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| Number | Title | Issue Date |
| 6893903 | Semiconductor device and method for manufacturing the same A semiconductor device (21) can include, e.g., a recessed portion (25) on the reverse surface (224) of an insulating resin (22) which is the mounting surface of the semiconductor device (21). Additionally, on the outer peripheral s... | 05/17/2005 |
| 6893904 | Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed A method for forming packaged substrates, including flip-chip dice individually or in a multi-die wafer. The method includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrat... | 05/17/2005 |
| 6891254 | Semiconductor device with protrusions A sealing process in a manufacturing method for semiconductor devices improves product reliability. A die pad 14 with a semiconductor chip 32 mounted thereon is placed between first and second molding dies 40, 42 such that the die pad 14 ... | 05/10/2005 |
| 6887739 | Method of manufacturing semiconductor package including forming a resin sealing member In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and th... | 05/03/2005 |
| 6887740 | Method for making an integrated circuit package having reduced bow An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, wher... | 05/03/2005 |
| 6884662 | Enhanced adhesion strength between mold resin and polyimide A new method is provided for the interface between a stress relieve interface layer of polyimide and a thereover created layer of mold compound. The invention provides for creating a pattern in the stress relieve layer of polyimide before the layer of mold compound ... | 04/26/2005 |
| 6881613 | Electronic component package An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads i... | 04/19/2005 |
| 6878570 | Thin stacked package and manufacturing method thereof There are disclosed a stacked package formed by stacking semiconductor device packages and a manufacturing method thereof. Each package includes leads and connection terminals. A semiconductor chip is electrically connected to the connection terminals. A package bod... | 04/12/2005 |
| 6875640 | Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed A stereolithographic method of applying material to form a protective layer on a preformed semiconductor die with a high degree of precision, either in the wafer stage, when attached to a lead frame, or to a singulated, bare die. The method is computerized and may u... | 04/05/2005 |
| 6875630 | Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the bas... | 04/05/2005 |
| 6874227 | Method for packaging an image sensor A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chi... | 04/05/2005 |
| 6872593 | Vertical mold die press machine A die mold machine for molding a plurality of semiconductor assemblies on multiple substrate/leadframes includes a plurality of die mold layers stacked vertically one above the other to form a plurality of die mold sections. The top die mold layer has at least one a... | 03/29/2005 |
| 6869811 | Methods for transfer molding encapsulation of a semiconductor die with attached heat sink A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First, the dam prevents damage to the mold. Second, the dam prevents encapsul... | 03/22/2005 |
| 6867066 | Method for production of a semiconductor device with package that includes an insulator frame on a metal member A semiconductor device provided with a shallow metal basin having a flange outwardly extending from the top edge of the side wall of the shallow metal basin, to receive a semiconductor device chip having one or more semiconductor device elements disposed therein and... | 03/15/2005 |
| 6867072 | Flipchip QFN package and method therefor A semiconductor device (10) includes a first leadframe (18) having a perimeter (20) that defines a cavity (22) and leads (14) extending inwardly from the perimeter, and a second leadframe (32) having top and bottom surfaces ... | 03/15/2005 |
| 6867480 | Electromagnetic interference package protection A method of shielding an integrated circuit from electromagnetic interference. The integrated circuit is at least partially encapsulated within an electromagnetic interference resistant molding compound, and then the integrated circuit is completely encapsulated wit... | 03/15/2005 |
| 6861683 | Optoelectronic component using two encapsulating materials and the method of making the same In an optoelectronic component assembly and a method for the production thereof, the optoelectronic component assembly includes an optoelectronic component arranged on a support element, which is surrounded by a closed dam. An encapsulation is arranged in an inner a... | 03/01/2005 |
| 6861294 | Semiconductor devices and methods of making the devices A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film... | 03/01/2005 |
| 6861295 | Low-pin-count chip package and manufacturing method thereof A low-pin-count chip package including a die pad for receiving a semiconductor chip and a plurality of connection pads electrically coupled to the semiconductor chip. The semiconductor chip, the die pad, and the connection pads are encapsulated in a package body suc... | 03/01/2005 |
| 6858473 | Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device A method for manufacturing a semiconductor device includes the steps of: (1) forming a plurality of electrically conductive parts on portions of an adhesive layer of an adhesive sheet, the adhesive sheet having a base layer and the adhesive layer; (2) attaching at l... | 02/22/2005 |
| 6858472 | Method for implementing selected functionality on an integrated circuit device A semiconductor device in a computer system is disclosed that includes a die having an active surface bearing integrated circuitry, the die including a plurality of bond pads thereon at least some of which are connected to the integrated circuitry and having at leas... | 02/22/2005 |
| 6858470 | Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof A method for fabricating semiconductor packages provides a leadframe for packages that are to be singulated with respective predetermined package body sizes. Individual mold caps are formed on the leadframe with mold cap dimensions that are larger than the respectiv... | 02/22/2005 |
| 6856006 | Encapsulation method and leadframe for leadless semiconductor packages An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically connecting th... | 02/15/2005 |
| 6855575 | Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof A method for manufacturing a semiconductor chip package includes: preparing a semiconductor chip having center and edge bonding pads and a substrate, which includes a first window, a second window, connection pads, external terminal pads, and a wiring pattern; attac... | 02/15/2005 |
| 6853089 | Semiconductor device and method of manufacturing the same In the manufacture of a semiconductor device by adopting a block molding method wherein a semiconductor chip is fixed onto a wiring substrate through an adhesive, the occurrence of a defect caused by flowing-out of the adhesive is to be prevented. The semiconductor ... | 02/08/2005 |
| 6852571 | Method of manufacturing stacked semiconductor device Flux is supplied to the surface of each land by a flux supplying apparatus. A solder ball having a predetermined size is supplied onto a land by using a ball supplying apparatus. A memory IC is disposed on a logic IC and each of a plurality of external leads comes i... | 02/08/2005 |
| 6852567 | Method of assembling a semiconductor device package A method of assembling a semiconductor device package includes first attaching a semiconductor device to a die-pad area of a leadframe. Electrical connections are then between electrical contact areas on the semiconductor device and electrical connection areas on th... | 02/08/2005 |
| 6846700 | Method of fabricating microelectronic connections using masses of fusible material A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an... | 01/25/2005 |
| 6841420 | Semiconductor device and method of manufacturing the same The present invention relates to a semiconductor device in which a semiconductor element and a substrate are disposed face-to-face, the mixture of the thermoplastic resin and the thermosetting resin is provided between the semiconductor element having the electrode ... | 01/11/2005 |
| 6841423 | Methods for formation of recessed encapsulated microelectronic devices A method for manufacturing microelectronic device packages. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first surface and a cavity extending through the support member from the first... | 01/11/2005 |
| 6838319 | Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically A method and apparatus for reducing or eliminating the formation of air pockets or voids in a flowable material provided in contact with at least one substrate. The flowable material is provided in a non-horizontal direction and flows from a lower portion to an uppe... | 01/04/2005 |
| 6835604 | Methods for transverse hybrid LOC package A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of inner leads is off-die wire bonded to some of the bond pads, and a secon... | 12/28/2004 |
| 6835600 | Lead frame and method for fabricating resin-encapsulated semiconductor device using the same A lead frame includes: an outer frame section; a plurality of chip mounting sections which are supported by the outer frame section and on which a plurality of semiconductor chips are mounted; lead sections surrounding the chip mounting sections; connecting sections... | 12/28/2004 |
| 6833768 | Surface-mount crystal oscillator A surface-mount crystal oscillator includes a crystal unit housing and an element housing which is provided on the base side of the crystal unit housing. A crystal blank is accommodated and hermetically sealed in the crystal unit housing. A concavity having an open ... | 12/21/2004 |
| 6833610 | Bridge connection type of chip package and fabricating method thereof A chip package having at least a substrate, a chip and a conductive trace is provided. The substrate has a first surface, a second surface, a cavity and at least one substrate contact all positioned on the first surface of the substrate. The chip has an active surfa... | 12/21/2004 |
| 6830961 | Methods for leads under chip in conventional IC package A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantia... | 12/14/2004 |
| 6825572 | Die package Methods and structures for die packages are described. The die package includes an integrated circuit die connected to and elevated above a substrate. In an embodiment, wire bonds connects pads on the die to pads on the substrate. The substrate pads are closely adja... | 11/30/2004 |
| 6821821 | Methods for manufacturing resistors using a sacrificial layer An electrical resistor is made by providing a sacrificial layer and conductive pads disposed on a first surface of the sacrificial layer. An electrically resistive material is deposited over the pads and on the first surface of the sacrificial layer to form at least... | 11/23/2004 |
| 6821815 | Method of assembling a semiconductor chip package A method of encapsulating a microelectronic assembly comprises providing a microelectronic assembly having an element defining exterior surfaces and an array of terminals exposed at the exterior surfaces. The element defines an aperture through the exterior surfaces... | 11/23/2004 |
| 6821823 | Molded substrate stiffener with embedded capacitors A molded stiffener for a package substrate is presented. The stiffener includes a molded portion. The molded portion is molded of an electrically nonconductive molding compound. A plurality of capacitors are embedded in the molded portion. The capacitors are constru... | 11/23/2004 |
