Famous Patents
William F. Semple, a dentist, was awarded the first US Patent on chewing gum in 1869. His recipe contained powdered chalk.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8173456 | Method of manufacturing a light emitting diode element A method of manufacturing a light emitting diode element is provided. A first patterned semi-conductor layer, a patterned light emitting layer, and a second patterned semi-conductor layer are sequentially formed on an epitaxy substrate so as to form a plurality of e... | 05/08/2012 |
| 8153457 | Method for forming light emitting device The invention provides a method for forming a light emitting device. A first substrate is provided. A plurality of patterned masks is formed on the first substrate, or on a semiconductor epitaxial layer grown on the first substrate, or the first substrate is etched ... | 04/10/2012 |
| 8143079 | Silicon nanoparticle white light emitting device Multiple films of red-green-blue (RGB) luminescent silicon nanoparticles are integrated in a cascade configuration as a top coating in an ultraviolet/blue light emitting diode (LED) to convert it to a white LED. The configuration of RGB luminescent silicon nanoparti... | 03/27/2012 |
| 8129206 | Light emitting diode package and method of making the same The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regi... | 03/06/2012 |
| 8114691 | Semiconductor light emitting device having textured structure and method of manufacturing the same A semiconductor light emitting diode having a textured structure and a method of manufacturing the same are provided. The semiconductor light emitting diode includes a first semiconductor layer formed into a textured structure, an intermediate layer formed between t... | 02/14/2012 |
| 8105854 | LED package A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The CO... | 01/31/2012 |
| 8105853 | Surface-textured encapsulations for use with light emitting diodes Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to ... | 01/31/2012 |
| 8101441 | Method of manufacturing light-emitting device A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glas... | 01/24/2012 |
| 8093078 | Photoelectric device, method of fabricating the same and packaging apparatus for the same A method for fabricating a photoelectric device initially provides a ceramic substrate comprising a thermal dissipation layer on a bottom layer of the ceramic substrate, an electrode layer on the top surface of the ceramic substrate, and a reflective structure in ca... | 01/10/2012 |
| 8088636 | LED packaging using injection molding method A light emitting diode (LED) packaging method includes the steps of preparing a circuit board (1), a transparent cap (3), and at least one LED material (2), placing the transparent cap (3) on the LED material (2) such that the circ... | 01/03/2012 |
| 8067254 | Common optical element for an array of phosphor converted light emitting devices A device is provided with an array of a plurality of phosphor converted light emitting devices (LEDs) that produce broad spectrum light. The phosphor converted LEDs may produce light with different correlated color temperature (CCT) and are covered with an optical e... | 11/29/2011 |
| 8048695 | Method for fabricating a light source that includes phosphor-converted LED A light source and method for fabricating the same are disclosed. The light source includes a die, a light conversion component, and a scattering ring. The die emits light of a first wavelength through a top surface of the die and one or more side surfaces of the di... | 11/01/2011 |
| 8043874 | Method for coating semiconductor device using droplet deposition Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with eac... | 10/25/2011 |
| 8043875 | LED packaging method An LED packaging method provides a package that includes a substrate, a LED chip, a carbon naonotube thin film and an adhesive layer. The LED chip includes an anode and a cathode. The carbon naonotube thin film includes at least two electrically conductive areas spa... | 10/25/2011 |
| 8030103 | Liquid crystal display panel and method of manufacturing the same The present invention provides a liquid crystal display panel and a method of manufacturing the liquid crystal display panel capable of reducing or eliminating metal erosion in an area in which a conductive dot is formed. In some embodiments, a display panel compris... | 10/04/2011 |
| 8012778 | LED package and fabricating method thereof The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip... | 09/06/2011 |
| 8008100 | Light emitting diode package structure and manufacturing method therefor A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an e... | 08/30/2011 |
| 7989237 | Package structure for solid-state lighting devices and method of fabricating the same Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and ele... | 08/02/2011 |
| 7977127 | Optical transmission module and manufacturing method of the same To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely. An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplificati... | 07/12/2011 |
| 7960194 | Method for manufacturing a reflective surface sub-assembly for a light-emitting device A method for manufacturing a reflective surface sub-assembly for a light-emitting device, comprising a substrate, at least one area reserved for placement of a light-emitting device assembly on the substrate, and a diffusive reflective layer applied on selected regi... | 06/14/2011 |
| 7955878 | Semiconductor light emitting device and method of manufacturing the same A semiconductor light emitting device can include a casing having a concave-shaped cavity with an opening, a semiconductor light emitting element installed in a bottom portion of the cavity, and a resin layer for filling an interior of the cavity. The resin layer ca... | 06/07/2011 |
| 7951623 | Process for producing optical semiconductor device The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in... | 05/31/2011 |
| 7951624 | Method of manufacturing light emitting diode A method of manufacturing light emitting diode has steps of providing a package base, providing a light emitting structure and bonding the light emitting structure on the package base. The package base has a first metal layer and a second metal layer respectively fo... | 05/31/2011 |
| 7951625 | Semiconductor light emitting element and method for manufacturing semiconductor light emitting device In a semiconductor light emitting device, light is lost from a side surface of a substrate; therefore, if a substrate side surface occupies a large area, it decreases light extraction efficiency. The area of the substrate side surface may be reduced by reducing a th... | 05/31/2011 |
| 7906355 | Optical waveguide device production method, optical waveguide device produced by the method, and optical waveguide connection structure to be used for the device An optical waveguide device production method which ensures that a receptacle structure can be easily and highly accurately produced in a single step, an optical waveguide device produced by the method, and an optical waveguide connection structure to be used for th... | 03/15/2011 |
| 7897419 | Color correction for wafer level white LEDs A method for fabricating a plurality of LED chips comprises providing a plurality of LEDs and forming a plurality of spacers each of which is on at least one of the LEDs. Coating the LEDs with a conversion material, each of the spacers reducing the amount of convers... | 03/01/2011 |
| 7875471 | Method of manufacturing light emitting diode device A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in ... | 01/25/2011 |
| 7875473 | Method of manufacturing light emitting diode device A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in ... | 01/25/2011 |
| 7875472 | Method of manufacturing light emitting diode device A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in ... | 01/25/2011 |
| 7867794 | Surface-mount type optical semiconductor device and method for manufacturing the same A small and thin surface-mount type optical semiconductor device having high air tightness, which can be manufactured at a reduced cost includes: a base 2 formed of a glass substrate; a recess 5 formed on a first main surface 3 of the base; a th... | 01/11/2011 |
| 7858408 | LED with phosphor tile and overmolded phosphor in lens Overmolded lenses and certain fabrication techniques are described for LED structures. In one embodiment, thin YAG phosphor plates are formed and affixed over blue LEDs mounted on a submount wafer. A clear lens is then molded over each LED structure during a single ... | 12/28/2010 |
| 7833811 | Side-emitting LED package and method of manufacturing the same The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. Th... | 11/16/2010 |
| 7790485 | Semiconductor light emitting device and method of manufacturing the same A method of manufacturing a semiconductor light emitting device. The method includes: mounting a semiconductor light emitting element on a flat substrate; covering the semiconductor light emitting element on the flat substrate by a cover layer in a domed shape to fo... | 09/07/2010 |
| 7638345 | Method of manufacturing silicon nanowires and device comprising silicon nanowires formed by the same A method of manufacturing silicon nanowires is characterized in that silicon nanowires are formed and grown through a solid-liquid-solid process or a vapor-liquid-solid process using a porous glass template having nanopores doped with erbium or an erbium precursor. ... | 12/29/2009 |
| 7611915 | Methods of manufacturing light emitting diodes including barrier layers/sublayers Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a reflector layer,... | 11/03/2009 |
| 7601550 | Methods for producing a light emitting semiconductor body with a luminescence converter element The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one ... | 10/13/2009 |
| 7569406 | Method for coating semiconductor device using droplet deposition Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with eac... | 08/04/2009 |
| 7534636 | Lids for wafer-scale optoelectronic packages A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a ... | 05/19/2009 |
| 7527991 | Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same In a light emitting apparatus comprising a light emitting device, a fluorescent substance capable of absorbing at least a portion of light emitted by the light emitting device and emitting light having a different wavelength, and a color converting member which cont... | 05/05/2009 |
| 7452737 | Molded lens over LED die One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support st... | 11/18/2008 |
