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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 8178394 | Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof A method for manufacturing an integrated circuit package system includes: providing a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an i... | 05/15/2012 |
| 8178395 | Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base i... | 05/15/2012 |
| 8163603 | Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an apertur... | 04/24/2012 |
| 8153477 | Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first post extends from the dielectric base in a first vertical direction in... | 04/10/2012 |
| 8148207 | Method of making a semiconductor chip assembly with a post/base/cap heat spreader A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aper... | 04/03/2012 |
| 8129224 | Stud bumps as local heat sinks during transient power operations A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plur... | 03/06/2012 |
| 8129223 | Nanotube modified solder thermal intermediate structure, systems, and methods An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder. ... | 03/06/2012 |
| 8110446 | Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aper... | 02/07/2012 |
| 8110445 | High power ceramic on copper package According to an embodiment of a high power package, the package includes a copper heat sink, a ceramic lead frame and a semiconductor chip. The copper heat sink has a thermal conductivity of at least 350 W/mK. The ceramic lead frame is attached to the copper heat si... | 02/07/2012 |
| 8067270 | Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an apertur... | 11/29/2011 |
| 8067269 | Method for fabricating at least one transistor A method for fabricating transistors such as high electron mobility transistors, each transistor comprising a plurality of epitaxial layers on a common substrate, method comprising: (a) forming a plurality of source contacts on a first surface of the plurality of ep... | 11/29/2011 |
| 8062933 | Method for fabricating heat dissipating package structure A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; an encapsulant formed on the chip carrier and for encapsulating the chip, with a non-active surface of the chip being exposed f... | 11/22/2011 |
| 8053284 | Method and package for circuit chip packaging A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substra... | 11/08/2011 |
| 8039316 | Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the sub... | 10/18/2011 |
| 8021927 | Die down ball grid array packages and method for making same A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the hea... | 09/20/2011 |
| 8012808 | Integrated micro-channels for 3D through silicon architectures Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures. ... | 09/06/2011 |
| 8008131 | Semiconductor chip package assembly method and apparatus for countering leadfinger deformation The invention provides semiconductor chip packages, tools, and methods for preventing and for correcting leadfinger deformation caused during wirebonding in semiconductor chip package manufacturing. Disclosed are improved heat blocks and methods for their use in ens... | 08/30/2011 |
| 8008130 | Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from ... | 08/30/2011 |
| 7993978 | Method of manufacturing a semiconductor device and molding die A method of manufacturing a semiconductor device capable of obtaining high joining force between a heat spreader and resin is provided. The method of manufacturing a semiconductor device according to the present invention includes: setting a heat spreader 60 ... | 08/09/2011 |
| 7985627 | Thermal intermediate apparatus, systems, and methods Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat ... | 07/26/2011 |
| 7981728 | Coreless substrate A coreless substrate having a plurality of function pads, etched from a metal sheet and having a protruded shape; an insulating layer, the insulating layer being formed on one side of the function pads, a circuit corresponding to a pattern being formed on the insula... | 07/19/2011 |
| 7955900 | Coated thermal interface in integrated circuit die Some embodiments of the invention include a coated thermal interface to bond a die with a heat spreader. The coated thermal interface may be used to bond the die with the heat spreader without flux. Other embodiments are described and claimed. ... | 06/07/2011 |
| 7951650 | Thermal management of electronic devices Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The ... | 05/31/2011 |
| 7943430 | Semiconductor device with heat sink and method for manufacturing the same A semiconductor device and a method for manufacturing the same are described. The semiconductor device comprises: a heat sink having at least one opening passing through the heat sink; at least one semiconductor chip disposed in the opening, wherein the semiconducto... | 05/17/2011 |
| 7932132 | Semiconductor device and method of manufacturing the same A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes: a casing, a board and a semiconductor chip. The chip includes: an element part; a heat sink bonded to the element part; an insulating layer located on the... | 04/26/2011 |
| 7906376 | Magnetic particle-based composite materials for semiconductor packages A semiconductor package is described. The semiconductor package includes a substrate and an integrated heat spreader disposed above and coupled with the substrate. A cavity is disposed between the substrate and the integrated heat spreader. A semiconductor die is di... | 03/15/2011 |
| 7897437 | Thermal interconnect systems methods of production and uses thereof Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated ... | 03/01/2011 |
| 7888184 | Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary c... | 02/15/2011 |
| 7888183 | Thinned die integrated circuit package A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die... | 02/15/2011 |
| 7879652 | Semiconductor module A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a s... | 02/01/2011 |
| 7871862 | Ball grid array package stacking system A ball grid array package stacking system includes: forming a heat spreader having a centrally located access port; mounting a substrate in the heat spreader for providing a connection pad in the centrally located access port; coupling an integrated circuit die to t... | 01/18/2011 |
| 7871861 | Stacked integrated circuit package system with intra-stack encapsulation A stacked integrated circuit package system includes: mounting a first integrated circuit over a first carrier; mounting a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack int... | 01/18/2011 |
| 7851268 | Integrated circuit package system using heat slug An integrated circuit package system includes providing a substrate having an integrated circuit die thereon. A support is provided on the substrate. A heat slug having a tie bar is positioned by the tie bar on the support. The substrate and the integrated circuit d... | 12/14/2010 |
| 7846778 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly. ... | 12/07/2010 |
| 7842554 | VLSI hot-spot minimization using nanotubes The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot ... | 11/30/2010 |
| 7842553 | Cooling micro-channels The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or micro-trenches, and a technique for fabricating the same. ... | 11/30/2010 |
| 7833839 | Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature Various methods and apparatus for establishing a thermal pathway for a semiconductor device are disclosed. In one aspect, a method of manufacturing is provided that includes placing a gel-type thermal interface material in a preselected pattern on a semiconductor ch... | 11/16/2010 |
| 7833838 | Method and apparatus for increasing the immunity of new generation microprocessors from ESD events A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy material is provided on the substrate upon which the microprocessor i... | 11/16/2010 |
| 7829388 | Integrated circuit package and fabricating method thereof The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A pl... | 11/09/2010 |
| 7820488 | Microelectronic devices and methods A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When ... | 10/26/2010 |
