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| Number | Title | Issue Date |
| 8178371 | Solid-state lasers A method for assembling an optically pumped solid-state laser having an extended cavity. The method includes the steps of providing a casing, mounting a TEC and a base plate in the casing, and mounting a plurality of laser components on the base plate using a UV and... | 05/15/2012 |
| 8173455 | Phosphor coating method for fabricating light emitting semiconductor device and applications thereof A phosphor coating method for fabricating a light-emitting semiconductor is provided. The phosphor coating method comprises the steps as follows: First a light emitting semiconductor wafer having a plurality of die units formed thereon is provided, and a photoresist... | 05/08/2012 |
| 8173453 | Laser patterning of encapsulated organic light emitting diodes Patterning an organic light emitting diode (OLED) after it has been encapsulated by permanently changing the light emissivity of the diodes. The OLED includes an intervening layer between a source of laser treatment and a light emitting layer. Depending on the compo... | 05/08/2012 |
| 8173454 | Light emitting diode package and method of manufacturing the same Disclosed is a light emitting diode package, including a metal body including a cavity for receiving a light emitting diode therein, a lens mount for mounting thereon a lens through which light is transmitted, a heat sink for dissipating heat, a lead insertion reces... | 05/08/2012 |
| 8163578 | Light emitting diodes with smooth surface for reflective electrode A light emitting diode comprising an epitaxial layer structure, a first electrode, and a second electrode. The first and second electrodes are separately disposed on the epitaxial layer structure, and the epitaxial layer structure has a root-means-square (RMS) rough... | 04/24/2012 |
| 8138000 | Methods for forming semiconductor light emitting devices and submounts A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device receive... | 03/20/2012 |
| 8129205 | Solid state lighting devices and associated methods of manufacturing Solid state lighting devices and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state light device includes a light emitting diode with an N-type gallium nitride (GaN) material, a P-type GaN material spaced apart from the N-type... | 03/06/2012 |
| 8119427 | Light emitting diode die-bonding with magnetic field In one aspect of the present invention, a method of LED die-bonding includes coating the back side of an LED chip with a magnetic material, placing the LED chip in a packaging cup such that the back side of the LED chip is in contact with the bottom of the packaging... | 02/21/2012 |
| 8110421 | Light emitting device and method for manufacturing same A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate; forming a dielectric film on a second surface side... | 02/07/2012 |
| 8097476 | Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a package carrier, a conducting material, at least one light emitting di... | 01/17/2012 |
| 8097477 | Method for forming a light-emitting case and related light-emitting module A method for manufacturing a light-emitting case includes forming a PLED (Polymer Light Emitting Diode) device, disposing the PLED device into a mold, and utilizing the mold to sheathe the PLED device with transparent plastic material in an injection-molding manner.... | 01/17/2012 |
| 8084283 | Top contact LED thermal management An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from... | 12/27/2011 |
| 8080435 | Organic electroluminescence element and manufacturing method thereof A main object of the present invention is to provide an organic EL element which can absolutely segment cathodes when forming an organic layer by a coating method, and a producing method thereof. The present invention attains the object by providing a producing meth... | 12/20/2011 |
| 8067253 | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat ... | 11/29/2011 |
| 8062914 | Method for fabricating flat panel display device Provided is a flat panel display device and a method for fabricating the same. The flat panel display device comprises a first substrate, a light emitting unit, a second substrate, and insulating films. The light emitting unit comprises thin film transistors positio... | 11/22/2011 |
| 8048694 | Package base structure and associated manufacturing method A package base structure of a light emitting device and associated manufacturing method is provided. The method includes steps of forming a first mask layer and a second mask layer on a first surface and a second surface of a substrate; defining a first opening and ... | 11/01/2011 |
| 8034645 | Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader A method of making a semiconductor chip assembly includes providing a post and a base that include a copper surface layer and an aluminum core, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer... | 10/11/2011 |
| 8026115 | Optical bonding composition for LED light source Disclosed herein is an optical bonding composition that may be used in optical applications. An LED light source that utilizes the composition is also disclosed, as well as a method of making it. The LED light source may comprise: an LED die; an optical element opti... | 09/27/2011 |
| 8017417 | Light emitting diode having a wavelength shift layer and method of manufacture Embodiments of the present invention provide an LED having a Wavelength Shift Layer (WSL) and method of manufacture. Specifically, under embodiment of the present invention, a WSL layer is applied over an LED chip. The WSL itself typically comprises two layers: an a... | 09/13/2011 |
| 8017416 | Method for the production of a plurality of opto-electronic semiconductor chips and opto-electronic semiconductor chip Presented is a method for the production of a plurality of optoelectronic semiconductor chips each having a plurality of structural elements with at least one semiconductor layer. The method involves providing a chip composite base that includes a substrate and a gr... | 09/13/2011 |
| 8012777 | Packaging process of light emitting diode A packaging process of a light emitting diode (LED) is provided. First, an LED chip is bonded with a carrier to electrically connect to each other. After that, the carrier is heated to raise the temperature thereof. Next, an encapsulant is formed on the heated carri... | 09/06/2011 |
| 8003416 | Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post wi... | 08/23/2011 |
| 7998765 | Method for forming an LED lens structure and related structure A method for manufacturing an LED lens structure includes the following steps of disposing a lead frame with the LED chip into a mold, and injecting thermoplastic transparent material to a plane of the lead frame which is different from a plane that LED chip is moun... | 08/16/2011 |
| 7998764 | Solid-state light emitting display and fabrication method thereof A solid-state light emitting display and a fabrication method thereof are proposed. The light emitting display includes a metallic board formed with conductive circuits, and a plurality of luminous microcrystals disposed on a surface of the metallic board and electr... | 08/16/2011 |
| 7993944 | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side... | 08/09/2011 |
| 7989236 | Method of making phosphor containing glass plate, method of making light emitting device A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the gl... | 08/02/2011 |
| 7985606 | Method of manufacturing light emitting device A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process step... | 07/26/2011 |
| 7964420 | LED chip package structure with an embedded ESD function and method for manufacturing the same An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between... | 06/21/2011 |
| 7960193 | Dual panel-type organic electroluminescent display device and method of fabricating the same A dual panel-type organic electroluminescent display device includes first and second substrates facing and spaced apart from each other, an array element layer disposed along an inner surface of the first substrate, the array element including a thin film transisto... | 06/14/2011 |
| 7951622 | Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the ... | 05/31/2011 |
| 7951621 | LED chip package structure with high-efficiency light-emitting effect and method of packaging the same An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively... | 05/31/2011 |
| 7951620 | Water-barrier encapsulation method The present invention generally relates to organic light emitting diode (OLED) structures and methods for their manufacture. To increase the lifetime of an OLED structure, an encapsulating layer may be deposited over the OLED structure. The encapsulating layer may f... | 05/31/2011 |
| 7932108 | Method of preparing a sealed light-emitting diode chip A method for producing a light emitting diode chip encapsulation product, the method comprising covering a light emitting diode chip connected onto a substrate with a thermosetting film, and thermally curing the thermosetting film. ... | 04/26/2011 |
| 7927896 | Method of production of semiconductor light emission device and method of production of light emission apparatus A method of production of semiconductor light emission devices for forming stripes of two multilayers having different emission wavelengths on a substrate, including the steps of: depositing a first multilayer including an active layer on the substrate; selectively ... | 04/19/2011 |
| 7923271 | Method of assembling multi-layer LED array engine A method of assembling a multi-layer LED array engine is provided. The method includes the steps of: preparing a base plate frame comprising at least one lighting area, and two lead frame grooves; positioning two lead frames inside accommodating spaces defined in th... | 04/12/2011 |
| 7915061 | Environmentally robust lighting devices and methods of manufacturing same An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chi... | 03/29/2011 |
| 7910387 | Phosphor coating method for fabricating light emitting semiconductor device and applications thereof A phosphor coating method for fabricating a light-emitting semiconductor is provided. The phosphor coating method comprises the steps as follows: First a light emitting semiconductor wafer having a plurality of die units formed thereon is provided, and a photoresist... | 03/22/2011 |
| 7906354 | Light emitting nanowire device Method of making a light emitting semiconductor nanowire device includes providing a plurality of spaced light emitting semiconductor nanowires on a growth substrate; applying a dielectric material disposed between the semiconductor nanowires producing a layer of em... | 03/15/2011 |
| 7892867 | Method for manufacturing flexible display panel A carrier applicable to a laser releasing process and for carrying at least a flexible display panel is provided. The flexible display panel is formed on a transparent substrate and includes a display main body and a driving circuit module connected to an edge of th... | 02/22/2011 |
| 7892868 | LED packaging method using a screen plate A LED packaging method includes a procedure of placing a screen plate having stepped holes on a substrate carrying LED chips, a procedure of reversing the screen plate with respect to the substrate, and a procedure of packaging the LED chips with a first packaging a... | 02/22/2011 |
