Did You Know...
...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Number | Title | Issue Date |
| 8187922 | Low cost flexible substrate A low cost flexible substrate is described which comprises a thin metal foil and a layer of solder mask. The metal foil layer is patterned to create tracks and lands for solder bonding and/or wirebonding and the layer of solder mask is patterned to create openings f... | 05/29/2012 |
| 8133762 | Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core A semiconductor device is made by providing a sacrificial substrate and depositing an adhesive layer over the sacrificial substrate. A first conductive layer is formed over the adhesive layer. A polymer pillar is formed over the first conductive layer. A second cond... | 03/13/2012 |
| 8124456 | Methods for securing semiconductor devices using elongated fasteners Semiconductor device assemblies include elements such as electronic components and substrates secured together by a fastener that includes an elongated portion extending continuously through an aperture in two or more such elements. Computer systems include such sem... | 02/28/2012 |
| 8071430 | Stress buffer layer for ferroelectric random access memory An F-RAM package having a semiconductor die containing F-RAM circuitry, a mold compound, and a stress buffer layer that is at least partially located between the semiconductor die and the mold compound. Also, a method for making an F-RAM package that includes provid... | 12/06/2011 |
| 7879649 | Programmable capacitor associated with an input/output pad The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface... | 02/01/2011 |
| 7871859 | Vertical surface mount assembly and methods A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. Preferab... | 01/18/2011 |
| 7598124 | System and method to increase die stand-off height In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a first face of a die and a second face of a substrate, the substrate ... | 10/06/2009 |
| 7563645 | Electronic package having a folded package substrate An electronic package of the kind having a folded substrate is provided. The substrate is configured so that a stress concentration is created where folding is desired. In the present example, the stress concentration is created with first a resilient metal ground l... | 07/21/2009 |
| 7550317 | Method for manufacture of wafer level package with air pads A structure for improving electrical performance and interconnection reliability of an integrated circuit in a Wafer Level Packaging (WLP) application comprises an air pad located under an interconnection metal solder pad. Using a low dielectric material such as air... | 06/23/2009 |
| 7541219 | Integrated metallic contact probe storage device A mass storage device includes a probe that has a cantilever having a first end region operatively connected to a substrate and a second end region rotated in a direction such that the second end region is opposed to the first end region. A tip is disposed on the se... | 06/02/2009 |
| 7524700 | Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device A method for manufacturing a semiconductor device includes forming an electrode; forming a projection projecting with respect to the electrode by melting a resin; and providing a conductive layer electrically connected to the electrode. The conductive layer is exten... | 04/28/2009 |
| 7443026 | IC chip package having force-adjustable member between stiffener and printed circuit board An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an undersid... | 10/28/2008 |
| 7425467 | Web process interconnect in electronic assemblies Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relat... | 09/16/2008 |
| 7402182 | High-power LGA socket A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion ... | 07/22/2008 |
| 7400514 | Non-rigid conductor link measurement sensor and method for the production thereof The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell per se is mounted in a package that furthermore comprises a printed ... | 07/15/2008 |
| 7382042 | COF flexible printed wiring board and method of producing the wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, and which exhibits no drop in bonding strength during panel bonding carried out after mounting of semiconductor chips, whereby reliabilit... | 06/03/2008 |
| 7371676 | Method for fabricating semiconductor components with through wire interconnects A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a c... | 05/13/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7361985 | Thermally enhanced molded package for semiconductors An integrated circuit package (50) is provided which comprises a substrate (20), an integrated circuit (12) mounted on the substrate, and a compressive, thermally conductive interposer (52) mounted on the integrated circuit. ... | 04/22/2008 |
| 7352585 | Flip chip heat sink package and method An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first... | 04/01/2008 |
| 7351612 | Method for fabricating quad flat non-leaded package The present invention discloses a method for fabricating a quad flat non-leaded package. A lead frame is disposed on a lower mold equipped with a resilient film. The lead frame includes at least a package unit comprising a chip pedestal and a plurality of pins spati... | 04/01/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7336499 | Flexible printed wiring board An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist wh... | 02/26/2008 |
| 7330038 | Interleaved MEMS-based probes for testing integrated circuits In one embodiment, a probe card includes a substrate and a plurality of probes. Each of the probes may have a supported portion and an unsupported portion that meet at a base. The unsupported portion may have a non-uniform (e.g. triangular) cross-section along a len... | 02/12/2008 |
| 7321783 | Mobile entertainment and communication device A mobile entertainment and communication device in a palm-held size housing has a cellular or satellite telephone capable of wireless communication with the Internet and one or more replaceable memory card sockets for receiving a blank memory card for recording data... | 01/22/2008 |
| 7311451 | Method of manufacturing optical communication module, and optimum mold and lead frame for use in the manufacturing method A method of manufacturing an optical communication module, and a mold and a lead frame that are suitable for the method are provided. The method comprises the steps of: placing in a mold the lead frame on which a ferrule and an optical communication facility section... | 12/25/2007 |
| 7304849 | Compliant thermal cap for an electronic device A cooling structure for an electronic device comprises a compliant cap preloaded over the electronic device. The compliant cap comprises a horizontal top surface and at least one vertical support for the surface, the vertical support comprising a compliant portion a... | 12/04/2007 |
| 7294929 | Solder ball pad structure An interconnect structure a substrate, a contact pad disposed over a surface of the substrate, and an insulative mask disposed over the contact pad. The insulative mask can include an opening that is aligned over and exposes an inner portion of the contact pad. The ... | 11/13/2007 |
| 7291910 | Semiconductor chip assemblies, methods of making same and components for same Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensa... | 11/06/2007 |
| 7288432 | Electronic devices with small functional elements supported on a carrier Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relat... | 10/30/2007 |
| 7285492 | Method for processing substrate A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes... | 10/23/2007 |
| 7282932 | Compliant contact pin assembly, card system and methods thereof A compliant contact pin assembly, a contactor card, a testing system and methods for making and testing are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within ... | 10/16/2007 |
| 7279391 | Integrated inductors and compliant interconnects for semiconductor packaging Some embodiments of the present invention include integrated inductors and compliant interconnects for semiconductor packaging. ... | 10/09/2007 |
| 7278857 | Brittle fracture resistant spring A spring contact has a post-release outer upper surface in compression and a post-release outer lower surface in compression. A compressive lower layer of spring material may be formed at a thickness that is three-eighths or less of a tensile upper layer of spring m... | 10/09/2007 |
| 7279363 | Vertically stacked semiconductor device A semiconductor device including a vertical assembly of semiconductor chips interconnected on a substrate with one or more metal standoffs providing a fixed space between each supporting chip and a next successive vertically stacked chip is described. The device is ... | 10/09/2007 |
| 7273812 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 09/25/2007 |
| 7271497 | Dual metal stud bumping for flip chip applications A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed t... | 09/18/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7264999 | Semiconductor device with interlocking clip A semiconductor device is provided having a single-piece clip that interlocks into a lead frame using one or more forks on the clip that mate with one or more corresponding slots in the lead frame. A semiconductor die is mounted to a pad of the lead frame and the cl... | 09/04/2007 |
