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| Number | Title | Issue Date |
| 8183095 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation A semiconductor wafer contains a plurality of semiconductor die separated by a saw street. An insulating layer is formed over the semiconductor wafer. A protective layer is formed over the insulating layer including an edge of the semiconductor die along the saw str... | 05/22/2012 |
| 8153480 | Air cavity package for flip-chip According to an example embodiment, there is method (100) for manufacturing a semiconductor device in an air-cavity package. For a device die having an active surface, a lead frame is provided (5), the lead frame has a top-side surface and an under-sid... | 04/10/2012 |
| 8148209 | Resin ejection nozzle, resin encapsulation method, and electronic part assembly A resin ejection nozzle is scanned over a substrate on which an electronic part is mounted, and ejects an encapsulation resin to an encapsulation area of the substrate. The resin ejection nozzle comprises an ejection part adapted to eject the encapsulation resin, th... | 04/03/2012 |
| 8148210 | Method for fabricating a semiconductor chip panel The method includes providing a plurality of semiconductor chips and placing the plurality of semiconductor chips on a carrier. A compression molding apparatus is provided that includes a first tool and a second tool. The carrier is placed on the first tool of the c... | 04/03/2012 |
| 8143110 | Methods and apparatuses to stiffen integrated circuit package A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir ... | 03/27/2012 |
| 8138027 | Optical semiconductor device having pre-molded leadframe with window and method therefor A semiconductor device is made by providing a semiconductor die having an optically active area, providing a leadframe or pre-molded laminated substrate having a plurality of contact pads and a light transmitting material disposed between the contact pads, attaching... | 03/20/2012 |
| 8129231 | Method of manufacture for semiconductor package with flow controller A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compo... | 03/06/2012 |
| 8129230 | Underfill method and chip package A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a f... | 03/06/2012 |
| 8119458 | Placement method of an electronic module on a substrate The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved... | 02/21/2012 |
| 8105883 | Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method Provided is a method for manufacturing a semiconductor device in which movement of an island in resin sealing is prevented. A molding die includes an upper die and a lower die. The upper and lower dies are fitted together to form cavities and runners. In the lower d... | 01/31/2012 |
| 8097497 | Inkjet printed wirebonds, encapsulant and shielding A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern... | 01/17/2012 |
| 8084302 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor A semiconductor wafer is made by forming a first conductive layer over a sacrificial substrate, mounting a semiconductor die to the sacrificial substrate, depositing an insulating layer over the semiconductor die and first conductive layer, exposing the first conduc... | 12/27/2011 |
| 8076185 | Integrated circuit protection and ruggedization coatings and methods An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component. ... | 12/13/2011 |
| 8067275 | Integrated circuit package system with package integration An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the... | 11/29/2011 |
| 8058109 | Method for manufacturing a semiconductor structure The present invention provides a method for manufacturing a semiconductor structure, —including—the following steps of: forming a substrate having a package array; forming a thermosetting non-conductive layer covering the substrate; partially solidifying the the... | 11/15/2011 |
| 8058110 | Plating method, semiconductor device fabrication method and circuit board fabrication method The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 with a cutting tool 12; the step of forming a seed layer 36 on the resin layer 10 | 11/15/2011 |
| 8058108 | Methods of forming semiconductor chip underfill anchors Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in an insulating layer applied to a side of a semiconductor chip. The first opening does not extend t... | 11/15/2011 |
| 8034667 | Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same A semiconductor sealing resin sheet is composed of a supporting sheet and a sealing resin layer releasably laminated on the supporting sheet, wherein the sealing resin layer has a thermosetting property, the elastic modulus of the sealing resin layer before thermose... | 10/11/2011 |
| 8017452 | Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method A circuit element is disposed on an organic substrate and is connected to a wiring pattern provided on the organic substrate. Internal connection electrodes are formed on a support of a conductive material through electroforming such that the internal connection ele... | 09/13/2011 |
| 8017451 | Electronic modules and methods for forming the same Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate. ... | 09/13/2011 |
| 8003448 | Semiconductor package and method for producing the same A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to th... | 08/23/2011 |
| 7993983 | Method of making a semiconductor chip assembly with chip and encapsulant grinding A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, then forming an encapsulant that covers the chip, then grinding the encapsulant without grinding the chip and then grinding the encapsulant and t... | 08/09/2011 |
| 7993984 | Electronic device and manufacturing method An electronic device including a semiconductor device with a plurality of bump electrodes, a mounting board connected to the semiconductor device, thermally expandable particles, and adhesive. The thermally expandable particles are provided on the sides of the semic... | 08/09/2011 |
| 7989269 | Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof A semiconductor device is made by mounting a first semiconductor die to a first substrate, forming a first encapsulant over the first semiconductor die, and forming a second encapsulant over the first encapsulant. The second encapsulant is penetrable, thermally cond... | 08/02/2011 |
| 7989270 | Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors A semiconductor device is made by forming a plurality of conductive pillars vertically over a temporary carrier. A conformal insulating layer is formed over the conductive pillars. A conformal conductive layer is formed over the conformal insulating layer. A first c... | 08/02/2011 |
| 7968380 | Semiconductor encapsulation material and method for encapsulating semiconductor using the same A semiconductor encapsulation material of the present invention contains a glass for metal coating which has a strain point of 480° C. or higher, a temperature corresponding to a viscosity of 104 dPa·s of 1,100° C. or lower, and a thermal expansion coe... | 06/28/2011 |
| 7964450 | Wirebondless wafer level package with plated bumps and interconnects A semiconductor package includes a carrier strip having a die cavity and a plurality of bump cavities. A semiconductor die is mounted in the die cavity of the carrier strip using a die attach adhesive. In one embodiment, a top surface of the semiconductor die is app... | 06/21/2011 |
| 7947536 | Process for forming encapsulated electronic devices There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy ... | 05/24/2011 |
| 7943435 | Underfill film having thermally conductive sheet An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit boar... | 05/17/2011 |
| 7939383 | Method for fabricating semiconductor package free of substrate A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in t... | 05/10/2011 |
| 7939382 | Method of fabricating a semiconductor package having through holes for molding back side of package A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the hole... | 05/10/2011 |
| 7927924 | Semi-finished package and method for making a package The present invention relates to a semi-finished package and a method for making a package. The semi-finished package includes a carrier and at least one molding compound. The molding compound is disposed on a surface of the carrier, and has a body and a plurality o... | 04/19/2011 |
| 7927925 | Electronic packages with fine particle wetting and non-wetting zones Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be mad... | 04/19/2011 |
| 7923304 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a conductive pillar, having substantially parallel vertical sides, in direct contact with the substrate; mounting an integrated circuit to the substrate beside... | 04/12/2011 |
| 7919362 | Method for preparing a cover for protecting a component on a substrate A method for preparing a cover on a substrate in particular for the encapsulation of electronic, optical, optoelectronic components, of the electromechanical microsystems type, also known as Micro-Electro-Mechanical Systems (MEMS) or optoelectromechanical microsyste... | 04/05/2011 |
| 7915090 | Method for manufacturing a semiconductor device A method for manufacturing a semiconductor device having a substrate on which conductor wiring is disposed, electrodes provided to the conductor wiring, a semiconductor element connected to the electrodes, and a sealing member that covers the semiconductor element, ... | 03/29/2011 |
| 7915089 | Encapsulation method A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated between first and second molds. One mold is moved towards the other so as to vary the size of a cavity defin... | 03/29/2011 |
| 7915091 | Method of controlling satellite drops from an encapsulant jetter A method of jetting drops of encapsulant from an encapsulant jetter, the drops including primary drops and satellite drops that are much smaller than the primary drops. The method has the steps of providing a series of wire bonds electrically connecting a micro-elec... | 03/29/2011 |
| 7910406 | Electronic circuit device and method for manufacturing same An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the se... | 03/22/2011 |
| 7906378 | Epoxy resin composition for encapsulating semiconductor element and semiconductor device An epoxy resin composition for encapsulating a semiconductor element and a semiconductor device manufactured using the epoxy resin composition are provided. The epoxy resin composition includes epoxy resin, a curing agent, at least one kind of an inorganic filler se... | 03/15/2011 |
