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| Number | Title | Issue Date |
| 8324027 | Semiconductor device and method for manufacturing the same It is an object to manufacture and provide a highly reliable display device including a thin film transistor with a high aperture ratio which has stable electric characteristics. In a manufacturing method of a semiconductor device having a thin film transistor in wh... | 12/04/2012 |
| 8232142 | Self-aligned silicon carrier for optical device supporting wafer scale methods Disclosed is a carrier assembly for and a method of manufacturing an optical device. The method comprises providing a silicon substrate; attaching a number of optical dies on the silicon substrate to form an optical device carrier assembly; providing a corresponding... | 07/31/2012 |
| 8017443 | Light transmissive cover, device provided with same and methods for manufacturing them A light transmissive cover for a device comprising: a cover member of light transmissive material; and a junction member joined to the cover member, the junction member being a member used to be joined to the body of the device and having a light interrupting film o... | 09/13/2011 |
| 8003442 | Integrated cirucit package and method for fabrication thereof The invention provides an integrated circuit package and method of fabrication thereof. The integrated circuit package comprises an integrated circuit chip having a photosensitive device thereon; a bonding pad formed on an upper surface of the integrated circuit chi... | 08/23/2011 |
| 7993977 | Method of forming molded standoff structures on integrated circuit devices A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a substantially rectangular sheet of transparent material and, after forming the standoff structures, singulating ... | 08/09/2011 |
| 7947531 | Combinatorial evaluation of dry semiconductor processes Combinatorial evaluation of dry semiconductor processes is described, including rotating a mask comprising a plurality of apertures, wherein the mask is positioned between a dry semiconductor processing source and the substrate, and performing a dry semiconductor pr... | 05/24/2011 |
| 7906372 | Lens support and wirebond protector A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond p... | 03/15/2011 |
| 7863105 | Image sensor package and forming method of the same An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed ... | 01/04/2011 |
| 7858446 | Sensor-type semiconductor package and fabrication method thereof A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein... | 12/28/2010 |
| 7811861 | Image sensing device and packaging method thereof An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the lig... | 10/12/2010 |
| 7763499 | CMOS front end process compatible low stress light shield An improved imaging device having a pixel arrangement featuring a multilayer light shield. The multilayer light shield includes stacked layers of light-shielding and light-transparent material. The light-transparent material, such as a dielectric, is selected to hav... | 07/27/2010 |
| 7713787 | Mounted body and method for manufacturing the same A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a)... | 05/11/2010 |
| 7655507 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individua... | 02/02/2010 |
| 7632714 | Method for manufacturing a display device There is provided a method for manufacturing a display device. The method includes the steps of: forming a bottom electrode for supplying a first charge, in individual pixels on a substrate; forming a pattern of a first light-emitting layer having a first-charge tra... | 12/15/2009 |
| 7632713 | Methods of packaging microelectronic imaging devices Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, the microelectronic imaging devices include an interposer substrate and a plurality of imager units coupled to the interposer substrate.... | 12/15/2009 |
| 7625780 | Fluidic heterogeneous microsystems assembly and packaging Self-assembly of components carried in a fluid is provided. A first component and a second component are obtained and self-assembled together. A third component is obtained and assembled with the first and second components, following the step of assembling the firs... | 12/01/2009 |
| 7572676 | Packaging structure and method of an image sensor module This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active a... | 08/11/2009 |
| 7566588 | Semiconductor device with a resin-sealed optical semiconductor element To provide a semiconductor device 10, which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10A has a configuration such that in semiconductor device 10A, wherein an optical semiconductor elem... | 07/28/2009 |
| 7563644 | Optical device and method for fabricating the same An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an in... | 07/21/2009 |
| 7468293 | Method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing In a method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing, the object of the invention is to achieve an improved hermetic sealing between window and housing through... | 12/23/2008 |
| 7443017 | Package having bond-sealed underbump A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a stand... | 10/28/2008 |
| 7427527 | Method for aligning devices A method is provided for aligning parts such as MEMS devices and photonics devices. One approach involves: providing between first and second parts a bonding material having fluid and solid states; applying a control field in the region of the bonding material, the ... | 09/23/2008 |
| 7419854 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 09/02/2008 |
| 7410816 | Method for forming a chamber in an electronic device and device formed thereby A method is disclosed for forming a chamber in an electronic device, including the steps of preparing an outer surface on a solidified core material, the solidified core material in a depression formed in a substrate. The method further includes establishing a layer... | 08/12/2008 |
| 7405100 | Packaging of a semiconductor device with a non-opaque cover Packages of semiconductor devices with non-opaque covers and methods for making the packages. The invention allows an encapsulant to be used with a non-opaque cover. By ensuring the cover is attached to a die in such a way as to expose bonding pads while sealing in ... | 07/29/2008 |
| 7402453 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individua... | 07/22/2008 |
| 7390687 | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex an... | 06/24/2008 |
| 7387902 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 06/17/2008 |
| 7371652 | Alignment using fiducial features The present invention relates to positioning components of an assembly using fiducial features. A first fiducial feature on a first piece of the assembly can be located. A first component can be positioned on the first piece of the assembly based on the location of ... | 05/13/2008 |
| 7361531 | Methods and apparatus for Flip-Chip-On-Lead semiconductor package Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabri... | 04/22/2008 |
| 7358119 | Thin array plastic package without die attach pad and process for fabricating the same A process for fabricating an integrated circuit package. Metal is plated up on a substrate to provide a plurality of contact pads and a plurality of fiducial markings on a periphery of the contacts. A transparent mask is selectively deposited on the substrate, over ... | 04/15/2008 |
| 7338823 | Side-emitting LED package and manufacturing method of the same The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also i... | 03/04/2008 |
| 7334919 | LED device and the manufacturing method thereof Disclosed are a LED device and the manufacturing method thereof, the device comprises a LED, which is composed of a LED chip and bonded wires, both connected to a plurality of lead frames and enveloped by a lamp cap, wherein one end of the lead frames emerges from t... | 02/26/2008 |
| 7312106 | Method for encapsulating a chip having a sensitive surface Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to k... | 12/25/2007 |
| 7304362 | Molded integrated circuit package with exposed active area An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may co... | 12/04/2007 |
| 7300816 | Method of sensor packaging The present invention is directed to a method of making flexible interconnect packaging, in particular, packaging for fingerprint sensor chips. The chip is mounted on a flexible substrate having conductive traces leading to a connector at an end of the substrate. Wi... | 11/27/2007 |
| 7291518 | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths and a sensing portion ... | 11/06/2007 |
| 7288831 | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip ... | 10/30/2007 |
| 7285445 | Direct cooling of LEDs A thermal management system is provided for semiconductor devices such as an LED array, wherein coolant directly cools the LED array. Preferably, the coolant may be selected, among other bases, based on its index of refraction relative to the index associated with t... | 10/23/2007 |
| 7282393 | Microelectromechanical device packages with integral heaters A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between w... | 10/16/2007 |
