Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 7176582 | Semiconductor device and method of manufacturing same In an example embodiment, the semiconductor device comprises a carrier and a semiconductor element, such as an integrated circuit. The carrier is provided with apertures, thereby defining connecting conductors having side faces. Notches are present in the side faces... | 02/13/2007 |
| 7176566 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 02/13/2007 |
| 7176062 | Lead-frame method and assembly for interconnecting circuits within a circuit module A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-b... | 02/13/2007 |
| 7176043 | Microelectronic packages and methods therefor A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexib... | 02/13/2007 |
| 7176060 | Integrated circuit card and a method of manufacturing the same A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed ... | 02/13/2007 |
| 7171744 | Substrate frame A substrate frame includes an insulative board (10a) having a pair of ear portions (13) extending along its longitudinal edges; a plurality of wiring substrate regions (11) arranged on the insulative board (10a) between the ... | 02/06/2007 |
| 7173321 | Semiconductor package having multiple row of leads Provided is a method of producing a semiconductor package including at least two rows of leads in which the leads of each row separately connecting a semiconductor chip to an external substrate. The method includes: forming a lead frame, the lead frame including a d... | 02/06/2007 |
| 7173951 | Semiconductor laser device with light receiving element A semiconductor laser device includes a package having a front surface, a rear surface and an outer peripheral surface; a semiconductor laser element and a light receiving element provided on the front surface; a plurality of leads arranged in spaced relation on the... | 02/06/2007 |
| 7170161 | In-process semiconductor packages with leadframe grid arrays Methods of forming a semiconductor assembly are described which include a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as solder, may be disposed or form... | 01/30/2007 |
| 7170168 | Flip-chip semiconductor package with lead frame and method for fabricating the same A flip-chip semiconductor package with a lead frame and a method for fabricating the same are provided. The lead frame has a plurality of leads, each lead having an upper surface, a lower surface, and an inner end directed toward the center of the lead frame. A rece... | 01/30/2007 |
| 7170151 | Accurate alignment of an LED assembly An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and ar... | 01/30/2007 |
| 7169651 | Process and lead frame for making leadless semiconductor packages A process for making a plurality of leadless packages is disclosed. Firstly, chips are attached onto a lead frame with a first metal layer formed thereon. After a wire bonding step and an encapsulating step are conducted, a portion of each lead of the lead frame is ... | 01/30/2007 |
| 7169685 | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive A method for balancing layer-caused compressive or tensile stress in a semiconductor die, die wafer or similar substrate uses a stress-balancing layer (SBL) attached to the opposite side from the stress-causing layer before the die or wafer is significantly warped a... | 01/30/2007 |
| 7170150 | Lead frame for semiconductor package A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting board are a plurality of elongate slots or apertures. The ground ring is... | 01/30/2007 |
| 7166918 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 01/23/2007 |
| 7166186 | Laser decapsulation apparatus and method A decapsulation apparatus 100 has a laser 8 that removes plastic encapsulant from a device 24. Chamber 20 is sealed. Exhaust port 9 removes debris and fumes. The device 24 is positioned and scanned using an X,Y table 2. A hi... | 01/23/2007 |
| 7163839 | Multi-chip module and method of manufacture A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first semiconductor chip. The second semiconductor chip has a smaller dimension t... | 01/16/2007 |
| 7160760 | Semiconductor device and a method of manufacturing the same A semiconductor device and method having high output and having reduced external resistance is reduced and improved radiating performance. A MOSFET (70) has a connecting portion for electrically connecting a surface electrode of a semiconductor pellet and a p... | 01/09/2007 |
| 7160759 | Semiconductor device and method of manufacturing the same As a means for promoting the increase of the number of pins in a QFN (Quad Non-leaded package), a semiconductor die mounted on a die pad is arranged at the center of a plastic package, and a plurality of leads made of the same metal as the die pad and die pad suppor... | 01/09/2007 |
| 7160121 | Stressed metal contact with enhanced lateral compliance An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region o... | 01/09/2007 |
| 7161370 | Semiconductor testing device A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the sp... | 01/09/2007 |
| 7157791 | Semiconductor chip assembly with press-fit ground plane A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, and a ground plane. The pillar is press-fit into an opening in the ground plane, and the ground plane is electri... | 01/02/2007 |
| 7157790 | Single die stitch bonding An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least ... | 01/02/2007 |
| 7157308 | Circuit substrates, semiconductor devices, semiconductor manufacturing apparatus methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices A method is provided to control the height of bump electrodes and increase a clearance between edge sections of a semiconductor chip and lead terminals of a tape substrate. By applying suction to a tape substrate through a suction groove, boundary portions of a semi... | 01/02/2007 |
| 7157312 | Surface mount package and method for forming multi-chip microsensor device A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and readouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured... | 01/02/2007 |
| 7153753 | Strained Si/SiGe/SOI islands and processes of making same A process of making a strained silicon-on-insulator structure is disclosed. A recess is formed in a substrate to laterally isolate an active area. An undercutting etch forms a bubble recess under the active area to partially vertically isolate the active area. A the... | 12/26/2006 |
| 7152311 | Enhancements in framed sheet processing A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from ... | 12/26/2006 |
| 7153724 | Method of fabricating no-lead package for semiconductor die with half-etched leadframe A series of grooves are etched in a leadframe to be used in fabricating a group of semiconductor packages at locations where the leadframe will later be sawed to separate the semiconductor packages. In variations of the process, the grooves may be wider or narrower ... | 12/26/2006 |
| 7151036 | Precision high-frequency capacitor formed on semiconductor substrate A precision high-frequency capacitor includes a dielectric layer formed on the front side surface of a semiconductor substrate and a first electrode on top of the dielectric layer. The semiconductor substrate is heavily doped and therefore has a low resistivity. A s... | 12/19/2006 |
| 7148080 | Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package A method for joining lead frames in a chip stack package or a package stack, a chip stack package, and a method of forming a chip stack package. A joining mediator is formed on joining portions of at least one lead frame. The joining mediator has an anti-oxidation p... | 12/12/2006 |
| 7148086 | Semiconductor package with controlled solder bump wetting and fabrication method therefor A semiconductor package and a method of manufacturing a semiconductor package include a substrate having a plurality of lead fingers. A plurality of stud bumps is attached to the plurality of lead fingers. A die having a plurality solder bumps is provided. The plura... | 12/12/2006 |
| 7148085 | Gold spot plated leadframes for semiconductor devices and method of fabrication A leadframe for use with integrated circuit chips comprising a plated layer of gold selectively covering areas of said leadframe intended for solder attachment; and said gold layer providing a visual distinction to said areas. ... | 12/12/2006 |
| 7148082 | Method of making a semiconductor chip assembly with a press-fit ground plane A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, then electrically connecting a conductive trace that includes a pillar and a routing line to the pad, and then press-fitting the pillar into an o... | 12/12/2006 |
| 7148078 | Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities An integrated circuit package includes an angled one-piece substrate having a light source fixed to one area and a sensor die fixed to a second area, such that the light source is directed to illuminate the field of view of the sensor die when a surface of interest ... | 12/12/2006 |
| 7144754 | Device having resin package and method of producing the same A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect... | 12/05/2006 |
| 7144800 | Multichip packages with exposed dice Multichip packages and methods for making same. The present invention generally allows for either the back of a flipchip, the back of a mother die, or both to be exposed in a multichip package. When the mother die is connected to the package contacts, the back of th... | 12/05/2006 |
| 7144517 | Manufacturing method for leadframe and for semiconductor package using the leadframe In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer, the primary leadframe including a die paddle and a plurality of leads ... | 12/05/2006 |
| 7144538 | Method for making a direct chip attach device and structure A method for forming a direct chip attach device (1) includes attaching an electronic chip (3) to a lead frame structure (2), which includes a flag (18). Next, conductive studs (22) are attached to bond pads (13) on electron... | 12/05/2006 |
| 7144755 | Fabrication method of semiconductor integrated circuit device At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavit... | 12/05/2006 |
| 7141782 | Image sensor with protective package structure for sensing area An image sensor with a protective package structure for the sensing area is provided. The image sensor includes a transparent substrate and a semiconductor image-sensing chip. A conductive interconnection circuit is formed on at least the lower surface of the transp... | 11/28/2006 |
