Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 8062931 | Surface treatment and passivation of AlGaN/GaN HEMT In the preferred embodiments, a method to reduce gate leakage and dispersion of group III-nitride field effect devices covered with a thin in-situ SiN layer is provided. This can be obtained by introducing a second passivation layer on top of the in-situ SiN-layer, ... | 11/22/2011 |
| 7985625 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main surface of a semiconductor wafer; arranging a plurality of second electro... | 07/26/2011 |
| 7901991 | Method for manufacturing photovoltaic panels by the use of a polymeric tri-layer comprising a composite getter system The present invention relates to a method for manufacturing thin-film photovoltaic panels by the use of a sealing means composed by a polymeric tie layer comprising getter system composed of a polymer with low H2O transmission having dispersed in its insi... | 03/08/2011 |
| 7833834 | Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is e... | 11/16/2010 |
| 7811860 | Method for producing a device and device A method for producing a device and a device is disclosed. In one embodiment, a component is surrounded by a material. A fluoropolymer-containing compound is produced at a surface of the material. A molding is produced from a material and a fluoropolymer-containing ... | 10/12/2010 |
| 7749811 | Tin phosphate barrier film, method, and apparatus A method is disclosed for inhibiting oxygen and moisture penetration of a device comprising the steps of depositing a tin phosphate low liquidus temperature (LLT) inorganic material on at least a portion of the device to create a deposited tin phosphate LLT material... | 07/06/2010 |
| 7741157 | System and method for direct bonding of substrates A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient ... | 06/22/2010 |
| 7713786 | Etching/bonding chamber for encapsulated devices and method of use A method for activating a getter at low temperature for encapsulation in a device cavity containing a microdevice comprises etching a passivation layer off the getter material while the device wafer and lid wafer are enclosed in a bonding chamber. A plasma etching p... | 05/11/2010 |
| 7651890 | Method and apparatus for prevention of solder corrosion Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a fi... | 01/26/2010 |
| 7572675 | Mold flash removal process for electronic devices A method is provided for removing excess encapsulation material from unmolded surfaces of a molded substrate including semiconductor packages by utilizing an acid solution. The method comprises the steps of mounting the substrate to a holding device with the unmolde... | 08/11/2009 |
| 7534658 | Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices The specification teaches a technique for manufacturing microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In an embodiment, a process for manufac... | 05/19/2009 |
| 7534657 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main surface of a semiconductor wafer; arranging a plurality of second electro... | 05/19/2009 |
| 7449366 | Wafer level packaging cap and fabrication method thereof A wafer level packaging cap for covering a device wafer with a device thereon and a fabrication method thereof are provided. The method includes operations of forming a plurality of connection grooves on a wafer, forming a seed layer on the connection grooves, formi... | 11/11/2008 |
| 7442577 | Method of fabricating a patterned device using sacrificial spacer layer The present invention is a method of fabricating a patterned device using a sacrificial spacer layer. The first step in this process is to select an appropriate substrate and form a step thereon. The sacrificial layer is then applied to the substrate and a blocking ... | 10/28/2008 |
| 7416918 | Direct build-up layer on an encapsulated die package having a moisture barrier structure A packaging technology that fabricates a microelectronic package including build-up layers, having conductive traces, on an encapsulated microelectronic die and on other packaging material that surrounds the microelectronic die, wherein an moisture barrier structure... | 08/26/2008 |
| 7393716 | Encapsulated organic semiconductor device and method A semiconductor device comprising organic semiconductor material (14) has one or more barrier layers (16) disposed at least partially thereabout to protect the organic semiconductor material (14) from environment-driven changes that typically le... | 07/01/2008 |
| 7387912 | Packaging of electronic chips with air-bridge structures A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structur... | 06/17/2008 |
| 7387928 | Device and method for making air, gas or vacuum capacitors and other microwave components A device and method for making a capacitor and other high frequency and/or microwave components. In particular, an air dielectric capacitor has a first electrode and a second electrode that are spaced apart, planar and each of a different size or area. The first ele... | 06/17/2008 |
| 7377961 | Hydrogen vent for optoelectronic packages with resistive thermal device (RTD) Thermally tuned lasers may use a resistive thermal device (RTD), sensitive to hydrogen, within a hermetic enclosure. Over time, hydrogen trapped within the enclosure or out gassed from other components within the enclosure may degrade the accuracy of the RTD. A vent... | 05/27/2008 |
| 7374974 | Thyristor-based device with trench dielectric material A thyristor-based semiconductor device includes a thyristor body that has at least one region in the substrate and a thyristor control port in a trenched region of the device substrate. According to an example embodiment of the present invention, the trench is at le... | 05/20/2008 |
| 7371614 | Image sensor device and methods thereof An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The adhesive layer may be removed so as to expose the protective layer. The pro... | 05/13/2008 |
| 7371603 | Method of fabricating light emitting diode package The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate ... | 05/13/2008 |
| 7371992 | Method for non-contact cleaning of a surface A flame torch can be used to clean the surface of a contact-sensitive object, such as a glass optic, extremely thin workpiece, or semiconductor wafer by providing a reactive precursor gas to the feed gases of the torch. Reactive atom plasma processing can be used to... | 05/13/2008 |
| 7332430 | Method for improving the mechanical properties of BOC module arrangements The invention relates to a method for improving the mechanical properties of BOC module arrangements in which chips have 3D structures, solder balls, μ springs or soft bumps which are mechanically and electrically connected by means of solder connections to termina... | 02/19/2008 |
| 7326594 | Connecting a plurality of bond pads and/or inner leads with a single bond wire An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least tw... | 02/05/2008 |
| 7315069 | Integrated multi-purpose getter for radio-frequency (RF) circuit modules An integrated getter structure and a method for its formation and installation in a circuit module enclosure (24). The integrated structure includes a hydrogen getter structure (10) and selected quantities of a material (20) that is formulated t... | 01/01/2008 |
| 7312135 | Laser processing apparatus The present invention provides a laser processing apparatus having a laser oscillator for outputting a pulsed laser beam; deflection unit for deflecting the pulsed laser beam to irradiate a object to be processed with the deflected pulsed laser beam; a mounting base... | 12/25/2007 |
| 7303943 | Method of manufacturing electric device In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80° C. to 100° C. Thereafter, an IC is mounted on the film substrate. ... | 12/04/2007 |
| 7301227 | Package lid or heat spreader for microprocessor packages A package for an integrated circuit (IC) die comprises a substrate and a lid. The substrate has an upper surface facing an interior of the package and a lower surface facing an exterior of the package. The upper surface of the substrate carries an IC die and provide... | 11/27/2007 |
| 7291791 | Resin substrate A substrate is made of resin or a composite material. Pins with Au plating on their surface are soldered, with a soldering material made of Sn and Sb, to a substrate body having a first main surface, and formed into substantially a rectangular shape to project over ... | 11/06/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7279362 | Semiconductor wafer coat layers and methods therefor Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer... | 10/09/2007 |
| 7264998 | Method of removing unnecessary matter from semiconductor wafer, and apparatus using the same In an unnecessary matter removal method of joining a separation tape onto a semiconductor wafer and, then, separating the separation tape from the semiconductor wafer, thereby separating an unnecessary matter on the semiconductor wafer together with the separation t... | 09/04/2007 |
| 7253027 | Method of manufacturing hybrid integrated circuit device A method of manufacturing a hybrid integrated circuit device includes the steps of forming a plurality of units each including a conductive pattern on a surface of a board made of metal, forming grooves along boundaries of the respective units of the board, electric... | 08/07/2007 |
| 7250324 | Method for manufacturing an image sensor A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer on the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive ... | 07/31/2007 |
| 7237334 | Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate A method of providing a printed circuit board, a printed circuit board formed according to the method, and a system comprising the printed circuit board. The method comprises: providing a microelectronic substrate; providing a via-defining substrate by providing via... | 07/03/2007 |
| 7235427 | Method for treating substrates for microelectronics and substrates obtained by said method An embodiment of a multilayer wafer according to the invention includes a base substrate, a first layer associated with the base substrate, and a second layer on the first layer on side opposite from the base substrate in an axial direction and having a lateral edge... | 06/26/2007 |
| 7229850 | Method of making assemblies having stacked semiconductor chips A method of manufacturing a plurality of semiconductor chip packages and the resulting chip package assemblies. The method includes providing a circuitized substrate having terminals and leads. A first microelectronic element is arranged with the substrate and conta... | 06/12/2007 |
| 7226860 | Method and apparatus for fabricating metal layer A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemica... | 06/05/2007 |
| 7205179 | Hydrogen diffusion hybrid port and method of making A hydrogen diffusion port for use in a packaged electronic device. In one embodiment, the hydrogen window is characterized by a substantial absence of plating from the external surfaces of the cover the base. The hydrogen diffusion port is selected from the group of... | 04/17/2007 |
