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...During the Civil War, the Confederacy established its own Patent Office which issued 266 patents, a third of which concerned implements of war.
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| Number | Title | Issue Date |
| 8110415 | Silicon based microchannel cooling and electrical package A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon carrier including: a plurality of through silicon vias for providing... | 02/07/2012 |
| 8101434 | Method for LED-module assembly A method for LED-module assembly comprising the steps of providing a base portion with a base inner surface and a cover with a cover inner surface which together define a module interior, the cover having at least one opening therethrough; putting a sealing member i... | 01/24/2012 |
| 8101433 | Semiconductor device and manufacturing method of the same Provided is a semiconductor device having a pad on a semiconductor chip, a first passivation film formed over the semiconductor chip and having an opening portion on the pad of a probe region and a coupling region, a second passivation film formed over the pad and t... | 01/24/2012 |
| 8101435 | Fabrication method for semiconductor device A semiconductor device fabrication method can improve yield of semiconductor devices and decrease (or prevent) waste of non-defective semiconductor chips. This fabrication method has a step of performing characteristic inspection after packaging a semiconductor chip... | 01/24/2012 |
| 8067251 | Semiconductor device and a method of manufacturing the same A method including forming an intermediate product, the intermediate product being configured to include a wiring substrate including a plurality of first electrodes, a plurality of second electrodes and a plurality of test electrodes, a first semiconductor chip mou... | 11/29/2011 |
| 8048690 | Pressure-sensitive adhesive sheet and process for producing semiconductor device having same A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically con... | 11/01/2011 |
| 8039275 | Integrated circuit packaging system with rounded interconnect and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming a rounded interconnect on a package carrier having an integrated circuit attached thereto; placing a mold chase having a protrusion over the rounded interconnect; forming an encapsul... | 10/18/2011 |
| 8039274 | Multi-chip package semiconductor device and method of detecting a failure thereof A semiconductor chip may include at least one power supply pad for receiving an external power voltage, at least one input/output pad, an internal function block that may be configured to operate based on a power voltage to at least one of receive and transmit a sig... | 10/18/2011 |
| 8030098 | Pre-formed conductive bumps on bonding pads Apparatuses including pre-forming conductive bumps on bonding pads for probing and wire-bonding connections and methods for making the same are disclosed. A method may include providing a microelectronic die including a conductive bump formed on a bonding pad, and a... | 10/04/2011 |
| 7998760 | Manufacture method for photovoltaic module including inspection and repair After overlaying a conductive adhesive film and the wiring material on an electrode of a solar cell and temporarily fixing the wiring material to the solar cell by pressure bonding under first temperature/pressurizing condition, the quality of the temporarily fixed ... | 08/16/2011 |
| 7993939 | Integrated circuit package system with laminate base An integrated circuit package system with laminate base is provided including forming a base package including, forming a laminate substrate strip, mounting an integrated circuit on the laminate substrate strip, forming a molded cover over the integrated circuit and... | 08/09/2011 |
| 7993940 | Component attach methods and related device structures A method, and associated apparatus, for attaching a component (e.g., an electronic and/or optoelectronic component) is provided which can facilitate low-voiding of an attachment layer. The method includes disposing an attachment material layer over a surface, provid... | 08/09/2011 |
| 7993941 | Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant A semiconductor package is made using a prefabricated post carrier including a base plate and plurality of conductive posts. A film encapsulant is disposed over the base plate of the post carrier and around the conductive posts. A semiconductor die is mounted to a t... | 08/09/2011 |
| 7981702 | Integrated circuit package in package system An integrated circuit package in package system including forming a base integrated circuit package with a base lead having a portion with a substantially planar base surface, forming an extended-lead integrated circuit package with an extended lead having a portion... | 07/19/2011 |
| 7981703 | Electronic assemblies without solder and methods for their manufacture The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with ... | 07/19/2011 |
| 7960189 | Method of manufacturing a system in package A system in package (10) has a, preferably wireless, test controller (20) for testing each die (30) after it has been mounted onto the substrate of the system in package (10), and a faulty die (30) is repaired before a next die ( | 06/14/2011 |
| 7960190 | Temporary package for at-speed functional test of semiconductor chip In some embodiments, a temporary package for at-speed functional test of semiconductor chip, including high power chips, is presented. In this regard, a method is introduced including placing an integrated circuit die on a contactor layer, the contactor layer to ele... | 06/14/2011 |
| 7919336 | Fabrication method for semiconductor device A semiconductor device fabrication method can improve yield of semiconductor devices and decrease (or prevent) waste of non-defective semiconductor chips. This fabrication method has a step of performing characteristic inspection after packaging a semiconductor chip... | 04/05/2011 |
| 7901955 | Method of constructing a stacked-die semiconductor structure In constructing a multi-die semiconductor device, a plurality of semiconductor die are provided. Each die is probe tested when it is part of a wafer. Flat contacts are connected to each die when it is part of a wafer. After wafer sawing, each die is tested in a test... | 03/08/2011 |
| RE42193 | Laser decapsulation method A decapsulation apparatus 100 has a laser 8 that removes plastic encapsulant from a device 24. Chamber 20 is sealed. Exhaust port 9 removes debris and fumes. The device 24 is positioned and scanned using an X, Y table 2. ... | 03/01/2011 |
| 7883908 | Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI) A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the ... | 02/08/2011 |
| 7876119 | Method of inspecting semiconductor device chip patterns on a wafer An inspection method includes performing an inspection by applying a probe to pads of a contact check pattern located, together with a chip pattern, on a wafer, and performing an inspection by applying the probe to pads of the chip pattern if a result of the inspect... | 01/25/2011 |
| 7855087 | Floating sheet production apparatus and method This sheet production apparatus comprises a vessel defining a channel configured to hold a melt. The melt is configured to flow from a first point to a second point of the channel. A cooling plate is disposed proximate the melt and is configured to form a sheet on t... | 12/21/2010 |
| 7829355 | Method for inspecting semiconductor device A method for inspecting a semiconductor device includes carrying out a first test for inspecting characteristics of semiconductor devices under a shielded (dark) condition to discriminate non-defective devices; and carrying out a second test on the semiconductor dev... | 11/09/2010 |
| 7816153 | Method and apparatus for producing a dislocation-free crystalline sheet A dislocation-free sheet may be formed from a melt. A sheet of material with a first width is formed on a melt of the material using a cooling plate. This sheet has dislocations. The sheet is transported with respect to the cooling plate and the dislocations migrate... | 10/19/2010 |
| 7807482 | Method for transferring wafers The invention concerns a method for preparing a thin layer (28) or a chip to be transferred onto another substrate, this method including the realization, above the surface of said thin layer or said chip, of at least one layer, called adhesive layer (25 | 10/05/2010 |
| 7803641 | Mold structure for packaging LED chips and method thereof A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow ch... | 09/28/2010 |
| 7781236 | Optical element mounting method and optical element mounting device An optical element mounting method includes: illuminating ultraviolet light onto a polymer optical waveguide device; under the ultraviolet light illumination, capturing, by an image pickup device, the polymer optical waveguide device including a light incident/exiti... | 08/24/2010 |
| 7767473 | Multiple die wafers having increased reliability and methods of increasing reliability in same A method increases a reliability of packaged semiconductor integrated circuit dice by identifying one or more dice on a wafer having failed an electrical test. One or more failed dice are added to a character map. A first tier of buffer dice is added to the initial ... | 08/03/2010 |
| 7745239 | Arrangement of fill unit elements in an integrated circuit interconnect layer An integrated circuit having a metal interconnect layer, and also having a conductive line and a boundary defined with a uniform distance from the conductive line that defines a “keep out” distance between the boundary and the conductive line. A set of first fil... | 06/29/2010 |
| 7732226 | Method of manufacturing flash memory device Disclosed are methods of manufacturing a flash memory device. The method can include performing a first test on memory banks of chips on a wafer to record an availability of the banks; performing an inking process on each of the chips according to a number of availa... | 06/08/2010 |
| 7723131 | Manufacturing method of a semiconductor device, and paste applicator Speed-up of a die bonding process for mounting a semiconductor chip onto a wiring substrate and improvement of a semiconductor package manufacturing yield are to be attained. A paste applicator comprises a drive section and a movable section supported by the drive s... | 05/25/2010 |
| 7713764 | Method for manufacturing semiconductor device including testing dedicated pad and probe card testing A method for manufacturing a semiconductor device includes preparing two substrates having a first and a second surface and having first and second pads and a second testing-dedicated pad, the first pads in the first surface, the second pads in the second surface an... | 05/11/2010 |
| 7709278 | Method of making PCB circuit modification from multiple to individual chip enable signals A semiconductor package is disclosed having a single CE signal during electrical test and a plurality of CE signals during normal operation thereafter. After electrical testing of the memory die during fabrication, the electrical traces carrying the single CE signal... | 05/04/2010 |
| 7678589 | Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor A method for manufacturing a capacitive semiconductor sensor includes: forming a plurality of circuit chips in a wafer, wherein each circuit chip includes a pad for testing a sensor chip; bonding the sensor chip on each circuit chip with a bump so that the sensor ch... | 03/16/2010 |
| 7674637 | Monitoring cool-down stress in a flip chip process using monitor solder bump structures A semiconductor chip and methods for forming the same. The semiconductor chip includes M regular solder bump structures and N monitor solder bump structures, M and N being positive integers. If a flip chip process is performed for the semiconductor chip, then the N ... | 03/09/2010 |
| 7659127 | Manufacturing device of semiconductor package and manufacturing method of semiconductor package A manufacturing device of a semiconductor package includes: a holding element for holding a substrate; a bonding element for holding the package and bonding a first metal bump of the package to a second metal bump of the substrate; a monitoring element for irradiati... | 02/09/2010 |
| 7629185 | Semiconductor laser device manufacturing method and semiconductor laser device A semiconductor laser device manufacturing method includes, sequentially, a first aging step S1, a first inspection step S2, a mounting step S3, a second aging step S4 and a second inspection step S5. Since the first aging step S | 12/08/2009 |
| 7625768 | Transfer molding apparatus and method for manufacturing semiconductor device A transfer molding apparatus, wherein said top-half mold and said bottom-half mold form a plurality of cavities interconnected, and wherein said pressure adjusting means reduces the pressure of the cavities every time a specified amount of resin is supplied into any... | 12/01/2009 |
| 7566575 | Mounting circuit and method for producing semiconductor-chip-mounting circuit A method according to the present invention for producing a semiconductor-chip-mounting circuit 1 includes mainly three steps. In a first step, contacts 2 each in the form of a conical helix are formed by solder-plating the surface of connecting termin... | 07/28/2009 |
