Did You Know...
...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.
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| Number | Title | Issue Date |
| 8187923 | Laser release process for very thin Si-carrier build A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided. ... | 05/29/2012 |
| 8183093 | Method of manufacturing a semiconductor device by lamination A wiring circuit layer 2 having at least a wiring part and an insulating part, whose top and bottom surfaces (20A, 20B) is adhesive surfaces, is formed on a metal support substrate 1 in a way such that the layer 2 can be peeled fro... | 05/22/2012 |
| 8173490 | Fabrication of electronic devices including flexible electrical circuits A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductor... | 05/08/2012 |
| 8163602 | Ultraviolet energy curable tape and method of making a semiconductor chip using the tape There is provided a UV energy curable tape comprising an adhesive material including a UV energy curable oligomer, a UV energy initiator, and a material which emits optical light when the tape composition is substantially fully cured. A semiconductor chip made using... | 04/24/2012 |
| 8158459 | Substrate bonding method and semiconductor device (a) A first Sn absorption layer (5) is formed on the principal surface of a first substrate (1), the first Sn absorption layer being made of metal absorbing Sn from AuSn alloy and lowering a relative proportion of Sn in the AuSn alloy. (b) A second Sn ... | 04/17/2012 |
| 8148205 | Method of electrically connecting a microelectronic component A method of making a microelectronic connection component is disclosed. A plurality of portions of a conductive, etch-resistant material is provided on a surface of a metallic sheet. The sheet is etched from the surface to form posts extending generally parallel to ... | 04/03/2012 |
| 8148204 | Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure A circuit connection structure that exhibits excellent adhesiveness between a heat resistant resin film and a circuit adhesive member, even under high temperature and high humidity, is provided by introducing a chemically stable functional group into the heat resist... | 04/03/2012 |
| 8143106 | Thermosetting die-bonding film The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and ... | 03/27/2012 |
| 8138025 | Microcap wafer bonding method and apparatus A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabric... | 03/20/2012 |
| 8138024 | Package system for shielding semiconductor dies from electromagnetic interference A method of manufacturing a package system includes: providing a semiconductor die with a contact pad and a ground pad, mounting the semiconductor die on a package substrate using and adhesive layer, forming a vertical conductive structure on top of the ground pad i... | 03/20/2012 |
| 8129222 | High density chip scale leadframe package and method of manufacturing the package An integrated circuit package having a die pad with a first face and a second face, a plurality of inner leads, and a plurality of sides between the first face and the second face. The plurality of inner leads is disposed substantially co-planer with and substantial... | 03/06/2012 |
| 8124457 | Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element A wiring circuit layer 2 having a connecting conductor part 21 that can be connected to an electrode 31 of a semiconductor element 3 is formed on a metal support substrate 1 in a way such that the wiring circuit layer can be separa... | 02/28/2012 |
| 8124458 | Method for packaging semiconductor dies having through-silicon vias An integrated circuit structure is provided. The integrated circuit structure includes a die and an anisotropic conducing film (ACF) adjoining the back surface of the die. The die includes a front surface; a back surface on an opposite side of the die than the front... | 02/28/2012 |
| 8119454 | Manufacturing fan-out wafer level packaging Fan-out wafer level packaging includes an integrated circuit having a top surface, a bottom surface and a bond pad defined on the top surface, and a substrate having a cavity. An adhesive layer is positioned between a top surface of the cavity and the bottom surface... | 02/21/2012 |
| 8119455 | Wafer level package fabrication method A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t... | 02/21/2012 |
| 8114712 | Method for fabricating a semiconductor device package A method of fabricating a semiconductor device package is provided. The method includes providing a laminate comprising a dielectric film disposed on a first metal layer, said laminate having a dielectric film outer surface and a first metal layer outer surface; for... | 02/14/2012 |
| 8114710 | Manufacturing method of resin-sealed semiconductor device The radiation performance of a resin sealed semiconductor package is enhanced and further the fabrication yield thereof is enhanced. A drain terminal coupled to the back surface drain electrode of a semiconductor chip is exposed at the back surface of an encapsulati... | 02/14/2012 |
| 8114711 | Method of electrically connecting a microelectronic component A method of treating a component can include providing a component including a plurality of metallic posts extending generally parallel to one another. The providing step can be performed so that the posts have solder on the tips of the posts but not covering other ... | 02/14/2012 |
| 8110444 | Prepreg, method for manufacturing prepreg, substrate, and semiconductor device A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second re... | 02/07/2012 |
| 8105880 | Method for attaching a semiconductor die to a leadframe, and a semiconductor device Methods are disclosed related to attaching a die to a leadframe. One such method includes initially bonding a carrier pad which is pre-coated with a thermosetting first adhesive to the leadframe. The first adhesive can be raised to its thermosetting cure temperature... | 01/31/2012 |
| 8093104 | Multi-chip stacking method to reduce voids between stacked chips A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disp... | 01/10/2012 |
| 8093105 | Method of fabricating a capillary-flow underfill compositions An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer ... | 01/10/2012 |
| 8076182 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in... | 12/13/2011 |
| 8058106 | MEMS device package with vacuum cavity by two-step solder reflow method In a method of vacuum packaging a MEMS device, at least one MEMS device is attached on a substrate. A solder preform is printed on the substrate at the perimeter surrounding the substrate. A lid is attached to the solder preform wherein the lid provides a cavity enc... | 11/15/2011 |
| 8053282 | Mounting structure of component of lighting device and method thereof Disclosed is a structure for mounting a component to a lighting device, including at least one lighting-device base, at least one metal film, and a lighting array chip. The lighting-device base has a surface to which a first layer of metal bonding agent is applied. ... | 11/08/2011 |
| 8053281 | Method of forming a wafer level package A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielect... | 11/08/2011 |
| 8053283 | Die level integrated interconnect decal manufacturing method and apparatus A die level integrated interconnect decal manufacturing method and apparatus for implementing the method. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal methods forming an... | 11/08/2011 |
| 8034664 | Method of fabricating passive device applied to the three-dimensional package module Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrat... | 10/11/2011 |
| 8017444 | Adhesive sheet, semiconductor device, and process for producing semiconductor device An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture ... | 09/13/2011 |
| 7985626 | Manufacturing tool for wafer level package and method of placing dies A manufacturing method of placing dice for a wafer level package comprises placing a plurality of dice on an elastic material, which is formed on a first base, and the elastic material of the present invention has viscosity in a first condition to adhere the plurali... | 07/26/2011 |
| 7960214 | Chip package A fabricating process of chip package structure is provided. First, a first substrate having a plurality of first bonding pads and a second substrate having a plurality of second bonding pads are provide, wherein a plurality of bumps are formed on the first bonding ... | 06/14/2011 |
| 7947532 | Power semiconductor device and method for its production A power semiconductor device and a method for its production. The power semiconductor device has at least one power semiconductor chip, which has on its top side and on its back side large-area electrodes. The electrodes are electrically in connection with external ... | 05/24/2011 |
| 7943427 | Semiconductor device, substrate for producing semiconductor device and method of producing them A substrate B for use in production of a semiconductor device is used, which substrate includes an adhesive sheet 50 having a base layer 51 and an adhesive layer 52, and a plurality of independently provided electrically conductive portions 2... | 05/17/2011 |
| 7943428 | Bonded semiconductor substrate including a cooling mechanism A bonded substrate comprising two semiconductor substrates is provided. Each semiconductor substrate includes semiconductor devices. At least one through substrate via is provided between the two semiconductor substrates to provide a signal path therebetween. The bo... | 05/17/2011 |
| 7939375 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in... | 05/10/2011 |
| 7939376 | Patterned die attach and packaging method using the same A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches... | 05/10/2011 |
| 7932131 | Reduction of package height in a stacked die configuration A method and structure for reducing the size of semiconductor package is disclosed. In one example embodiment, a method for stacking dies of a semiconductor package includes forming a set of insulated bonding wires between respective bonding pads of a first semicond... | 04/26/2011 |
| 7919359 | Semiconductor mounting substrate and method for manufacturing the same A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semi... | 04/05/2011 |
| 7910405 | Semiconductor device having adhesion increasing film to prevent peeling A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is... | 03/22/2011 |
| 7906373 | Thermally enhanced electrically insulative adhesive paste Adhesive paste of polymer resin, fugitive liquid and particulate filler with round edges provides improved performance characteristics. ... | 03/15/2011 |
