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| Number | Title | Issue Date |
| 8143111 | System and method for configuring an integrated circuit A system and method for configuring an integrated circuit. Embodiments include a method for manufacturing an integrated circuit (IC), comprising associating configuration items of the integrated circuit with at least one fuse of at least one type of fuse, wherein a ... | 03/27/2012 |
| 8133766 | Fuse of semiconductor device and method of forming the same A fuse of a semiconductor device includes first fuse metals formed over an underlying structure and a second fuse metal formed between the first fuse metals. Accordingly, upon blowing, the fuse metals are not migrated under conditions, such as specific temperature a... | 03/13/2012 |
| 8133767 | Efficient interconnect structure for electrical fuse applications A semiconductor structure is provided that includes an interconnect structure and a fuse structure located in different areas, yet within the same interconnect level. The interconnect structure has high electromigration resistance, while the fuse structure has a low... | 03/13/2012 |
| 8105886 | Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same A fuse link is formed between first and second terminals. The first and second terminals and fuse link have a polysilicon layer and a layer formed on the polysilicon layer and containing a metal element. At least a portion of the fuse link is an amorphous silicon la... | 01/31/2012 |
| 8101471 | Method of forming programmable anti-fuse element A programmable anti-fuse element includes a substrate (224), an N-well (426) in the substrate, an electrically insulating layer (427) over the N-well, and a gate electrode (430) over the electrically insulating layer. The gate electrode h... | 01/24/2012 |
| 8039321 | Electrical fuse, semiconductor device having the same, and method of programming and reading the electrical fuse Provided are an electrical fuse, a semiconductor device having the same, and a method of programming and reading the electrical fuse. The electrical fuse includes first and second anodes disposed apart from each other. A cathode is interposed between the first and s... | 10/18/2011 |
| 8017454 | Fuse of semiconductor device and method for forming the same A method for forming a fuse of a semiconductor device includes performing an ion-implanting process at sides of a fuse blowing region of a metal fuse, thereby increasing the concentration of impurity ions of a thermal transmission path region. In a subsequent laser ... | 09/13/2011 |
| 7998798 | Method of cutting electrical fuse A method of cutting an electrical fuse including a first conductor and a second conductor, the first conductor including a first cutting target region, the second conductor branched from the first conductor and connected to the first conductor and including a second... | 08/16/2011 |
| 7981732 | Programming of laser fuse A method for programming a laser fuse. The laser fuse has a fuse link including a material having a characteristic of changing its electrical resistance after being exposed to a laser beam. The laser beam is directed to the fuse link, the laser beam being controlled... | 07/19/2011 |
| 7977164 | Fuse of a semiconductor memory device and repair process for the same Disclosed herein is a fuse of a semiconductor memory device and a repair process for the same. The fuse includes a lower conductive film of a multilayer interconnection formed on a lower structure of a semiconductor substrate, an upper conductive film of the multila... | 07/12/2011 |
| 7955905 | Methods and systems for thermal-based laser processing a multi-material device A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includ... | 06/07/2011 |
| 7955906 | Methods and systems for thermal-based laser processing a multi-material device A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includ... | 06/07/2011 |
| 7951653 | Methods of manufacturing a semiconductor device using compositions for etching copper A method of manufacturing a semiconductor device includes preparing a substrate on which a fuze line containing copper is formed. The method further includes cutting the fuze line by emitting a laser beam, and applying a composition for etching copper to the substra... | 05/31/2011 |
| 7943437 | Apparatus and method for electronic fuse with improved ESD tolerance Method of making an electronic fuse blow resistor structure. In one embodiment, the method includes forming an insulator film, depositing a conductor on the insulator film, and after the depositing, etching the conductor to form a plurality of spaced apart non-condu... | 05/17/2011 |
| 7923307 | Semiconductor device with fuse and method for fabricating the same A method for fabricating a semiconductor with a fuse includes providing a substrate, forming an insulation layer over the substrate, forming a polysilicon hard mask over the insulation layer, forming a first mask pattern to form a fuse over the polysilicon hard mask... | 04/12/2011 |
| 7923306 | Semiconductor structure processing using multiple laser beam spots Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam th... | 04/12/2011 |
| 7915096 | Semiconductor device and method for fabricating the same A semiconductor device includes a fuse pattern formed as conductive polymer layer having a low melting point. The fuse pattern is easily cut at low temperature to improve repair efficiency. The semiconductor device includes first and second fuse connecting patterns ... | 03/29/2011 |
| 7910408 | Damage propagation barrier and method of forming A conductor-filled damage propagation barrier is formed extending into a low-k dielectric layer between a fuse and an adjacent circuit element for preventing propagation of damage during a fuse blow operation. Conductor material filling the damage propagation barrie... | 03/22/2011 |
| 7892895 | Diode junction poly fuse System and method for providing an electrical fuse having a p-n junction diode. A preferred embodiment comprises a cathode, an anode, and one or more links formed between the cathode and the anode. The cathode and the portion of the cathode adjoining the link are do... | 02/22/2011 |
| 7867832 | Electrical fuse and method of making A semiconductor fuse and methods of making the same. The fuse includes a fuse element and a compressive stress liner that reduces the electro-migration resistance of the fuse element. The method includes forming a substrate, forming a trench feature in the substrate... | 01/11/2011 |
| 7833844 | Semiconductor device and production method of the same A disclosed method of producing a semiconductor device includes the steps of (A) forming a gate electrode and a trimming fuse on a semiconductor substrate; (B) forming a side wall insulating film covering the gate electrode and the trimming fuse; (C) forming a condu... | 11/16/2010 |
| 7829392 | Method for manufacturing fuse box having vertically formed protective film A method for manufacturing a fuse box of a semiconductor device includes forming an interlayer dielectric film over a semiconductor substrate including a given lower structure; forming a metal line and a fuse over the interlayer dielectric film; forming a first prot... | 11/09/2010 |
| 7820493 | Methods of making and using fuse structures, and integrated circuits including the same A fuse structure, an integrated circuit including the structure, and methods for making the structure and (re)configuring a circuit using the fuse. The fuse structure generally includes (a) a conductive structure with at least two circuit elements electrically coupl... | 10/26/2010 |
| 7811866 | Single passivation layer scheme for forming a fuse An integrated circuit structure comprising a fuse and a method for forming the same are provided. The integrated circuit structure includes a substrate, an interconnection structure over the substrate, a fuse connected to the interconnection structure, and an anti-r... | 10/12/2010 |
| 7799617 | Semiconductor device and method of manufacturing same A semiconductor device includes an etching protection layer to protect a metal layer in a bonding pad area when a metal fuse is etched. ... | 09/21/2010 |
| 7785935 | Manufacturing method for forming an integrated circuit device and corresponding integrated circuit device The present invention provides a manufacturing method for forming an integrated circuit device and to a corresponding integrated circuit device. The manufacturing method for forming an integrated circuit device comprises the steps of: forming a first level on a subs... | 08/31/2010 |
| 7785936 | Method for repair of semiconductor device The present invention relates to a method for repairing a semiconductor device. The method includes cutting a fuse without creation of residue by transforming the fuse into a nonconductor of high resistance by oxidizing the fuse by irradiating the fuse with an oxyge... | 08/31/2010 |
| 7785937 | Electrical fuse having sublithographic cavities thereupon An electrical fuse and a first dielectric layer thereupon are formed on a semiconductor substrate. Self-assembling block copolymers containing two or more different polymeric block components are applied into a recessed region surrounded by a dielectric template lay... | 08/31/2010 |
| 7785934 | Electronic fuses in semiconductor integrated circuits A structure fabrication method. The method includes providing a structure. The structure includes (a) a substrate layer, (b) a first fuse electrode in the substrate layer, and (c) a fuse dielectric layer on the substrate layer and the first fuse electrode. The metho... | 08/31/2010 |
| 7772047 | Method of fabricating a semiconductor die having a redistribution layer A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the... | 08/10/2010 |
| 7767500 | Superjunction device with improved ruggedness An improved superjunction semiconductor device includes a charged balanced pylon in a body region, where a top of the pylon is large to create slight charge imbalance. A MOSgated structure is formed over the top of the pylon and designed to conduct current through t... | 08/03/2010 |
| 7745266 | Method of forming a fuse part The present invention provides a semiconductor device with a fuse part and a method of forming the same. The method includes forming a selective metal layer on a via hole which is connected to a metal line in a semiconductor device, forming a fuse metal layer on the... | 06/29/2010 |
| 7713793 | Fuse of semiconductor device and method for manufacturing the same A method for manufacturing a fuse of a semiconductor device comprises forming an island-type metal fuse in a region where a laser is irradiated, so that laser energy may not be dispersed in a fuse blowing process, thereby improving repair efficiency. ... | 05/11/2010 |
| 7713792 | Fuse structure including monocrystalline semiconductor material layer and gap A fuse structure, a method for fabricating the fuse structure and a method for programming a fuse within the fuse structure each use a fuse material layer that is used as a fuse, and located upon a monocrystalline semiconductor material layer in turn located over a ... | 05/11/2010 |
| 7704805 | Fuse structures, methods of making and using the same, and integrated circuits including the same A fuse structure, an integrated circuit including the structure, and methods for making the structure and (re)configuring a circuit using the fuse. The fuse structure generally includes (a) a conductive structure with at least two circuit elements electrically coupl... | 04/27/2010 |
| 7704804 | Method of forming a crack stop laser fuse with fixed passivation layer coverage A crack stop void is formed in a low-k dielectric or silicon oxide layer between adjacent fuse structures for preventing propagation of cracks between the adjacent fuse structures during a fuse blow operation. The passivation layer is fixed in place by using an etch... | 04/27/2010 |
| 7666717 | Non-volatile memory devices including fuse covered field regions A non-volatile device includes a semiconductor substrate having a fuse window region. At least one fuse crosses the fuse window region. Field regions are arranged outside of the fuse window region and arranged under end portions of the at least one fuse. An isolatio... | 02/23/2010 |
| 7662674 | Methods of forming electromigration and thermal gradient based fuse structures Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a metallic fuse structure by forming at least one via on a first interconnect structure, lining the at least one via with a barrier layer, and then forming a s... | 02/16/2010 |
| 7651894 | Method for manufacturing semiconductor device A semiconductor device manufacturing method including forming a dummy capacitor in a fuse region to avoid a step height between plate electrodes in a cell region and in a fuse region, is disclosed herein. The method can be used so that only an insulating film at a t... | 01/26/2010 |
| 7651893 | Metal electrical fuse structure An electrical fuse and a method for forming the same are provided. The electrical fuse includes a dielectric layer over a shallow trench isolation region and a contact plug extending from a top surface of the dielectric layer to the shallow trench isolation region, ... | 01/26/2010 |
