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| Number | Title | Issue Date |
| 7977126 | Method of manufacturing organic light emitting device having photo diode A method for manufacturing an organic light emitting device including a photo diode and a transistor includes forming a first semiconductor layer and a second semiconductor layer on separate portions of a buffer layer formed on the substrate; forming a gate metal la... | 07/12/2011 |
| 7883911 | Method for fabricating photodiodes A Schottky photodiode includes a semiconductor layer and a conductive film provided in contact with the semiconductor layer. The conductive film has an aperture and a periodic structure provided around said aperture for producing a resonant state by an excited surfa... | 02/08/2011 |
| 7883912 | Display device and method for manufacturing the same According to one aspect of the present invention, at least one or more of patterns required for manufacturing a display device, such as a conductive layer which forms a wiring or an electrode and a mask, is formed by a droplet discharging method. At that time, a por... | 02/08/2011 |
| 7846753 | Vertical light emitting diode and method of making a vertical light emitting diode A vertical gallium-nitrate-based LED and method of making a vertical gallium-nitrate-based LED using a stop layer is provided. Embodiments of the present invention use mechanical thinning and a plurality of superhard stop points to remove epitaxial layers with a hig... | 12/07/2010 |
| 7772017 | Method of producing a solid state imaging device including using a metal oxide etching stopper In the solid-state imaging device of the present invention having a photoelectric conversion section and a charge transfer section equipped with a charge transfer electrode for transferring an electric charge generated in the photoelectric conversion section, the ch... | 08/10/2010 |
| 7754506 | Method of fabricating submicron suspended objects and application to the mechanical characterization of said objects A method of fabricating submicron objects that includes the following steps: depositing a void layer on a support, depositing a transfer layer on the void layer, producing the objects in the transfer layer, producing a hard mask on a portion of the transfer layer to... | 07/13/2010 |
| 7732232 | Series interconnected optoelectronic device module assembly Series interconnection of optoelectronic device modules is disclosed. Each device module includes an active layer disposed between a bottom electrode and a transparent conducting layer. An insulating layer is disposed between the bottom electrode of a first device m... | 06/08/2010 |
| 7727786 | Photon-based memory device An optical memory cell having a material layer associated with a pixel capable of emitting and receiving light. The material layer has phosphorescent material formed therein for storing data as light received from and emitted to the pixel. ... | 06/01/2010 |
| 7727785 | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive A method for balancing layer-caused compressive or tensile stress in a semiconductor die, die wafer or similar substrate uses a stress-balancing layer (SBL) attached to an opposite side from a stress-causing layer before the semiconductor die or wafer is significant... | 06/01/2010 |
| 7713767 | Method of making circuitized substrate with internal optical pathway using photolithography A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The m... | 05/11/2010 |
| 7651877 | Two-dimensional image detecting apparatus and method for manufacturing the same The present invention provides a two-dimensional image detecting apparatus including a mold structure which apparatus can be applied to mammography, and a manufacturing method thereof. The manufacturing method includes: a conversion layer formation step of forming a... | 01/26/2010 |
| 7632692 | Liquid crystal display, thin film transistor array panel therefor, and manufacturing method thereof A thin film transistor array panel is provided, which includes: a gate line formed on an insulating substrate; a gate insulating layer on the gate line; a semiconductor layer on the gate insulating layer; a data line formed on the gate insulating layer; a drain elec... | 12/15/2009 |
| 7531371 | Multisurfaced microdevice system array and a method of producing the array A multisurfaced microdevice system array is produced from a wafer formed of semiconductor substrate material. Sensing, controlling and actuating microdevices are fabricated at specific location on both sides of the wafer, and the wafer is diced. Each die thus create... | 05/12/2009 |
| 7524687 | Method for producing a radiation-emitting-and-receiving semiconductor chip A method for producing an integrated semiconductor component comprising a first semiconductor layer construction for emitting radiation and a second semiconductor layer construction for receiving radiation, wherein a substrate is first provided and a first semicondu... | 04/28/2009 |
| 7429750 | Solid-state element and solid-state element device A solid-state element has: a semiconductor layer formed on a substrate, the semiconductor layer having a first layer that corresponds to an emission area of the solid-state element to and a second layer through which current is supplied to the first layer; a light d... | 09/30/2008 |
| 7427753 | Method of cross-section milling with focused ion beam (FIB) device A method of milling a cross section of a wafer and a milling device. The method includes a coarse scanning of at least two milling frames and a fine scanning of at least one milling frame. The milling device is adapted to cross-section milling of a wafer, said milli... | 09/23/2008 |
| 7422919 | Avalanche photodiode An avalanche photodiode includes at least one crystal layer having a larger band-gap than that of an absorption layer formed by a composition or material different from that of the absorption layer formed on a junction interface between a compound semiconductor abso... | 09/09/2008 |
| 7419839 | Bonding an optical element to a light emitting device A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperatur... | 09/02/2008 |
| 7420728 | Methods of fabricating interferometric modulators by selectively removing a material Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket d... | 09/02/2008 |
| 7399651 | LED package structure and mass production method of making the same An LED package structure includes a lower substrate, an upper substrate disposed on the lower substrate and having a though hole exposing a portion of the upper surface of the lower substrate; an individual LED unit disposed within the through hole in the upper subs... | 07/15/2008 |
| 7393707 | Method for manufacturing an electro-optical device An object of the present invention is to provide an EL display device having high operation performance and reliability. A third passivation film 45 is disposed under the EL element 203 comprising a pixel electrode (anode) 46, an EL layer... | 07/01/2008 |
| 7387904 | Light emitting element and manufacturing method thereof, and light emitting device using the light emitting element A light-emitting element has a layer including an organic material between a first electrode and a second electrode, and further has a layer including a metal oxide between the second electrode and the layer including the organic material, where these electrodes and... | 06/17/2008 |
| 7374958 | Light emitting semiconductor bonding structure and method of manufacturing the same A light emitting semiconductor bonding structure includes a structure formed by bonding a substrate onto a light emitting semiconductor. The substrate is a structure containing electric circuits. The ohmic contact N electrode layer and P electrode layer are formed o... | 05/20/2008 |
| 7371601 | Piezoresistive sensing structure A technique for manufacturing a piezoresistive sensing structure includes a number of process steps. Initially, a piezoresistive element is implanted into a first side of an assembly that includes a semiconductor material. A passivation layer is then formed on the f... | 05/13/2008 |
| 7358122 | High performance FET devices and methods thereof Structure and methods of fabrication are disclosed for an enhanced FET devices in which dopant impurities are prevented from diffusing through the gate insulator. The structure comprises a Si:C, or SiGe:C, layer which is sandwiched between the gate insulator and a l... | 04/15/2008 |
| 7351598 | Solid-stage image pickup device and method for producing the same A solid-state image pickup device includes an element isolation insulating film electrically isolating pixels on the surface of a well region; a first isolation diffusion layer electrically isolating the pixels under the element isolation insulating film; and a seco... | 04/01/2008 |
| 7349592 | Optoelectronic circuit board with optical waveguide and optical backplane An optical transmission device comprises an optical transmission medium and a plurality of optical receivers, and the optical transmission medium has a linear line waveguide. At least one of the optical receivers is adapted to receive a first optical signal propagat... | 03/25/2008 |
| 7341879 | Method of manufacturing a point source light-emitting diode A point source light emitting-diode (LED) comprises a substrate, an epitaxy structure, a first electrode, an isolation layer, a bonding layer, a contact layer, and a connection bridge. The epitaxy structure is located on the substrate, and the substrate has a patter... | 03/11/2008 |
| 7329932 | Microelectromechanical (MEM) viscosity sensor and method A MEM viscosity sensor comprises a substrate, with first and second support structures affixed to the substrate and spaced-apart. A compliant member is affixed to the support structures such that it is suspended above and can flex vertically with respect to the subs... | 02/12/2008 |
| 7326582 | Optical isolator device, and method of making same The present invention is generally directed to an optical isolator device, and various methods of making same. In one illustrative embodiment, the method comprises obtaining a single SOI substrate, the SOI substrate having an active layer comprised of silicon and a ... | 02/05/2008 |
| 7315261 | Method for converting data from pixel format to bitplane format This invention efficiently converts normal pixel data into bit plane data. A sequence of pack, bitwise shuffle, masking, rotate and merging operations transform tile from pixel form to bit plane form. This enables downstream algorithms to read only the data for the ... | 01/01/2008 |
| 7314772 | Photonic device Embodiments of methods, apparatuses, devices, or systems for forming a photonic device are described. ... | 01/01/2008 |
| 7300810 | Solid-state imaging device and method of manufacturing the same A solid-state imaging device is provided in which noise to an image signal is restrained and miniaturization is facilitated in a peripheral circuit formation region. A solid-state imaging device includes a pixel formation region 4 and a peripheral circ... | 11/27/2007 |
| 7297564 | Fabrication of vertical sidewalls on (110) silicon substrates for use in Si/SiGe photodetectors A method of fabricating vertical sidewalls on silicon (110) substrates for use in Si/SiGe photodetectors includes preparing a silicon (110) layer wherein the silicon (110) plane is parallel to an underlying silicon wafer surface. Masking the silicon (110) layer with... | 11/20/2007 |
| 7295783 | Digital optical network architecture A digital optical network (DON) is a new approach to low-cost, more compact optical transmitter modules and optical receiver modules for deployment in optical transport networks (OTNs). One important aspect of a digital optical network is the incorporation in these ... | 11/13/2007 |
| 7288426 | Automatically adjusting serial connections of thick and thin layers and method for the production thereof The invention relates to a method for the production of automatically adjusting serial connections of thick and/or thin layers. The method comprises the following process steps: applying electrically conductive strip conductors (20) to a substrate (10)... | 10/30/2007 |
| 7289547 | Laser and detector device A detector is disposed on the passive side of a laser to detect photon leakage through the passive side mirror and measure as current created in the detector via a Schottky contact. ... | 10/30/2007 |
| 7285433 | Integrated devices with optical and electrical isolation and method for making The invention is directed to a method for optical and electrical isolation between adjacent integrated devices. The method comprises the steps of forming at least one trench through an exposed surface of a semiconductor wafer by removing a portion of the semiconduct... | 10/23/2007 |
| 7285431 | Method for manufacturing a GaN based LED of a black hole structure This invention relates to a method for manufacturing a GaN based LED of a back hole structure, and the method comprises: epitaxially growing an N type GaN layer, a multi-quantum wells emitting active region and a P type GaN layer in turn on an insulation substrate m... | 10/23/2007 |
| 7282855 | Flat panel display having light blocking layer A light-emitting display device the same includes an insulating substrate having a thin film transistor formed thereon. The thin film transistor includes a source electrode and/or a drain electrode. A passivation layer is formed on the insulating substrate over at l... | 10/16/2007 |
