Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 7572680 | Packaged integrated circuit with enhanced thermal dissipation A semiconductor package (10) uses a plurality of thermal conductors (56-64) that extend upward within an encapsulant (16) from one or more thermal bond pads (22, 24, 26) on a die (14) to disperse heat. The thermal conductors... | 08/11/2009 |
| 7563648 | Semiconductor device package and method for manufacturing same A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the... | 07/21/2009 |
| 7563649 | Chip packaging with metal frame pin grid array A packaging technology for silicon chips is similar to ball grid array packaging technology of the prior art without, however, the use of printed board substrate of the prior art Instead pins are used that are part of a planar frame, the pins folded to a position 90... | 07/21/2009 |
| 7528014 | Semiconductor device and method of manufacturing the same A manufacturing method of a semiconductor device including preparing a lead frame having a die pad, leads arranged around the die pad and a silver plating layer formed over a first portion of each of the leads, mounting a semiconductor chip over a main surface of th... | 05/05/2009 |
| 7510913 | Method of making an encapsulated plasma sensitive device A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processe... | 03/31/2009 |
| 7479412 | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film ... | 01/20/2009 |
| 7479411 | Apparatus and method for forming solder seals for semiconductor flip chip packages An apparatus and method for forming a substantially continuous solder bump around the periphery of each dice on a flip chip wafer is disclosed. The solder bump is provided on each die so that when it is singulated from the wafer and mounted onto a substrate, the sol... | 01/20/2009 |
| 7473585 | Technique for manufacturing an overmolded electronic assembly A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a first side of an integrated circuit (IC) die mounted to a first side... | 01/06/2009 |
| 7468294 | Semiconductor device and a method of manufacturing the same A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder ... | 12/23/2008 |
| 7456053 | Packaging method for segregating die paddles of a leadframe A packaging method for segregating die paddles of a leadframe, includes (a) providing a leadframe having a top surface, a bottom surface and a die paddle region, the die paddle region having a plurality of die paddles, wherein at least two of the die paddles are con... | 11/25/2008 |
| 7445968 | Methods for integrated circuit module packaging and integrated circuit module packages In order to achieve electromagnetic and/or thermal isolation between components in close proximity to each other on a common module substrate, an alternate package and method for manufacturing the package is provided. Inventive methods utilize a grounded, met... | 11/04/2008 |
| 7439099 | Thin ball grid array package An integrated circuit package is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. The substrate further has a cavity therein and a heat slug is fixed to the substrate and spans the cavity.... | 10/21/2008 |
| 7439101 | Resin encapsulation molding method for semiconductor device According to a resin encapsulation molding method for a semiconductor device, a resin-encapsulated substrate having a semiconductor device that is mounted on the substrate and that has a portion exposed is formed. With the method, a device-mounted substrate on which... | 10/21/2008 |
| 7435625 | Semiconductor device with reduced package cross-talk and loss Structure and method are provided for plastic encapsulated semiconductor devices having reduced package cross-talk and loss. Semiconductor die are first coated with a buffer region having a lower dielectric constant ε and/or lower loss tangent δ than the plastic e... | 10/14/2008 |
| 7427523 | Method of making light emitting device with silicon-containing encapsulant A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a pho... | 09/23/2008 |
| 7425469 | Method for encapsulating an electronic component using a foil layer The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer w... | 09/16/2008 |
| 7423342 | Method for assembling semiconductor switching elements and heat sink in rotary electric machine and rotary electric machine A method for assembling semiconductor switching elements and a heat sink in a rotary electric machine includes: a first step in which bare chips of the semiconductor switching elements are bonded to the heat sink using a good heat conductive bonding material; a seco... | 09/09/2008 |
| 7417309 | Circuit device and portable device with symmetrical arrangement To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) att... | 08/26/2008 |
| 7410836 | Method for fabricating a photosensitive semiconductor package A photosensitive semiconductor package, a method for fabricating the same, and a lead frame thereof are proposed. The lead frame has a die pad and a plurality of leads, wherein at least one recessed portion is formed at an end of each lead close to the die pad, and ... | 08/12/2008 |
| 7410830 | Leadless plastic chip carrier and method of fabricating same A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that... | 08/12/2008 |
| 7407832 | Method for manufacturing semiconductor package A die for encapsulating an IC structural body having bonding wires with a molten resin is provided with at least one first half having an ejector-pin-through-hole and at least one second half coupled together to form a cavity therebetween. An ejector pin having a mi... | 08/05/2008 |
| 7405107 | Semiconductor device, method and apparatus for fabricating the same A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said semiconductor device and said radiator, wherein an outer main surface of the ... | 07/29/2008 |
| 7402458 | Stress relieved flat frame for DMD window An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic ... | 07/22/2008 |
| 7391119 | Temperature sustaining flip chip assembly process A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during f... | 06/24/2008 |
| 7384805 | Transfer mold semiconductor packaging processes In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of open... | 06/10/2008 |
| 7378300 | Integrated circuit package system An integrated circuit package system is provided including forming a leadframe structure having a encapsulant space provided predominantly inside the leadframe structure and attaching a die to the leadframe structure in the encapsulant space inside the leadframe str... | 05/27/2008 |
| 7378299 | Leadless semiconductor package and manufacturing method thereof A leadless semiconductor package mainly includes a semiconductor device securely attached to an upper surface of a die pad by solder paste and a plurality of leads arranged about the periphery of the die pad. The thickness of the leads and the die pad are within a r... | 05/27/2008 |
| 7378301 | Method for molding a small form factor digital memory card A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash ... | 05/27/2008 |
| 7371610 | Process for fabricating an integrated circuit package with reduced mold warping A process for fabricating an integrated circuit package includes mounting a semiconductor die on a first surface of a metal carrier and forming electrical connections between the semiconductor die and ones of a plurality of contacts on the metal carrier. Next, using... | 05/13/2008 |
| 7372133 | Microelectronic package having a stiffening element and method of making same A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact l... | 05/13/2008 |
| 7371606 | Manufacturing method of a semiconductor device The yield of a sealing process for a semiconductor device which adopts a flip-chip mounting method is to be improved. In a molding process wherein plural semiconductor chip ICs mounted on a parts mounting surface of a substrate matrix through bump electrodes are to ... | 05/13/2008 |
| 7371617 | Method for fabricating semiconductor package with heat sink A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip car... | 05/13/2008 |
| 7368324 | Method of manufacturing self-supporting contacting structures A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently ... | 05/06/2008 |
| 7368326 | Methods and apparatus to reduce growth formations on plated conductive leads A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal... | 05/06/2008 |
| 7368810 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 05/06/2008 |
| 7364948 | Method for fabricating semiconductor package A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bo... | 04/29/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7361995 | Molded high density electronic packaging structure for high performance applications A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the f... | 04/22/2008 |
| 7356782 | Voltage reference signal circuit layout inside multi-layered substrate A multi-layered substrate has a voltage reference signal circuit layout therein. A major change in the design of the multi-layered substrate is the moving of a reference signal trace from a signal layer to a non-signaling layer. Once the reference signal trace is mo... | 04/08/2008 |
| 7351611 | Method of making the mould for encapsulating a leadframe package A mould for encapsulating an integrated circuit package on a leadframe including a top mould-half and a complementary bottom mould-half enclosing a cavity for encapsulating said package wherein structures are provided on at least one of said mould-halves which, upon... | 04/01/2008 |
