Quotables
"The horse is here to stay, the automobile is only a novelty - fad."
President of Michigan Savings Bank ; 1903
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 4451973 | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a ... | 06/05/1984 |
| 4396457 | Method of making bumped-beam tape Mechanically punching bumps in a thin copper or aluminum foil and etching the foil to form beams with a bump at the end of each beam. Alternatively increasing the layers by casting or gluing polyimide film to the foil and etching the polyimide film in des... | 08/02/1983 |
| 4380775 | Semiconductor unit with connecting wires To reduce failure and breakage of connecting wires connecting specific zones on semiconductor chips to semiconductor frames, the connecting wires are made of an aluminum-copper alloy having, by weight, 3 to 5%, preferably 4% copper, the remainder aluminum... | 04/19/1983 |
| 4355463 | Process for hermetically encapsulating semiconductor devices A tape assembly process attaches semiconductor chips to a tape via thermocompression gang bonding and the tape is wound onto a reel. The tape is fabricated during its manufacture to have a plurality of spaced finger array patterns. The inner finger ends a... | 10/26/1982 |
| 4331740 | Gang bonding interconnect tape process and structure for semiconductor device automatic assembly A continuous tape is employed in the automatic assembly of semiconductor devices. The tape contains a sequential series of patterns, each one comprising a plurality of metal fingers. Each pattern includes fingers having an inward extension that terminates... | 05/25/1982 |
| 4330790 | Tape operated semiconductor device packaging A semiconductor device is bonded to a contact finger pattern which is located in a continuous tape. A metal package cup is fabricated from metal stock so as to have a flat rim portion around its periphery. A plastic insulating sheet is punched so that it ... | 05/18/1982 |
| 4298883 | Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet With a packaged semiconductor device of this invention, an IC pellet or chip supported on a mounting unit is encapsulated in plastics material, for example, epoxy resin or silicone resin. A plurality of lead strips are disposed at one end in the proximity... | 11/03/1981 |
| 4298769 | Hermetic plastic dual-in-line package for a semiconductor integrated circuit A hermetic plastic package for a semiconductor integrated circuit chip includes a chip carrier provided with a plurality of conducting fingers that terminate at its underside. The carrier includes a pedestal onto which a semiconductor chip is bonded and w... | 11/03/1981 |
| 4283839 | Method of bonding semiconductor devices to carrier tapes A carrier tape (20) is provided for assembling components to make semiconductor devices. The tape (20) is made from soft, copper foil (21) and eliminates a plastic substrate (12) of the prior art. Patterns (27) containing clusters (24) of inner leads (28)... | 08/18/1981 |
| 4280132 | Multi-lead frame member with means for limiting mold spread Blocking members are provided for limiting mold spread over a desirable area while a semiconductor is molded. The blocking members are composed within a metallic layer together with metallic leads by photoetching techniques. The blocking members are posit... | 07/21/1981 |
| 4258381 | Lead frame for a semiconductor device suitable for mass production A semiconductor chip lead frame may have universal application for mounting any of many different chip sizes. More particularly, an island for supporting the chip has a plurality of recesses at its peripheral side portions, opposed to the intervals betwee... | 03/24/1981 |
| 4246697 | Method of manufacturing RF power semiconductor package High frequency power transistor carriers are made by bonding a metalized ceramic base to a lead frame strip, subsequently gold plating the resultant structure and then cutting the lead frame strip to isolate the base and collector leads while still mainta... | 01/27/1981 |
| 4237607 | Method of assembling semiconductor integrated circuit A method of assembling a semiconductor integrated circuit in which a semiconductor integrated circuit chip with bumps is bonded to a flexible film circuit substrate. The assembling method of the invention comprises a step of making the highest layer of th... | 12/09/1980 |
| 4215360 | Power semiconductor device assembly having a lead frame with interlock members A power semiconductor device package is made using a subassembly of a die mount substrate and a lead frame. The subassembly is interlocked in a manner that permits relative movement without losing alignment. A method is described in which the lead frame i... | 07/29/1980 |
| 4189085 | Method of assembling a microcircuit with face-mounted leads A method of assembling a packaged microcircuit with face-mounted leads includes forming a lead frame into a holder with opposed sets of leads turned upward and angular to spaced apart carrier strips, and securing a substrate having a microcircuit thereon ... | 02/19/1980 |
| 4183135 | Hermetic glass encapsulation for semiconductor die and method A semiconductor die having bump type contact areas thereon with film strip leads bonded thereto and fired glass encapsulating only the active side of the die and the bump contact areas. The method of encapsulation includes bonding the film strip leads to ... | 01/15/1980 |
| 4177480 | Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads An integrated circuit arrangement comprises a semiconductor body carrying an integrated circuit which is embedded in an insulating material casing together with a plurality of flat strip lines for making electrical connection with the semiconductor body, ... | 12/04/1979 |
| 4157611 | Packaging structure for semiconductor IC chip and method of packaging the same A packaging structure for a semiconductor IC chip, in which lead electrodes connected with the chip are extended out through a binding agent filled in a sealing gap, characterized in that in the vicinity of the lead electrodes the outer surface of the bin... | 06/12/1979 |
| 4151638 | Hermetic glass encapsulation for semiconductor die and method a semiconductor die having bump type contact areas thereon with film strip leads bonded thereto and fired glass encapsulating only the active side of the die and the bump contact areas. The method of encapsulation includes bonding the film strip leads to ... | 05/01/1979 |
| 4109373 | Method for manufacturing semiconductor devices Disclosed is a method for fabricating semiconductor devices and apparatus that can be used in the practice thereof. A plurality of sets of lead wires is mounted on a reusable primary lead frame. While the lead frame, and thus the lead wires are supported,... | 08/29/1978 |
| 4100675 | Novel method and apparatus for hermetic encapsulation for integrated circuits and the like The base assembly of a dual in-line encapsulation package (DIP) is provided with a mounting surface such that the upper ends of the package pins are flat and are flush with the flat upper surface of the base enabling one-stage bonding of the integrated ci... | 07/18/1978 |
| 4065851 | Method of making metallic support carrier for semiconductor elements To improve the bonding layer for connecting wires to semiconductor chips with contact fingers, or contact strips, on a substrate carrier, the bonding layer is formed as spongy, microporous structure, applied to discrete positions of the contact strips by ... | 01/03/1978 |
| 4045863 | Method of producing metallic carrier system for a multi-electrode semiconductor strip Method of producing a metallic carrier system mounting, making conductive contact with a semi-conductor member through relatively thin tongue-like inner feed lines made from a different metal than the metal of the carrier. The inner feed lines are made fr... | 09/06/1977 |
| 4017963 | Semiconductor assembly and method Semiconductor assembly and method in which very small pill-like packages can be mounted directly on boards and can be directly mounted in assemblies and stacks. The pill-like package encapsulates a semiconductor body having at least a portion of an electr... | 04/19/1977 |
| 4012766 | Semiconductor package and method of manufacture thereof An improved plastic package and method of manufacture thereof for use in packaging integrated circuit semiconductor devices and the like. A transfer molded package having the lead frame disposed therein is formed having an opening therethrough. The device... | 03/15/1977 |
| 3978578 | Method for packaging semiconductor devices An improved method of packaging semiconductor devices and dice which comprises coating a semiconductor wafer with a polyimide film, etching selected areas of the polyimide film from the surface of the wafer, separating the wafer into a plurality of semico... | 09/07/1976 |
| 3959874 | Method of forming an integrated circuit assembly A method of forming an integrated circuit assembly is disclosed. The method comprises selectively treating a surface of a carrier to delineate a pattern thereon capable of receiving a metal deposit. The pattern is contacted with a conductive lead of an in... | 06/01/1976 |
| 3952403 | Shell eyelet axial lead header for planar contact semiconductive device A shell eyelet axial lead header for a planar contact semiconductive device is disclosed wherein a series of bonding pads are first formed as part of a lead frame. The bonding pads are in a planar configuration, are supported by small breakable tabs from ... | 04/27/1976 |
| 3942245 | Related to the manufacture of lead frames and the mounting of semiconductor devices thereon A support for a semiconductor device comprises a lead frame having a matrix of cranked conductors, which may be on an insulating substrate, with a recess being defined within the lead frame, the arrangement being such that by merely placing a correctly or... | 03/09/1976 |
| 3932685 | Aluminum stabilization process and stabilization solution therefor A process for the stabilization of an aluminum part, such as a semiconductor lead frame, which includes the step of coating said aluminum part with an alcohol solution containing boron, phosphorous and a metal selected from the group consisting of gold, p... | 01/13/1976 |
