U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Icon_funbox Did You Know...

...that in the early 1940s GE engineer James Wright was charged with a task of utmost importance to the war effort: develop a cheap substitute for rubber that could be used to produce tires, gas masks and a whole host of military gear. Wright tackled the task diligently -- and wound up inventing Silly Putty.

Newsletter  PatentStorm News

Make the Most of Our Site

See this month's Top Inventors and Most Cited Patents.

Stay on top of the latest innovations by subscribing to an RSS feed.

Registered users: Manage your profile.

 

Class 438/126 - And encapsulating


Subclass of Class 438 - Semiconductor device manufacturing: process
Definition: Process including a step of surrounding the semiconductor
No. of patents: 924
Last issue date: 04/10/2012


                    24  
NumberTitleIssue Date
3959874Method of forming an integrated circuit assembly
A method of forming an integrated circuit assembly is disclosed. The method comprises selectively treating a surface of a carrier to delineate a pattern thereon capable of receiving a metal deposit. The pattern is contacted with a conductive lead of an in...
06/01/1976
3950142Lead assembly for semiconductive device
An improved lead assembly adapted for utilization in a semiconductor device having a glass envelope, an electrical device positioned within said envelope having at least one end surface, said lead assembly comprising a metallic seal member adapted for ext...
04/13/1976
3945111Metallization system for semiconductor devices, devices utilizing such metallization system and method for making devices and metallization system
A metallization system for metallurgically bonding a semiconductor die to metallic conducting slugs as terminals at the same time, and at the same temperature, that a surrounding glass sleeve is hermetically sealed to the conducting slugs for forming a ze...
03/23/1976
3934336Electronic package assembly with capillary bridging connection
An electronic package assembly comprising a substrate having a central recess in which a semiconductor chip can be mounted. A narrow inclined groove is cut into the edge of the recess and extends from the recess bottom to the location of a screen-printed ...
01/27/1976
                    24  
 
Sign InRegister
Username  
Password   
forgot password?