Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
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| Number | Title | Issue Date |
| 8187898 | Method for manufacturing liquid discharge head A method for manufacturing a liquid discharge head provided with a substrate which has a layer made of silicon nitride and with a discharge port forming member which is disposed above the layer made of silicon nitride and has a discharge port for discharging liquid.... | 05/29/2012 |
| 8148177 | Light emitting device and display A light emitting device containing a semiconductor light emitting component and a phosphor, the phosphor is capable of absorbing a part of light emitted by the light emitting component and emitting light of a wavelength different from that of the absorbed light, is ... | 04/03/2012 |
| 8129204 | Liquid discharge head substrate, liquid discharge head using the substrate, and manufacturing method therefor Provided is a liquid discharge head substrate including: a substrate; a heating resistor layer formed on the substrate; a flow path for a liquid; a wiring layer stacked on the heating resistor layer and having an end portion which forms a step portion on the heating... | 03/06/2012 |
| 8101438 | Method of fabricating printhead integrated circuit with backside electrical connections A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-s... | 01/24/2012 |
| 8048691 | Wiring forming method Size reduction and high integration of each of the laminated substrates are achieved, while forming an excellent wiring which electrically connects the substrates to each other. A conductive ink, i.e., an ink, containing a conductive material is used, and in a state... | 11/01/2011 |
| 8026114 | Emitter, manufacturing method and manufacturing apparatus thereof, electro-optical apparatus and electronic apparatus An emitter has a plurality of types of light-emitting units with different changes in emission characteristics over time. In addition, the emitter includes a deterioration adjustment device which adjusts the deterioration of the emission characteristics over time in... | 09/27/2011 |
| 8012773 | Method for manufacturing liquid discharge head A method for manufacturing a liquid discharge head includes providing a first layer containing a metal nitride to at least a portion on one surface of a silicon substrate corresponding to a supply port; providing a second layer on the first layer, the second layer i... | 09/06/2011 |
| 7972875 | Optical systems fabricated by printing-based assembly Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems an... | 07/05/2011 |
| 7901959 | Liquid crystal display and back light having a light emitting diode A light emitting device containing a semiconductor light emitting component and a phosphor, the phosphor is capable of absorbing a part of light emitted by the light emitting component and emitting light of a wavelength different from that of the absorbed light, is ... | 03/08/2011 |
| 7863061 | Surface emitting laser manufacturing method, surface emitting laser array manufacturing method, surface emitting laser, surface emitting laser array, and optical apparatus including surface emitting laser array Provided is a surface emitting laser manufacturing method, etc., which reduces process damage occurring to a surface relief structure, enabling stable provision of a single transverse mode characteristic. Provided is a method including a surface relief structure for... | 01/04/2011 |
| 7759139 | Method for manufacturing silicon device A method for manufacturing a silicon device includes steps of: forming a silicon layer 4a that indicates a second conductivity type on a first surface S1a of a silicon substrate 2a that indicates a first conductivity type; a... | 07/20/2010 |
| 7732228 | Method for manufacturing printing head A process for manufacturing a printing head is able to maintain an appropriate connection between a substrate and flying leads. The process includes a connecting step of connecting electric connection terminals of a substrate and flying leads provided on an electric... | 06/08/2010 |
| 7718449 | Wafer level package for very small footprint and low profile white LED devices A surface mount LED package having a tight footprint and small vertical image size is fabricated by a method comprising: forming light emitting diode chips each having a substrate and a plurality of layers configured to emit electroluminescence responsive to electri... | 05/18/2010 |
| 7687287 | Method for fabricating a polymer L.E.D. A light-emissive device is prepared by depositing a polymer layer on a substrate. The deposition process utilizes a formulation comprising a conjugated polymer dissolved in a solvent, the solvent including a trialkyl-substituted aromatic hydrocarbon wherein at least... | 03/30/2010 |
| 7682848 | Light emitting device with blue light LED and phosphor components A light emitting device containing a semiconductor light emitting component and a phosphor, the phosphor is capable of absorbing a part of light emitted by the light emitting component and emitting light of a wavelength different from that of the absorbed light, is ... | 03/23/2010 |
| 7659128 | Method of processing silicon wafer and method of manufacturing liquid ejecting head A break pattern is formed on a silicon wafer using an anisotropic etching process. The break pattern includes a plurality of through holes, each of having a first plane perpendicular to a plane defined by the silicon wafer, a second plane opposite to the first plane... | 02/09/2010 |
| 7605009 | Method of fabrication MEMS integrated circuits A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said ... | 10/20/2009 |
| 7582495 | Inkjet head, method for producing inkjet head, inkjet recorder and inkjet coater A method for producing an inkjet head for jetting an ink from a nozzle that is formed on a nozzle main body formed of a metal material, the method includes smoothening a surface of the nozzle main body, applying a silica sol solution to the nozzle main body so as to... | 09/01/2009 |
| 7575941 | Method of manufacturing photodiode A method of manufacturing of a photodiode is provided. The photodiode is formed on a substrate of a first conductive type. First, an isolation structure is formed in the substrate to define a photosensitive area in the substrate. Thereafter, trenches are formed in t... | 08/18/2009 |
| 7572651 | Inkjet-fabricated integrated circuits A method for forming an integrated circuit including at least two interconnected electronic switching devices, the method comprising forming at least part of the electronic switching devices by ink-jet printing. ... | 08/11/2009 |
| 7569404 | Ink-jet printhead fabrication A silicon wafer substrate is used in ink-jet printhead fabrication. The fabrication process is improved by simultaneously forming MOSFET source/drain contact vias simultaneously with substrate contact vias. A dry etch having a silicon oxide:silicon etch rate of at l... | 08/04/2009 |
| 7521267 | Thermal inkjet printhead processing with silicon etching A method of etching the trench portions of a thermal inkjet printhead using a robust mask that precisely defines the area of the substrate surface to be etched and that protects the adjacent drop generator components from damaging exposure to the silicon etchant. Th... | 04/21/2009 |
| 7498182 | Method of manufacturing an ultraviolet light emitting AlGaN composition and ultraviolet light emitting device containing same An AlGaN composition is provided comprising a group III-Nitride active region layer, for use in an active region of a UV light emitting device, wherein light-generation occurs through radiative recombination of carriers in nanometer scale size, compositionally inhom... | 03/03/2009 |
| 7498183 | Fabrication of conductive micro traces using a deform and selective removal process In a method of forming micro traces, stamping techniques are employed to define a target pattern of the micro traces. The stamping is applied to electrically conductive material and may be limited to pressure, but a thermal stamping approach may be utilized. Followi... | 03/03/2009 |
| 7488611 | Devices and methods for integrated circuit manufacturing Integrated circuits and methods for producing them are provided. In particular, integrated circuits with shielding elements are provided. ... | 02/10/2009 |
| 7468284 | Method of bonding substrates A method of bonding a first substrate to a second substrate is provided. The method comprises the steps of: (a) providing a first substrate having a plurality of etched trenches defined in a first bonding surface; (b) providing a second substrate having a second bon... | 12/23/2008 |
| 7462500 | Manufacturing method of ink jet recording head and ink jet recording head manufactured by manufacturing method A manufacturing method of an ink jet recording head including a discharge port for discharging ink includes the step of forming the discharge port by performing dry etching of a discharge port forming member for forming the discharge port, wherein the discharge port... | 12/09/2008 |
| 7442317 | Method of forming a nozzle rim A method of forming a nozzle rim for a nozzle aperture is provided. The method is suitable for forming part of a printhead fabrication process. The method comprises the steps of: (a) depositing a roof material layer over a sacrificial layer; and (b) removing a first... | 10/28/2008 |
| 7442318 | Method of making thermal print head A method of manufacturing a thermal print head includes a conductor layer formation step, a first measurement step, a conductor layer splitting step and a second measurement step. In the conductor layer formation step, a single conductor layer including first and se... | 10/28/2008 |
| 7413915 | Micro-fluid ejection head containing reentrant fluid feed slots Methods of micro-machining a semiconductor substrate to form through fluid feed slots therein. One method includes providing a semiconductor substrate wafer having a thickness greater than about 500 microns and having a device side and a back side opposite the devic... | 08/19/2008 |
| 7413671 | Method of fabricating a printhead integrated circuit with a nozzle chamber in a wafer substrate A method of fabricating a printhead integrated circuit includes the step of forming a first layer of a polymeric material on a substrate that incorporates drive circuitry. A heater element is formed on the first layer of polymeric material to be connected to the dri... | 08/19/2008 |
| 7408233 | Semiconductor device having N-channel thin film transistor with LDD regions and P-channel thin film transistor with LDD region A MIS type semiconductor device and a method for fabricating the same characterized in that impurity regions are selectively formed on a semiconductor substrate or semiconductor thin film and are activated by radiating laser beams or a strong light equivalent theret... | 08/05/2008 |
| 7402256 | Method for producing liquid-jet head A method for producing a liquid-jet head comprises the steps of: forming a vibration plate and piezoelectric elements on one surface of a passage-forming substrate, and removing the vibration plate in a region to be a communicating portion, thereby forming an expose... | 07/22/2008 |
| 7398597 | Method of fabricating monolithic microelectromechanical fluid ejection device A method for forming a printhead having a very high dot-per-inch printing capability is described. The method includes forming a layer containing electronic control circuits upon a semiconductor wafer. Nozzle chambers are then etched into the wafer and corresponding... | 07/15/2008 |
| 7393081 | Droplet jetting device and method of manufacturing pattern The present invention provides a method of manufacturing a pattern with a flattened surface and a droplet jetting device which can provides the pattern with a flattened surface. A droplet jetting means of the present invention comprises a droplet jetting means havin... | 07/01/2008 |
| 7390421 | Method for forming inkjet nozzles having a coiled thermal actuator mechanism A nozzle of an ink jet printer is formed by initially providing a silicon wafer having a circuitry wafer layer including electrical circuitry necessary for the operation of the thermal actuators on demand. The actuator is formed by forming a first inert material lay... | 06/24/2008 |
| 7387926 | Method for manufacturing CMOS image sensor A method for manufacturing a CMOS image sensor is provided. The method includes forming a gate electrode on a semiconductor layer having defined regions of a photodiode region and a logic region, such that a gate oxide film is interposed between the semiconductor la... | 06/17/2008 |
| 7387903 | Method for manufacturing layer pattern, method for manufacturing wiring, and method for manufacturing electronic equipment Aspects of the invention provide a manufacturing method enabling a fine layer pattern to form it precisely and stably. An exemplary method for manufacturing a layer pattern can include a step (a) of forming a region defined by a first layer and a second layer on a s... | 06/17/2008 |
| 7381341 | Method of manufacturing liquid jet head Disclosed is a method of manufacturing a liquid jet head, which enables a passage-forming substrate to be easily handled, thus realizing good formation of pressure generating chambers and an improvement in manufacturing efficiency. The method includes the steps of: ... | 06/03/2008 |
| 7381342 | Method for manufacturing an inkjet nozzle that incorporates heater actuator arms A method is provided for manufacturing an inkjet nozzle. The method includes the step of depositing a plastics material layer on a substrate incorporating heater actuator circuitry. The plastics material layer is etched to form a nozzle rim defining an ink port thro... | 06/03/2008 |
