Did You Know...
...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
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| Number | Title | Issue Date |
| 8153479 | Method of manufacturing semiconductor package A method of manufacturing a semiconductor package comprises: preparing a photosensitive insulating material having a first surface and a second surface opposite to the first surface; bonding a semiconductor chip to the first surface of the photosensitive insulating ... | 04/10/2012 |
| 8148208 | Integrated circuit package system with leaded package and method for manufacturing thereof A method for manufacturing an integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded pac... | 04/03/2012 |
| 8084301 | Resin sheet, circuit device and method of manufacturing the same Provided is a circuit device manufacturing method for coating a bottom surface of a circuit board with a thin coating of sealing resin. In the present invention, a circuit board having a circuit element such as a semiconductor element embedded therein is placed in a... | 12/27/2011 |
| 8067274 | Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method In this manufacturing method of a semiconductor device, a metal plate having a plurality of projection electrodes in each of a plurality of semiconductor device formation areas is prepared. Next, the projection electrodes of each of the semiconductor formation areas... | 11/29/2011 |
| 8048721 | Method for filling multi-layer chip-stacked gaps A method for filling multi-layer chip-stacked gaps is revealed, primarily comprising the steps as below. Firstly, a chip-stacked assembly is provided, comprising a substrate and a plurality of chips vertically stacked on the substrate where at least a first underfil... | 11/01/2011 |
| 8048722 | Manufacturing method of semiconductor device Performing electrolysis plating to a wiring is made possible, aiming at the increasing of pin count of a semiconductor device. Package substrate 3 by which ring shape common wiring 3p for electric supply was formed in the inner area of bonding l... | 11/01/2011 |
| 8030138 | Methods and systems of packaging integrated circuits Panel level methods and systems for packaging integrated circuits are described. In a method aspect of the invention, a substrate formed from a sacrificial semiconductor wafer is provided having a plurality of metallized device areas patterned thereon. Each device a... | 10/04/2011 |
| 8017450 | Method of forming assymetrical encapsulant bead A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die an... | 09/13/2011 |
| 8017449 | Process for fabricating electronic components using liquid injection molding A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mol... | 09/13/2011 |
| 8012809 | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. In... | 09/06/2011 |
| 8008133 | Chip package with channel stiffener frame Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener fr... | 08/30/2011 |
| 7989268 | Small form factor molded memory card and a method thereof A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is locat... | 08/02/2011 |
| 7985631 | Semiconductor assembly with one metal layer after base metal removal A method for packaging an integrated circuit. A barrier metal pattern is disposed on a baseplate. A conductive layer is disposed on the barrier metal pattern. A photoresist having a pattern is applied to the conductive layer. A via is then disposed on the conductive... | 07/26/2011 |
| 7960215 | Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip,... | 06/14/2011 |
| 7943434 | Monolithic molded flexible electronic assemblies without solder and methods for their manufacture A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection ... | 05/17/2011 |
| 7923302 | Method for manufacturing a semiconductor package A semiconductor package includes: a build-up wiring layer including a metal wiring layer and an insulation resin layer; and a low thermal expansion material layer having a coefficient of thermal expansion closer to that of a semiconductor chip mounted on the build-u... | 04/12/2011 |
| 7923303 | Method of resin sealing electronic part A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part... | 04/12/2011 |
| 7871865 | Stress free package and laminate-based isolator package Various methods are described where the semiconductor die and the lead frame (or the BGA or LGA substrate) are spaced apart to reduce stress. In one scenario, an air gap is formed between the semiconductor die and the lead frame by depositing a perimeter (made, for ... | 01/18/2011 |
| 7867828 | Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein A semiconductor device includes a base plate, and a semiconductor constituent body formed on the base plate. The semiconductor constituent body has a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An ... | 01/11/2011 |
| 7863109 | Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing an inner stacking module die; encapsulating the inner stacking module die with an inner stacking module encapsulation to form an inner stacking module, the inner stacking module en... | 01/04/2011 |
| 7851270 | Manufacturing process for a chip package structure A manufacturing process for a chip package structure is provided. First, a patterned conductive layer having a plurality of first openings and a patterned solder resist layer on the patterned conductive layer are provided. A plurality of chips are bonded onto the pa... | 12/14/2010 |
| 7846780 | Flip-chip package covered with tape A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the m... | 12/07/2010 |
| 7803667 | Manufacturing process for a quad flat non-leaded chip package structure A manufacturing process for a Quad Flat Non-leaded (QFN) chip package structure is provided. First, a conductive layer having recesses and a patterned solder resist layer on the conductive layer are provided, wherein the patterned solder resist layer covers the rece... | 09/28/2010 |
| 7803666 | Manufacturing process for a Quad Flat Non-leaded chip package structure A manufacturing process for a Quad Flat Non-leaded (QFN) chip package structure is provided. First, a patterned conductive layer and a patterned solder resist layer on the patterned conductive layer are provided. A plurality of chips are bonded onto the patterned so... | 09/28/2010 |
| 7795079 | Manufacturing process for a quad flat non-leaded chip package structure A manufacturing process for a Quad Flat Non-leaded (QFN) chip package structure is provided. First, a conductive layer having a plurality of recesses and a patterned solder resist layer on the conductive layer are provided, wherein the patterned solder resist layer ... | 09/14/2010 |
| 7790514 | Manufacturing process for a chip package structure A manufacturing process for a chip package structure is provided. First, a patterned conductive layer having a plurality of first openings and a first patterned solder resist layer on the patterned conductive layer are provided. A second patterned solder resist laye... | 09/07/2010 |
| 7767498 | Encapsulated devices and method of making A method of encapsulating an environmentally sensitive device. The method includes providing a substrate; placing at least one environmentally sensitive device adjacent to the substrate; and depositing at least one barrier stack adjacent to the environmentally sensi... | 08/03/2010 |
| 7749815 | Methods for depositing tungsten after surface treatment In one embodiment, a method for forming a tungsten-containing material on a substrate is provided which includes positioning a substrate containing a metal nitride barrier layer within a process chamber and exposing the substrate to a reagent gas containing diborane... | 07/06/2010 |
| 7704800 | Semiconductor assembly with one metal layer after base metal removal A method for packaging an integrated circuit. A barrier metal pattern is disposed on a baseplate. A conductive layer is disposed on the barrier metal pattern. A photoresist having a pattern is applied to the conductive layer. A via is then disposed on the conductive... | 04/27/2010 |
| 7704801 | Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device A resin sealed semiconductor device includes a semiconductor chip having a main surface, a plurality of surface electrodes formed on the main surface of the chip, a plurality of projection electrodes formed the main surface, each projection electrode being connected... | 04/27/2010 |
| 7687320 | Manufacturing method for packaged semiconductor device A semiconductor device in which moisture penetration into the package interior is suppressed, comprising a rewiring layer formed by plating, with improved reliability of electrical characteristics. On the main surface of a semiconductor chip comprising circuit eleme... | 03/30/2010 |
| 7674655 | Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material Semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a method of manufacturing a semiconductor device includes forming a plurality of first side trenches to an intermediate de... | 03/09/2010 |
| 7666716 | Fabrication method of semiconductor package The present invention provides a semiconductor package and a fabrication method thereof. The method includes the steps of: providing a chip carrier module having a plurality of chip carriers, disposing a plurality of electrical connecting points on the chip carriers... | 02/23/2010 |
| 7659151 | Flip chip with interposer, and methods of making same A device is disclosed which includes a die comprising an integrated circuit and an interposer that is coupled to the die, the interposer having a smaller footprint than that of the die. A method is disclosed which includes operatively coupling an interposer to a die... | 02/09/2010 |
| 7645642 | Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite A method of joining a thermoplastic material to a thermoset material, and a resultant thermoplastic-thermoset composite formed from such method are provided. At least one of the thermoplastic material and the thermoset material includes particles that melt when the ... | 01/12/2010 |
| 7638367 | Method of resin sealing electronic part A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part... | 12/29/2009 |
| 7608486 | Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts which are displaceable relative to each other between an encapsulating p... | 10/27/2009 |
| 7601563 | Small form factor molded memory card and a method thereof A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is locat... | 10/13/2009 |
| 7563652 | Method for encapsulating sensor chips A method for encapsulating sensor chips is disclosed. A protective layer is formed on an active surface of a sensor chip, and at least covers a sensor region in the active surface. The active surface of the sensor chip faces to a temporary carrier, so that the prote... | 07/21/2009 |
| 7550322 | Manufacturing method for resin sealed semiconductor device A semiconductor device manufacturing method comprises etching a front side of a conductive board to form plural sets of a die pad portion and bonding areas, each set corresponding to one semiconductor device. Semiconductor chips are mounted on respective ones of the... | 06/23/2009 |
