Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 6913946 | Method of making an ultimate low dielectric device A method of making a semiconductor device comprising: providing a semiconductor substrate having a plurality of discrete devices formed therein, and a plurality of metal layers and support layers, the support layers comprising an uppermost support layer and other su... | 07/05/2005 |
| 6913950 | Semiconductor device with chamfered substrate and method of making the same A semiconductor device includes an insulating substrate, a cutout formed in side surfaces of the substrate, a conductive pad formed on the obverse surface of the substrate, an electrode formed on the reverse surface of the substrate, a semiconductor chip mounted on ... | 07/05/2005 |
| 6908786 | Method for producing a contactless chip card using transfer paper The invention concerns a manufacturing process for a contactless smart card (or ticket) which includes the following steps: a manufacturing process for an antenna consisting in screen-printing turns of an electrically conductive po... | 06/21/2005 |
| 6905915 | Semiconductor device and method of manufacturing the same, and electronic instrument A method of manufacturing a semiconductor device includes mounting of a semiconductor chip on a substrate. In the mounting step, electrodes of the semiconductor chip and leads formed on the substrate are disposed to face each other. Each of the electrodes has a bump... | 06/14/2005 |
| 6906415 | Semiconductor device assemblies and packages including multiple semiconductor devices and methods A multidie semiconductor device (MDSCD) package includes a generally planar interposer comprising a substrate with a central receptacle, upper surface conductors, and outer connectors on the lower surface of the interposer. Conductive vias connect upper surface cond... | 06/14/2005 |
| 6903441 | Semiconductor package with enhanced chip groundability and method of fabricating the same A semiconductor package and a fabrication method thereof are provided, in which a ground pad on a chip is electrically connected to a ground plane on a substrate by means of an electrically-conductive wall formed over a side surface of the chip and an electrically-c... | 06/07/2005 |
| 6902955 | Method of manufacturing a semiconductor device having a flexible wiring substrate Peeling between a molding resin and a substrate is prevented to improve the quality of a semiconductor device. A film substrate capable of being deformed following shrinkage upon curing of a molding resin and having plural partitioned device areas is provided, then ... | 06/07/2005 |
| 6897093 | Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) package Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the forma... | 05/24/2005 |
| 6895666 | Underfill system for semiconductor package An underfill system for filling gaps between semiconductor chips and substrates is provided. The underfill system comprises a blower for blowing air, an air duct coupled to the blower, the air duct comprising a main duct coupled to the blower and a plurality of sub-... | 05/24/2005 |
| 6890834 | Electronic device and method for manufacturing the same An Al film is formed on a cap wafer and the Al film is patterned into a ring-shaped film. Dry etching is performed by using the ring-shaped film as a mask to form a drum portion enclosing a recess portion to provide a vacuum dome. After forming a depth of cut into t... | 05/10/2005 |
| 6889430 | Method of selectively adjusting surface tension of soldermask material A method of selectively adjusting surface tension of a soldermask material. Specifically, a method of selectively adjusting the surface tension of a soldermask material to promote adhesion of a molding compound in a ball grid array package while maintaining a low su... | 05/10/2005 |
| 6889429 | Method of making a lead-free integrated circuit package An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive mate... | 05/10/2005 |
| 6890800 | Method of manufacturing semiconductor device with ceramic multilayer board One side of a ceramic multilayer board is attached to a resin film with adhesive, the resin film is mounted on a mold for resin sealing having a cavity provided in desired position, the position of the board is controlled by pressing against a portion of the resin f... | 05/10/2005 |
| 6888172 | Apparatus and method for encapsulating an OLED formed on a flexible substrate An apparatus and method are disclosed for encapsulating an OLED device formed on a flexible substrate. The OLED device is moisture protected by an encapsulation which sandwiches the OLED device between two transparent dielectric metal oxide layers. The oxide layers ... | 05/03/2005 |
| 6883231 | Method for fabricating a circuit device A method for fabricating a circuit device includes preparing an insulation resin sheet for which a first conductive layer and a second conductive layer are adhered to each other by insulation resin, forming through holes in the first conductive layer and the insulat... | 04/26/2005 |
| 6884663 | Method for reconstructing an integrated circuit package using lapping A method is provided for reconstructing an integrated circuit package comprising: attaching a die to exposed wire bond pads of a lead frame so that the die is electrically connected to the lead frame; and encapsulating the die and the wire bond pads in an encapsulan... | 04/26/2005 |
| 6881611 | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the... | 04/19/2005 |
| 6876544 | Image sensor module and method for manufacturing the same An image sensor module and a method for manufacturing the same. The image sensor module includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mou... | 04/05/2005 |
| 6875632 | Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography A method for underfilling and encapsulating flip-chip configured semiconductor devices mounted on a carrier substrate using stereolithography (STL) to form, in situ, at least semisolid dam structures of photopolymeric material about the devices to entrap liquid, unp... | 04/05/2005 |
| 6875639 | Semiconductor device and method of manufacturing the same A semiconductor chip has a quadrangle main surface, a wiring substrate, and a resin seal member for sealing the semiconductor chip, in which the resin seal member has a quadrangle main surface which confronts the main surface of the semiconductor chip. A gate cut tr... | 04/05/2005 |
| 6869811 | Methods for transfer molding encapsulation of a semiconductor die with attached heat sink A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First, the dam prevents damage to the mold. Second, the dam prevents encapsul... | 03/22/2005 |
| 6869824 | Fabrication method of window-type ball grid array semiconductor package A fabrication method of a window-type ball grid array (WBGA) semiconductor package is provided. With a chip being mounted over an opening formed through a substrate and electrically connected to the substrate by bonding wires through the opening, a molding process i... | 03/22/2005 |
| 6867480 | Electromagnetic interference package protection A method of shielding an integrated circuit from electromagnetic interference. The integrated circuit is at least partially encapsulated within an electromagnetic interference resistant molding compound, and then the integrated circuit is completely encapsulated wit... | 03/15/2005 |
| 6867069 | Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin A first adhesive tape is attached to a first major surface of a semiconductor wafer, the semiconductor wafer having a plurality of semiconductor chip regions. Protrusion electrodes are formed on a second major surface of the semiconductor wafer within the plurality ... | 03/15/2005 |
| 6866901 | Method for edge sealing barrier films An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barri... | 03/15/2005 |
| 6861278 | Method and apparatus for underfilling semiconductor devices A method and apparatus for underfilling a gap between a multi-sided die and a substrate with an encapsulant material. The die and/or the substrate is heated non-uniformly by a heat source to generate a temperature gradient therein. The heated one of the die and the ... | 03/01/2005 |
| 6861283 | Package for integrated circuit with thermal vias and method thereof A method for enhancing thermal performance of an integrated circuit package attaches a dummy die to the semiconductor die of the integrated circuit. The dummy die is then thermally coupled through external terminals to the conductive layers of a printed circuit boar... | 03/01/2005 |
| 6861295 | Low-pin-count chip package and manufacturing method thereof A low-pin-count chip package including a die pad for receiving a semiconductor chip and a plurality of connection pads electrically coupled to the semiconductor chip. The semiconductor chip, the die pad, and the connection pads are encapsulated in a package body suc... | 03/01/2005 |
| 6858935 | Simulating euclidean wiring directions using manhattan and diagonal directional wires An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second sec... | 02/22/2005 |
| 6858472 | Method for implementing selected functionality on an integrated circuit device A semiconductor device in a computer system is disclosed that includes a die having an active surface bearing integrated circuitry, the die including a plurality of bond pads thereon at least some of which are connected to the integrated circuitry and having at leas... | 02/22/2005 |
| 6858470 | Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof A method for fabricating semiconductor packages provides a leadframe for packages that are to be singulated with respective predetermined package body sizes. Individual mold caps are formed on the leadframe with mold cap dimensions that are larger than the respectiv... | 02/22/2005 |
| 6855579 | Semiconductor device and process for fabrication thereof A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not m... | 02/15/2005 |
| 6855574 | Stress balanced semiconductor packages, method of fabrication and modified mold segment Stress balanced semiconductor device packages, a method of forming, and a method of modifying a mold segment for use in the method are disclosed. A semiconductor die is attached to one side of a substrate having discrete conductive elements such as a ball grid array... | 02/15/2005 |
| 6847121 | Semiconductor device and package product of the semiconductor device A semiconductor device includes, a circuit constituting section having a function circuit and an externally-drawing electrode, connected to the function circuit, on a surface of the circuit constituting section. An insulating layer is provided on a side of a rear su... | 01/25/2005 |
| 6841423 | Methods for formation of recessed encapsulated microelectronic devices A method for manufacturing microelectronic device packages. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first surface and a cavity extending through the support member from the first... | 01/11/2005 |
| 6841420 | Semiconductor device and method of manufacturing the same The present invention relates to a semiconductor device in which a semiconductor element and a substrate are disposed face-to-face, the mixture of the thermoplastic resin and the thermosetting resin is provided between the semiconductor element having the electrode ... | 01/11/2005 |
| 6841422 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a sec... | 01/11/2005 |
| 6838313 | Molded flip chip package A method for producing a molded flip chip package is described. According to one embodiment, an incomplete flip chip package comprising a thin substrate and a silicon chip is placed in a mold, and a resin is injected into the mold filling the gap between the surface... | 01/04/2005 |
| 6838319 | Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically A method and apparatus for reducing or eliminating the formation of air pockets or voids in a flowable material provided in contact with at least one substrate. The flowable material is provided in a non-horizontal direction and flows from a lower portion to an uppe... | 01/04/2005 |
| 6833610 | Bridge connection type of chip package and fabricating method thereof A chip package having at least a substrate, a chip and a conductive trace is provided. The substrate has a first surface, a second surface, a cavity and at least one substrate contact all positioned on the first surface of the substrate. The chip has an active surfa... | 12/21/2004 |
