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| Number | Title | Issue Date |
| 7537966 | Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer A method for fabricating a BOC package includes the steps of providing a semiconductor die having planarized bumps encapsulated in a polymer layer, and providing a substrate having a plurality of conductors and an opening. The method also includes the steps of attac... | 05/26/2009 |
| 7534662 | Methods for hermetic sealing of post media-filled MEMS package This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fi... | 05/19/2009 |
| 7524704 | Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam A method for encapsulating a component by using a chamber in which there is a vacuum or controlled atmosphere, positioning a continuous sealing seam made of a metal or a metal alloy on a wettable surface previously placed on a substrate including at least one compon... | 04/28/2009 |
| 7514299 | Chip package structure and manufacturing method thereof A manufacturing method of a chip package structure is provided. A circuit substrate having a first surface, a second surface, and a through hole connecting the first surface and the second surface is provided. A chip having an active surface and bonding pads dispose... | 04/07/2009 |
| 7498205 | Method for manufacturing substrate with cavity A method for manufacturing a substrate having a cavity which includes forming a barrier around a predetermined area where the cavity is to be formed on a copper foil laminated master, an internal circuit formed in the copper foil laminated master; coating a thermose... | 03/03/2009 |
| 7479413 | Method for fabricating semiconductor package with circuit side polymer layer A semiconductor package includes a substrate, a die attached and wire bonded to the substrate, and a die encapsulant encapsulating the die. The die includes a circuit side having a pattern of die contacts, planarized wire bonding contacts bonded to the die contacts,... | 01/20/2009 |
| 7459349 | Method of forming a stack of semiconductor packages A stackable semiconductor package includes a substrate with a first side surface that includes circuit patterns. Each circuit pattern includes a pad. A semiconductor die is electrically coupled to the circuit patterns. An encapsulant covers the semiconductor die and... | 12/02/2008 |
| 7445969 | Method of manufacturing a semiconductor device For molding semiconductor chips on a wiring substrate matrix with a sealing resin, the wiring substrate matrix is placed on a lower die cavity block of a lower die, and, thereafter, an upper die is brought down, whereby an outer peripheral portion of a cavity of the... | 11/04/2008 |
| 7443041 | Packaging of a microchip device A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer is placed on microchip devices. The interposer includes an aperture which extends from the interposer surface where external electrical contacts are... | 10/28/2008 |
| 7440263 | Image sensor and method for manufacturing the same An image sensor and a method for manufacturing the same. The image sensor includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the su... | 10/21/2008 |
| 7439099 | Thin ball grid array package An integrated circuit package is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. The substrate further has a cavity therein and a heat slug is fixed to the substrate and spans the cavity.... | 10/21/2008 |
| 7439101 | Resin encapsulation molding method for semiconductor device According to a resin encapsulation molding method for a semiconductor device, a resin-encapsulated substrate having a semiconductor device that is mounted on the substrate and that has a portion exposed is formed. With the method, a device-mounted substrate on which... | 10/21/2008 |
| 7435626 | Rearrangement sheet, semiconductor device and method of manufacturing thereof There are provided a semiconductor device construction having more degrees of design freedom of the semiconductor element than prior arts, and a method of manufacturing such device easily and at low cost. For this purpose, a rearrangement sheet is employed provided ... | 10/14/2008 |
| 7435625 | Semiconductor device with reduced package cross-talk and loss Structure and method are provided for plastic encapsulated semiconductor devices having reduced package cross-talk and loss. Semiconductor die are first coated with a buffer region having a lower dielectric constant ε and/or lower loss tangent δ than the plastic e... | 10/14/2008 |
| 7429787 | Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over... | 09/30/2008 |
| 7425464 | Semiconductor device packaging Methods and apparatus are provided for encapsulating electronic devices, comprising: providing one or more electronic devices (62) with primary faces (63) having electrical contacts (69), opposed rear faces (65) and edges (64) ther... | 09/16/2008 |
| 7410836 | Method for fabricating a photosensitive semiconductor package A photosensitive semiconductor package, a method for fabricating the same, and a lead frame thereof are proposed. The lead frame has a die pad and a plurality of leads, wherein at least one recessed portion is formed at an end of each lead close to the die pad, and ... | 08/12/2008 |
| 7402457 | Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is e... | 07/22/2008 |
| 7396704 | Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus This method of manufacturing a lid made of a transparent resin comprises a step of introducing a resin into a cavity for molding a protrusion continuous with a cavity for molding a lid in a die; a step of forming a molded body including a lid and a protrusion contin... | 07/08/2008 |
| 7391119 | Temperature sustaining flip chip assembly process A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during f... | 06/24/2008 |
| 7390687 | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex an... | 06/24/2008 |
| 7384805 | Transfer mold semiconductor packaging processes In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of open... | 06/10/2008 |
| 7377031 | Fabrication method of semiconductor integrated circuit device A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in the distal ends thereof which project into the air vents. By... | 05/27/2008 |
| 7378301 | Method for molding a small form factor digital memory card A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash ... | 05/27/2008 |
| 7378299 | Leadless semiconductor package and manufacturing method thereof A leadless semiconductor package mainly includes a semiconductor device securely attached to an upper surface of a die pad by solder paste and a plurality of leads arranged about the periphery of the die pad. The thickness of the leads and the die pad are within a r... | 05/27/2008 |
| 7371606 | Manufacturing method of a semiconductor device The yield of a sealing process for a semiconductor device which adopts a flip-chip mounting method is to be improved. In a molding process wherein plural semiconductor chip ICs mounted on a parts mounting surface of a substrate matrix through bump electrodes are to ... | 05/13/2008 |
| 7371617 | Method for fabricating semiconductor package with heat sink A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip car... | 05/13/2008 |
| 7372151 | Ball grid array package and process for manufacturing same A process for manufacturing an integrated circuit package includes forming a plurality of solder balls on a first surface of a substrate and mounting a semiconductor die to the substrate such that bumps of the semiconductor die are electrically connected to conducti... | 05/13/2008 |
| 7368809 | Pillar grid array package A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an array and each has a flattened top to electrically connect to a printe... | 05/06/2008 |
| 7368319 | Stacked integrated circuit package-in-package system A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first encapsulation and a second integrated circuit package having a second encapsulation, stacking the first integrated package below the second i... | 05/06/2008 |
| 7368307 | Method of manufacturing an OLED device with a curved light emitting surface A method of manufacturing an OLED device with a curved light-emitting surface comprising: a) forming a flexible substrate and providing the flexible substrate in a flat configuration; b) forming one or more OLEDs having a first electrode, one or more l... | 05/06/2008 |
| 7368323 | Semiconductor device and manufacturing method thereof A semiconductor device is provided which includes a first semiconductor chip, a substrate onto which the first semiconductor chip is flip-chip bonded and on which a concave is formed along one side of the first semiconductor chip which is flip-chip bonded, a second ... | 05/06/2008 |
| 7365420 | Semiconductor packages and methods for making and using same A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected... | 04/29/2008 |
| 7364945 | Method of mounting an integrated circuit package in an encapsulant cavity An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity. ... | 04/29/2008 |
| 7364925 | Organic light emitting device having a protective barrier A method of forming a protective barrier in an organic light emitting device is disclosed, wherein the organic light emitting device is formed on a substrate and includes a plurality of layers of materials, the plurality of layers of materials including an organic l... | 04/29/2008 |
| 7364941 | Circuit device manufacturing method A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto the overcoat resin. A first conductive film 23A and a second con... | 04/29/2008 |
| 7361997 | Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths A device package, such as a BGA, to be mounted on a printed wiring board (PWB) is disclosed. The bottom electrodes of the device package are arranged in an array such that intervals between the edges of the bottom electrodes become different from place to place. The... | 04/22/2008 |
| 7354800 | Method of fabricating a stacked integrated circuit package system An integrated circuit package system including providing a base substrate, attaching a base integrated circuit on the base substrate, attaching a core substrate over the base integrated circuit, attaching a substrate electrical connector between the core substrate a... | 04/08/2008 |
| 7355283 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding proc... | 04/08/2008 |
| 7351612 | Method for fabricating quad flat non-leaded package The present invention discloses a method for fabricating a quad flat non-leaded package. A lead frame is disposed on a lower mold equipped with a resilient film. The lead frame includes at least a package unit comprising a chip pedestal and a plurality of pins spati... | 04/01/2008 |
