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| Number | Title | Issue Date |
| 6759307 | Method to prevent die attach adhesive contamination in stacked chips The present invention provides methods and apparatus related to preventing adhesive contamination of the electrical contacts of a semiconductor device in a stacked semiconductor device package. The methods and apparatus include providing a first semiconductor device... | 07/06/2004 |
| 6759271 | Flip chip type semiconductor device and method of manufacturing the same A flip chip type semiconductor device is provided with a semiconductor chip with a plurality of pad electrodes on one surface. A solder electrode is connected to each pad electrode and a metallic post is connected to each solder electrode. The surface of the semicon... | 07/06/2004 |
| 6753594 | Electronic component with a semiconductor chip and fabrication method The invention relates to an electronic component with a semiconductor chip and a rewiring plate including a bond channel for bond connections between contact surfaces of the semiconductor chip and contact terminal pads on the rewiring plate. The contact surfaces ext... | 06/22/2004 |
| 6750082 | Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip A method of assembling a package having an exposed die comprising the following steps. A die attached to a substrate by connectors is provided. The die having a backside. Encapsulate is formed around the die and over the backside of the die to form an encapsulated p... | 06/15/2004 |
| 6747342 | Flip-chip packaging A semiconductor die mounted between an X-lead frame and a support structure without bonding wires or straps. A power enhancement mode junction field effect transistor (JFET) die having a top surface defining a drain, and a bottom surface having a first metalized reg... | 06/08/2004 |
| 6743663 | Method for producing a hybrid frame or hybrid housing and corresponding hybrid frame or hybrid housing The invention relates to a method for producing a hybrid frame (1) or hybrid housing. According to said method, a leadframe (3) with soldering and/or bonding tags (3a), made from a plated strip, is placed into an injection mould and mould... | 06/01/2004 |
| 6744118 | Frame for semiconductor package A frame for a semiconductor package includes plural lead frames arranged through grid-leads in a matrix. Semiconductor devices are mounted on individual lead frames of the frame, and are molded with molding compound. Thereafter, the molded semiconductor devices are ... | 06/01/2004 |
| 6743664 | Flip-chip on flex for high performance packaging applications A method is provided including attaching an encapsulant to an integrated circuit (IC), forming a substrate from at least one layer of dielectric, attaching at least one electrical contact to the substrate, attaching a first surface of the substrate to the encapsulan... | 06/01/2004 |
| 6734045 | Lossy RF shield for integrated circuits A low-cost EMI shield that fits around an integrated circuit package to absorb electromagnetic energy and dissipate it as heat. The shield is not ohmically conductive so it may contact electrically active conductors without affecting the operation of the circuit. EM... | 05/11/2004 |
| 6734550 | In-situ cap and method of fabricating same for an integrated circuit device An in-situ cap for an integrated circuit device such as a micromachined device and a method of making such a cap by fabricating an integrated circuit element on a substrate; forming a support layer over the integrated circuit element and forming a cap structure in t... | 05/11/2004 |
| 6730544 | Stackable semiconductor package and method for manufacturing same A stackable semiconductor package having a lead frame, a plurality of electrical paths, and a sealing material. The leadframe has a plurality of leads, each one of the plurality of leads having a top portion exposed to a top surface of the semiconductor package and ... | 05/04/2004 |
| 6730539 | Method of manufacturing semiconductor device package A method of manufacturing a semiconductor device package includes forming a patterned photoresist film with windows for exposing a plurality of connection bump areas on a conductive substrate, forming metal plating layers on the connection bumps area using the photo... | 05/04/2004 |
| 6730546 | Molded component and method of producing the same A molded component is produced by inserting an electronic component between lead frames disposed at two respective ends, and then molding the electronic component with resin. At least a lead frame disposed on one of the two ends serves as an electrode terminal expos... | 05/04/2004 |
| 6723656 | Method and apparatus for etching a semiconductor die A method and apparatus for etching a semiconductor die are disclosed whereby flowing an etchant material across an inactive thereof thins the semiconductor die. In one embodiment, the etchant includes a mixture of nitric acid, hydrofluoric acid, and acetic acid and ... | 04/20/2004 |
| 6724072 | Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby ... | 04/20/2004 |
| 6720208 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” o... | 04/13/2004 |
| 6716677 | Microwave monolithic integrated circuit package A microwave monolithic integrated circuit (MMIC) package includes a MMIC and a base plate that is matched as to its coefficient of thermal expansion (CTE) with the MMIC. A solder preform is contained on the base plate. The MMIC is mounted on the solder preform. A ch... | 04/06/2004 |
| 6716673 | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip ... | 04/06/2004 |
| 6713882 | Resin sealing apparatus and resin sealing method The resin sealing apparatus includes a mold that has a main cavity into which a portion of a semiconductor device to be sealed with a resin is disposed. Furthermore, an external-shape regulating member is detachably accommodated in the main cavity of the mold to for... | 03/30/2004 |
| 6713850 | Tape carrier package structure with dummy pads and dummy leads for package reinforcement An improved tape carrier package (TCP) structure is proposed, which is characterized in the provision of dummy pads and dummy leads to help reinforce the package construction. The dummy pads are provided on the corners of the semiconductor chip, while the dummy lead... | 03/30/2004 |
| 6713321 | Super low profile package with high efficiency of heat dissipation A super low profile package with high efficiency of heat dissipation comprises the substrate, the heat sink, the die, the wires and the plastic mold. The heat sink adheres to the ground ring by the extending part of the heat sink, and the first surface of the die ad... | 03/30/2004 |
| 6709897 | Method of forming IC package having upward-facing chip cavity A method of forming an integrated circuit package with an upward-facing chip cavity such that the fabrication of the substrate and the packaging of silicon chip are combined. By forming a patterned dielectric layer to expose bonding pads on a silicon chip and subseq... | 03/23/2004 |
| 6709895 | Packaged microelectronic elements with enhanced thermal conduction A semiconductor chip is mounted in face-up disposition on a dielectric element, with thermally conductive but flexible elements disposed between the chip bottom surface and the top surface of the dielectric element so as to provide a compliant but thermally conducti... | 03/23/2004 |
| 6706563 | Heat spreader interconnect methodology for thermally enhanced PBGA packages A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an ... | 03/16/2004 |
| 6706560 | Method of forming heat sink and semiconductor chip assemblies Methods for applying a heat sink to a semiconductor chip. A heat sink frame is removably attached to one or more heat sinks and is used to align the heat sinks with corresponding semiconductor chips. The semiconductor chips are preferably positioned on a semiconduct... | 03/16/2004 |
| 6706558 | Manufacturing method of semiconductor device A plurality of posts 12 having electrical conductivity are formed on a side of a plate member 11. A buffer layer 14 is formed on the side of the plate member 11 so that top ends of the posts 12 are protruded from the buffer layer | 03/16/2004 |
| 6706553 | Dispensing process for fabrication of microelectronic packages A microelectronic package including at least one microelectronic die disposed within an opening in a microelectronic package core, wherein a liquid encapsulation material is injected with a dispensing needle within portions of the opening not occupied by the microel... | 03/16/2004 |
| 6706547 | Method of manufacturing a circuit device with trenches in a conductive foil After conductive patterns are formed on the conductive foil every block by employing isolation trenches, conductive plating layers are arranged selectively on the conductive patterns. Therefore, it is possible to accomplish the circuit device manufacturing method by... | 03/16/2004 |
| 6703260 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes A leadframe including offsets extending from a major plane thereof. The offsets extend from the major plane at a non-perpendicular angle thereto. Preferably, the angle of extension, relative to the major plane, is about 45 degrees or less. The offsets may... | 03/09/2004 |
| 6703261 | Semiconductor device and manufacturing the same A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive. The semiconductor device comprises a heat sink, a pair of screwing pieces having respective inner end portions connected to both ends of the heat sink ... | 03/09/2004 |
| 6703262 | Method for planarizing circuit board and method for manufacturing semiconductor device A method for planarizing a circuit board, has a step of fixing a circuit board having wiring layers on both sides to a board having a flat surface through an adhesive layer, wherein said circuit board is pressed from above by a flat member on fixing there... | 03/09/2004 |
| 6699731 | Substrate of semiconductor package A fabricating method for a semiconductor package is proposed, in which a chip carrier accommodates at least one semiconductor chip, which is attached with an interface layer formed on a covering module plate consisting of at least one covering plate, whil... | 03/02/2004 |
| 6692991 | Resin-encapsulated semiconductor device and method for manufacturing the same The resin-encapsulated semiconductor device of the present invention includes: a die pad provided by thinning a lower portion of a lead frame; a semiconductor chip mounted on the die pad; a plurality of leads provided by thinning an upper portion of the l... | 02/17/2004 |
| 6692989 | Plastic molded type semiconductor device and fabrication process thereof A process is provided for the fabrication of a plastic molded type semiconductor device in which a die pad is formed to have a smaller area than a semiconductor chip to be mounted on a principal surface of the die pad and the semiconductor chip and die pa... | 02/17/2004 |
| 6689636 | Semiconductor device and fabrication method of the same A semiconductor device and a fabrication method of the same are proposed, in which at least one electronic component is firstly mounted on a first substrate, and then the first substrate is attached onto a semiconductor chip or a second substrate. Further... | 02/10/2004 |
| 6689642 | Semiconductor device and manufacturing method thereof Recently, there have been increasing demands for the reduction in size and weight of mobile computing/communication terminals as well as the elongation of the use time of the internal batteries. This invention alters the assembling structure of power MOSF... | 02/10/2004 |
| 6689640 | Chip scale pin array An integrated circuit package with lead fingers with a footprint on the order of the integrated circuit footprint is provided. A lead frame may be made from a metal sheet, which may be stamped or etched. The lead frame provides a plurality of posts and a ... | 02/10/2004 |
| 6689638 | Substrate-on-chip packaging process A SOC (Substrate-On-Chip) packaging process is disclosed. A layer of two-stage thermosetting mixture with solvent is coating on an upside of a substrate. Thereafter, the substrate is heated for removing solvent so that the two-stage thermosetting mixture ... | 02/10/2004 |
| 6684496 | Method of making an integrated circuit package A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to ... | 02/03/2004 |
| 6682957 | Semiconductor substrate and land grid array semiconductor package using same and fabrication methods thereof A land grid array (LGA) type semiconductor chip package includes an insulation body having a plurality of first conductive interconnections embedded therein. A cavity is formed in an upper portion of the insulation body. A plurality of first conductive in... | 01/27/2004 |
