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| Number | Title | Issue Date |
| 8137999 | Package for a light emitting diode and method for fabricating the same A method for fabricating a LED includes: providing a metal substrate; etching the metal substrate to form a first terminal, a second terminal, and a gap between the first terminal and the second terminal, wherein the first terminal has at least one first etching con... | 03/20/2012 |
| 8114690 | Methods of low loss electrode structures for LEDs Aspects concerning a method of making electrical contact to a region of semiconductor in which one or more LEDs are formed include that a dielectric region can be formed on a p region of the semiconductor, and that a metallic electrode can be formed on (at least par... | 02/14/2012 |
| 8114689 | Method for manufacturing light emitting diode chip and light emitting diode light source module The present invention relates to a method for manufacturing a light emitting diode (LED) chip for a chip on board and a method for manufacturing an LED light source module in a chip on board fashion. The method of the present invention includes forming a plurality o... | 02/14/2012 |
| 8053259 | Manufacturing method of light emitting diode Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has ... | 11/08/2011 |
| 8012776 | Methods of manufacturing imaging device packages Methods of manufacturing an imaging device package are provided. In accordance with an embodiment a sensor die may be coupled to bond pads on a transparent substrate. Electrically conductive paths comprising bond wires are formed through the bond pads from the senso... | 09/06/2011 |
| 7998763 | Method for manufacturing semiconductor apparatus and mold assembly for the same A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semico... | 08/16/2011 |
| 7943403 | Light-emitting diode chip package body and packaging method thereof AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating dispo... | 05/17/2011 |
| 7888146 | Method for assembling array-type semiconductor laser device According to an aspect of the present invention, there is provided a method for assembling a semiconductor laser device, including: preparing a laser chip including: a substrate; stripe waveguides that are formed on the substrate and that each includes a gain produc... | 02/15/2011 |
| 7863062 | Semiconductor device with a shielding section to prevent condensation and optical device module having the semiconductor device In a solid-state imaging device 1 in which a hollow section 9 is formed between a solid-state imaging element 2 and a covering section 4 and an air path 7 extending from the hollow section 9 to the outside is formed in an ad... | 01/04/2011 |
| 7795051 | Accurate alignment of an LED assembly An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and ar... | 09/14/2010 |
| 7795052 | Chip coated light emitting diode package and manufacturing method thereof A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package ... | 09/14/2010 |
| 7781240 | Integrated circuit device An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mec... | 08/24/2010 |
| 7759144 | Package for a semiconductor light emitting device A semiconductor light emitting device package includes a substrate with a core and a copper layer overlying the core. The light emitting device is connected to the substrate directly or indirectly through a wiring substrate. The core of the substrate may be, for exa... | 07/20/2010 |
| 7759143 | System and method for separating and packaging integrated circuits A system for separating ICs, including a controller, a fixture and a support material supply. The fixture is coupled to a stretchable substrate and the stretchable substrate has a diced semiconductor wafer secured thereto. The diced semiconductor wafer including the... | 07/20/2010 |
| 7749781 | Method for manufacturing a light-emitting diode having high heat-dissipating efficiency A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip ... | 07/06/2010 |
| 7704761 | Manufacturing method of light emitting diode Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has ... | 04/27/2010 |
| 7691652 | Calorimetric flow meter An encapsulated calorimetric flow meter according to the present invention comprises an integrated circuit (104) mounted on a lead frame (102). The integrated circuit has a channel (105) provided in its lower face, the channel being aligned with... | 04/06/2010 |
| 7682850 | White LED for backlight with phosphor plates A white light LED for use in backlighting or otherwise illuminating an LCD is described where the white light LED comprises a blue LED over which is affixed a preformed red phosphor platelet and a preformed green phosphor platelet. In one embodiment, to form a plate... | 03/23/2010 |
| 7678591 | Semicoductor chip and method for production thereof For producing semiconductor chips by thin-film technology, an active layer (2) that has been grown on a substrate, with contact layers on the back side that have a base layer (3), is reinforced by a reinforcement layer (4). Next, an auxiliary ca... | 03/16/2010 |
| 7655486 | Method of making light emitting device with multilayer silicon-containing encapsulant A method of making an LED light emitting device is disclosed. The method includes forming a multilayer encapsulant in contact with an LED by contacting the LED with a first encapsulant that is a silicone gel, silicone gum, silicone fluid, organosiloxane, polysiloxan... | 02/02/2010 |
| 7651878 | Wafer-level chip-scale package of image sensor and method of manufacturing the same Provided are a WLCSP of an image sensor and a method of manufacturing the same. The WLCSP includes a wafer, support members, glass, and metal bumps. The wafer has an image sensor and a pair of pads disposed thereon, a portion of the bottom surface of the image senso... | 01/26/2010 |
| 7588951 | Method of packaging a semiconductor device and a prefabricated connector A method of packaging a first device having a first major surface and a second major surface includes forming a first layer over a second major surface of the first device and around sides of the first device and leaving the first major surface of the first device e... | 09/15/2009 |
| 7534635 | Getter precursors for hermetically sealed packaging Hermetically sealed packages include a getter precursor disposed within an interior region of the package. The getter precursor includes a cation portion and a non-oxidizing anion portion, which is configured to thermally decompose to change an oxidation state of ca... | 05/19/2009 |
| 7527990 | Solid state imaging device and producing method thereof A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensor... | 05/05/2009 |
| 7521271 | Method of manufacturing a transponder A method of manufacturing a transponder (1) where a transponder IC (2) comprising two IC contacts (7, 8) is brought into communication-capable connection, via each time one of the IC contacts (7, 8), with one of two transmission element s... | 04/21/2009 |
| 7507592 | Bonding pad structure for a display device and fabrication method thereof A bonding pad structure of a display device. A first conductive layer is formed overlying a substrate, a protection layer is formed overlying the substrate and the first conductive layer, and a second conductive layer is formed overlying the protection layer. An ope... | 03/24/2009 |
| 7504271 | Integrated circuit package substrate having a thin film capacitor structure This invention relates to the manufacture of a substrate, such as a package substrate or an interposer substrate, of an integrated circuit package. A base structure is formed from a green material having a plurality of via openings therein. The green material is the... | 03/17/2009 |
| 7485479 | Nitride-based light emitting device and method of manufacturing the same Provided are a nitride-based light emitting device and a method of manufacturing the same. The nitride-based light emitting device has a structure in which at least an n-cladding layer, an active layer, and a p-cladding layer are sequentially formed on a substrate. ... | 02/03/2009 |
| 7456035 | Flip chip light emitting diode devices having thinned or removed substrates In a method for fabricating a flip-chip light emitting diode device, epitaxial layers (14, 114) are deposited on a growth substrate (16, 116) to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial waf... | 11/25/2008 |
| 7442565 | Method for manufacturing vertical structure light emitting diode A method for manufacturing a vertical light emitting diode of the invention allows an easier process of individually separating chips. A light emitting structure is formed on a growth substrate having a plurality of device areas and at least one device isolation are... | 10/28/2008 |
| 7422929 | Wafer-level packaging of optoelectronic devices In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket... | 09/09/2008 |
| 7419839 | Bonding an optical element to a light emitting device A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperatur... | 09/02/2008 |
| 7416910 | Pyramid socket suspension An apparatus and method for flexibly suspending a sensing mechanism between a pair of cover plates, including a sensing mechanism formed in a crystalline silicon substrate; a pair of cover plates formed in crystalline silicon substrates; a first plurality of complem... | 08/26/2008 |
| 7405414 | Method and apparatus for patterning a workpiece The present invention relates to a method for creating a pattern on a workpiece sensitive to electromagnetic radiation. Electromagnetic radiation is emitted onto a computer controlled reticle having a multitude of modulating elements (pixels). The pixels are arrange... | 07/29/2008 |
| 7402446 | Method of manufacturing an electroluminescence device A semiconductor device is provided. The semiconductor device includes an element; a mounting board; and a single film made of a conductive material directly coupling the element with the mounting board. ... | 07/22/2008 |
| 7394109 | LED lighting device An LED lighting device comprises a seat with a conductor. A light emitting diode is disposed on the conductor of the seat, and has an upper positive conductive pad, a lower negative conductive pad, and an insulating pad disposed between the positive and negative con... | 07/01/2008 |
| 7391119 | Temperature sustaining flip chip assembly process A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during f... | 06/24/2008 |
| 7384805 | Transfer mold semiconductor packaging processes In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of open... | 06/10/2008 |
| 7371606 | Manufacturing method of a semiconductor device The yield of a sealing process for a semiconductor device which adopts a flip-chip mounting method is to be improved. In a molding process wherein plural semiconductor chip ICs mounted on a parts mounting surface of a substrate matrix through bump electrodes are to ... | 05/13/2008 |
| 7369334 | Optical device with alignment compensation An optical device is provided which includes a plurality of optical modules and an alignment compensation module. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to... | 05/06/2008 |
