Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 4375008 | Method for encapsulating components with cases and an encapsulation provided by the method Method for encapsulating components in cases, which includes connecting a gold wire to an aluminum surface, subsequently closing the case by welding in a vacuum, and tempering the case in a hydrogen-containing atmosphere and an encapsulation produced by t... | 02/22/1983 |
| 4331253 | Lid assembly for hermetic sealing of a semiconductor chip A lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a flowed solderable layer in t... | 05/25/1982 |
| 4330929 | Process for making an electrical component having a metallic casing with a conformable plastic coating An electrical component which includes a circuit element such as a solid electrolytic capacitor arranged within a metallic casing or can. One electrical lead of the component is connected to the casing; the other lead is connected to the circuit element a... | 05/25/1982 |
| 4250347 | Method of encapsulating microelectronic elements Method for encapsulating microelectronic elements, starting from strip-like material including a number of interconnected conductor patterns each having a number of leads for the microelectronic element to be encapsulated, which comprises applying a micro... | 02/10/1981 |
| 4233620 | Sealing of integrated circuit modules The hermetic seal of the backside of a substrate of an integrated circuit module is provided by a composition containing about 51.4 to about 60.6% by weight of an epoxy polymer; about 39 to about 48% by weight of a hardener and flexibilizing portion; and ... | 11/11/1980 |
| 4183135 | Hermetic glass encapsulation for semiconductor die and method A semiconductor die having bump type contact areas thereon with film strip leads bonded thereto and fired glass encapsulating only the active side of the die and the bump contact areas. The method of encapsulation includes bonding the film strip leads to ... | 01/15/1980 |
| 4177480 | Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads An integrated circuit arrangement comprises a semiconductor body carrying an integrated circuit which is embedded in an insulating material casing together with a plurality of flat strip lines for making electrical connection with the semiconductor body, ... | 12/04/1979 |
| 4173683 | Chemically treating the overcoat of a semiconductor device A method of manufacturing a semiconductor device having a passivating overcoat of insulating material disposed thereover comprises treating the overcoat with a silane solution prior to encapsulating the device.... | 11/06/1979 |
| 4043027 | Process for encapsulating electronic components in plastic A method of making a semiconductor device is disclosed in which a plurality of generally parallel conductors are provided, at least one of which has a mounting portion thereon. A semiconductor wafer is coupled to the mounting portion while means are provi... | 08/23/1977 |
| 4012766 | Semiconductor package and method of manufacture thereof An improved plastic package and method of manufacture thereof for use in packaging integrated circuit semiconductor devices and the like. A transfer molded package having the lead frame disposed therein is formed having an opening therethrough. The device... | 03/15/1977 |
| 3981074 | Method for producing plastic base caps for split cavity type package semi-conductor units A method for producing a completed base cap for a plastic package sealing a semi-conductor therein includes the steps of forming the initial body of a plastic base cap including a centrally located hollow recess on one side thereof, placing lead frames on... | 09/21/1976 |
| 3930306 | Process for attaching a lead member to a semiconductor device A thermally and electrically conductive metal lead member is joined to the refractory metal contact member of a semiconductor device using a brazing alloy comprising on a weight basis about 80-89 percent copper, about 5-15 percent silver, and about 4-6 pe... | 01/06/1976 |
