Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 8084282 | Wafer-level In-P Si bonding for silicon photonic apparatus Wafer-level bonding of the hybrid laser portion of a silicon photonics platform is done by forming a weakened level in a semiconductive pillar that supports laser-active layers by ion implantation into the semiconductive pillar without penetrating the laser-active l... | 12/27/2011 |
| 7871834 | Combined semiconductor apparatus with thin semiconductor films A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device such as a light-emitting device in the first thin semiconductor film to an integrated circuit i... | 01/18/2011 |
| 7842524 | Organic electro luminescence device and fabrication method thereof An organic electro luminescence device and a fabrication method thereof are provided. An array element is formed on a first substrate and an electro luminescent diode is formed on a second substrate. The array element and the electro luminescent diode are electrical... | 11/30/2010 |
| 7579200 | Semiconductor light emitting apparatus and method of fabricating the same A semiconductor light emitting apparatus is proposed, which has thyristor without increasing number of constituent semiconductor layers, with large degree of freedom of selection of ON voltage. It comprises first-conductivity-type first cladding layer, active layer,... | 08/25/2009 |
| 7537946 | Display apparatus A method for manufacturing an image display apparatus includes (i) preparing a display unit, wherein the display unit has a plurality of pixel circuits, each of the plurality of pixel circuits being provided with a drive transistor having a first main electrode conn... | 05/26/2009 |
| 7527989 | Method for fabricating liquid crystal display panel A method for fabricating a liquid crystal display panel is provided. A thin film transistor array substrate and a color filter array substrate are formed. The thin film transistor array substrate includes a screen region having gate lines, data lines, thin film tran... | 05/05/2009 |
| 7476558 | Method for manufacturing selective area grown stacked-layer electro-absorption modulated laser structure This invention relates to a method for manufacturing selective area grown stacked-layer electro-absorption modulated laser structure, comprising: step 1: forming a selective growth pattern of a modulator section on a substrate; step 2: simultaneously growing a 2-sta... | 01/13/2009 |
| 7439085 | Method and apparatus for electroluminescence Methods and apparatuses for causing electroluminescence with charge trapping structures are disclosed. Various embodiments relate to methods and apparatuses for causing electroluminescence with charge carriers of one type provided to the charge trapping structure by... | 10/21/2008 |
| 7422918 | Method of making a support for light emitting diodes which are interconnected in a three-dimensional environment The present invention relates to a method of making supports for light emitting diodes, wherein rigid substrates are used as supports for light emitting diodes, it being proposed, in particular, to render the substrates more fragile in order to make certain zones of... | 09/09/2008 |
| 7416906 | Soldering method for semiconductor optical device, and semiconductor optical device A method for soldering a semiconductor optical device including a resin-made optical lens to an object by a reflow soldering process using a lead-free solder, and a semiconductor optical device for use in the method. A semiconductor optical device including a silico... | 08/26/2008 |
| 7413916 | Light-emitting device and manufacturing method thereof A light emitting element having a superior light emitting characteristic is provided by forming a region partly including a phosphor (light emitting region) in manufacturing of a light emitting element having an organic compound layer using a high molecular weight m... | 08/19/2008 |
| 7399657 | Ball grid array packages with thermally conductive containers Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or at... | 07/15/2008 |
| 7371592 | Manufacturing method of thin film transistor array panel using an optical mask A method for manufacturing a thin film transistor array panel using a photo mask is provided. The photo mask includes: a transmitting area and a translucent area, wherein the translucent area includes a plurality of light blocking portions blocking light, and wherei... | 05/13/2008 |
| 7361966 | Actuator chip for inkjet printhead with electrostatic discharge protection An inkjet printhead chip includes electrostatic discharge (ESD) circuits to protect the chip during ESD events, including one preventing a thin dielectric layer on a substrate from breakdown. In one embodiment, the chip includes an ESD circuit essentially dedicated ... | 04/22/2008 |
| 7358615 | Microelectronic package having multiple conductive paths through an opening in a support substrate Microelectronic packages are disclosed. A microelectronic package may include a substrate having first and second sides. Passive components may be located on the first side of the substrate. Interconnects may also be located on the first side of the substrate, and m... | 04/15/2008 |
| 7358538 | Organic light-emitting devices with multiple hole injection layers containing fullerene The present invention provides layered hole injection structures including one or more layers of fullerenes for application in an organic electroluminescent device. The layered structures include a bi-layered structure including an electrically conductive layer serv... | 04/15/2008 |
| 7351623 | Liquid crystal display device and fabricating method thereof A thin film transistor substrate of a LCD device and a fabricating method thereof are disclosed for simplifying a fabricating process and enlarging a capacitance value of a storage capacitor without any reduction of aperture ratio. The LCD device includes: a double-... | 04/01/2008 |
| 7342707 | Indicators and illuminators using a semiconductor radiation emitter package A vehicle lamp assembly includes a housing and an LED lamp carried in the housing. A signal mirror includes a mirror and an LED lamp. The LED lamp includes a heat extraction member. ... | 03/11/2008 |
| 7335968 | High permeability composite films to reduce noise in high speed interconnects A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed ... | 02/26/2008 |
| 7329943 | Microelectronic devices and methods for forming interconnects in microelectronic devices Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backs... | 02/12/2008 |
| 7330319 | High brightness LED package with multiple optical elements A light source includes an LED die with an emitting surface and a plurality of optical elements having input surfaces in optical contact with distinct portions of the emitting surface. The optical elements can comprise tapers or concentrators that have reflective si... | 02/12/2008 |
| 7327016 | High permeability composite films to reduce noise in high speed interconnects An electronic system is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating ma... | 02/05/2008 |
| 7314772 | Photonic device Embodiments of methods, apparatuses, devices, or systems for forming a photonic device are described. ... | 01/01/2008 |
| 7304496 | Mask-programmable logic device with programmable input/output ports A mask-programmable logic device includes a macrocell having an external input/output port for “place-and-route” programming by addition of metallization layers. A programmable “fixed” layer allows the external input/output port to be isolated from the remai... | 12/04/2007 |
| 7294517 | Light emitting device and method of fabricating the same It is characteristic of an organic material suited to an interlayer insulating film to transmit vapor therethrough and to be liable to absorb moisture, and the material has a disadvantage that it is extremely susceptible to oxygen and moisture to be readily deterior... | 11/13/2007 |
| 7291285 | Method and system for line-dimension control of an etch process A method and system for controlling a dimension of an etched feature. The method includes: measuring a mask feature formed on a top surface of a layer on a substrate to obtain a mask feature dimension value; and calculating a mask trim plasma etch time based on the ... | 11/06/2007 |
| 7285431 | Method for manufacturing a GaN based LED of a black hole structure This invention relates to a method for manufacturing a GaN based LED of a back hole structure, and the method comprises: epitaxially growing an N type GaN layer, a multi-quantum wells emitting active region and a P type GaN layer in turn on an insulation substrate m... | 10/23/2007 |
| 7268014 | Fabrication method of light emitting diode package The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and ... | 09/11/2007 |
| 7265052 | Methods of forming conductive through-wafer vias The present invention is generally directed to various methods of forming conductive through-wafer vias. In one illustrative embodiment, the method comprises providing a layer of semiconducting material, forming a layer of metal on a first side of the layer of semic... | 09/04/2007 |
| 7259031 | Integrated photonic-electronic circuits and systems Photonic interconnect reconfigurably couples integrated circuits such as microprocessor, memory or other logic components. Detector, modulator, broad-band coupler and waveguide elements provide transmit and receive capability on CMOS substrate. Computer-implemented ... | 08/21/2007 |
| 7248131 | Monolithic vertical integration of an acoustic resonator and electronic circuitry Monolithic devices that include an acoustic resonator vertically integrated with electronic circuitry are described. In one aspect, a monolithic integrated device includes a substrate, electronic circuitry supported by the substrate, an acoustic isolator over the el... | 07/24/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7236164 | Display device In a display device in accordance with the present invention, each pixel includes a plurality of luminescent elements having different luminous intensities to represent gray scales by controlling the turning ON/OFF of the luminescent elements. A digital signal is tr... | 06/26/2007 |
| 7232754 | Microelectronic devices and methods for forming interconnects in microelectronic devices Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backs... | 06/19/2007 |
| 7221495 | Thin film precursor stack for MEMS manufacturing This invention provides a precursor film stack for use in the production of MEMS devices. The precursor film stack comprises a carrier substrate, a first layer formed on the carrier substrate, a second layer of an insulator material formed on the first layer, and a ... | 05/22/2007 |
| 7195939 | Structure and method for electrical isolation of optoelectronic integrated circuits Semiconductor devices in an optoelectronic integrated circuit are electrically isolated from each other by using planar lateral oxidation to oxidize a buried semiconductor layer vertically separating the semiconductor devices. ... | 03/27/2007 |
| 7183587 | Solid metal block mounting substrates for semiconductor light emitting devices A mounting substrate for a semiconductor light emitting device includes a solid metal block having a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. An insulating coating is provided in the cavity, and first an... | 02/27/2007 |
| 7172969 | Method and system for etching a film stack A method and system is described for preparing a film stack, and forming a feature in the film stack using a plurality of dry etching processes. The feature formed in the film stack can include a gate structure having a critical dimension of approximately 25 nm or l... | 02/06/2007 |
| 7164520 | Packaging for an interferometric modulator A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modul... | 01/16/2007 |
| 7151061 | Method of selective post-growth tuning of an optical bandgap of a semi-conductor heterostructure and products produced thereof A method of controlling the degree of IFVEI for post-growth tuning of an optical bandgap of a semiconductor heterostructure. The resultant layer structure may contain a semi-conductor heterostructure with one or more regions with selectively modified bandgap. Accord... | 12/19/2006 |
