Bizarre Patents
Process For Propelling Foodstuffs or the Like into a Crowd
A method of launching foodstuffs into a crowd for promotional and entertainment purposes.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8110443 | Semiconductor device and method of fabricating semiconductor device A method of fabricating a semiconductor device from a semiconductor wafer, having external connecting terminals on one side of the semiconductor wafer and a cover layer on another side of the semiconductor wafer, includes forming a groove with a first width from the... | 02/07/2012 |
| 8110442 | Method of manufacturing semiconductor device A method of manufacturing a thin TFT over a flexible substrate is provided. In formation of a TFT on a surface of a substrate having heat resistance, a liquid repellent film is formed selectively on a surface of the substrate, and an organic film is formed thereover... | 02/07/2012 |
| 8105879 | Near chip scale package integration process Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first poly... | 01/31/2012 |
| 8105878 | Manufacturing method of a semiconductor device having a package dicing A thermosetting tape is adopted as a dicing tape and, after package dicing, the thermosetting tape is heated, then a desired one of divided CSPs is picked up by an inverting collet. Since the thermosetting tape is heated o a predetermined temperature so that its adh... | 01/31/2012 |
| 8097494 | Method of making an integrated circuit package with shielding via ring structure Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated... | 01/17/2012 |
| 8084300 | RF shielding for a singulated laminate semiconductor device package A method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substra... | 12/27/2011 |
| 8053280 | Method of producing multiple semiconductor devices A method for producing multiple semiconductor devices. An electrically conductive layer is applied onto a semiconductor wafer. The semiconductor wafer is structured to produce multiple semiconductor chips. The electrically conductive layer is structured to produce m... | 11/08/2011 |
| 8012807 | Method for producing chip packages, and chip package produced in this way A method for producing chip packages is disclosed. In one embodiment, a plurality of chips is provided. The chips each have first pads. Second connection pads are applied on the wafer, wherein each second pad is electrically connected to a first pad. ... | 09/06/2011 |
| 7985624 | Method of manufacturing semiconductor device having plural dicing steps Provided is a method of manufacturing a semiconductor device including: arranging multiple dies planarly between a first lead frame plate and a second lead frame plate, which face each other, to connect the multiple semiconductor chips to each of the first lead fram... | 07/26/2011 |
| 7927922 | Dice rearrangement package structure using layout process to form a compliant configuration A dice rearrangement package structure is provided, which a dice having an active surface and a bottom surface, and a plurality of pads is disposed on the active surface; a package body is provided to cover the dices and the plurality of pads being exposed; one ends... | 04/19/2011 |
| 7923298 | Imager die package and methods of packaging an imager die on a temporary carrier Methods for fabricating an imager die package and resulting die packages are disclosed. An imager die packaging process may include dicing through a fabrication substrate comprising a plurality of imager die. Thereafter, known good die (KGD) qualified from the image... | 04/12/2011 |
| 7888180 | Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same A semiconductor apparatus includes a semiconductor device having electrodes on its opposed frontside and backside, respectively, a first external electrode connected to the electrode at the frontside, the first external electrode having a first major surface general... | 02/15/2011 |
| 7863104 | Method of producing a thin semiconductor chip A method of fabricating a semiconductor chip includes the providing an adhesive layer on the outer area of the active surface of a device wafer and attaching a rigid body to the active surface by the adhesive layer. The device wafer is thinned by treating the passiv... | 01/04/2011 |
| 7851265 | Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings cou... | 12/14/2010 |
| 7846776 | Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods are disclosed herein. One embodiment, for example, is directed to a method for processing a microfeature workpiece releasably a... | 12/07/2010 |
| 7824965 | Near chip scale package integration process Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first poly... | 11/02/2010 |
| 7811859 | Method of reducing memory card edge roughness by edge coating A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts thr... | 10/12/2010 |
| 7807508 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material expose... | 10/05/2010 |
| 7772038 | CMOS process for fabrication of ultra small or non standard size or shape semiconductor die A method for the singulation of integrated circuit die, the method including: etching a semiconductor layer disposed on a silicon oxide dielectric layer, thereby forming a trench defining a boundary of the die; depositing a silicon nitride layer in the trench; coati... | 08/10/2010 |
| 7772037 | Method for producing a multilayer system on a carrier, in particular in an electrochromic element A method for producing a multilayer system on a substrate, wherein a first and a second layer are applied on the substrate, in each case by means of a vacuum coating process, provides adherence of the layers on each other, even if at least one of the layers of the m... | 08/10/2010 |
| 7749810 | Method of packaging a microchip having a footprint that is larger than that of the integrated circuit A method of packaging an integrated circuit singulates a wafer to form an integrated circuit, positions the integrated circuit on a carrier, and passivates the integrated circuit after the positioning the integrated circuit on the carrier. At this point, the integra... | 07/06/2010 |
| 7709295 | Method of manufacturing semiconductor device In a method of manufacturing a semiconductor device, a passivation film made of a polyimide resin film is formed on a front surface of a semiconductor wafer including a scribe line and an outer circumferential portion. Thereafter, only the passivation film which is ... | 05/04/2010 |
| 7700413 | Production method of compound semiconductor light-emitting device wafer The inventive production method of a compound semiconductor light-emitting device (LED)s wafer comprises a step of forming a protective film on the top and/or bottom surface of a compound semiconductor LEDs wafer, where the devices being regularly and periodically a... | 04/20/2010 |
| 7696012 | Wafer dividing method A method of dividing a wafer having a plurality of streets, which are formed in a lattice pattern on the front surface, and having devices, which are formed in a plurality of areas sectioned by the plurality of streets, into individual devices along the streets, com... | 04/13/2010 |
| 7696011 | Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices Methods for applying a dielectric protective layer to a wafer in wafer-level chip-scale package manufacture are disclosed. A flowable dielectric protective material with fluxing capability is applied over the active surface of an unbumped semiconductor wafer to cove... | 04/13/2010 |
| 7691678 | Solid-state imaging device and method for manufacturing the same A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal spac... | 04/06/2010 |
| 7678611 | Spacer die structure and method for attaching A semiconductor spacer structure comprises in order a backgrinding tape layer, a spacer adhesive layer, a semiconductor spacer layer, an optional second spacer adhesive layer, a dicing tape layer. In a first method a spacer wafer having first and second sides, a bac... | 03/16/2010 |
| 7666711 | Semiconductor device and method of forming double-sided through vias in saw streets A semiconductor device is made by creating a gap between semiconductor die on a wafer. An insulating material is deposited in the gap. A first portion of the insulating material is removed from a first side of the semiconductor wafer to form a first notch. The first... | 02/23/2010 |
| 7662671 | Semiconductor device and method for manufacturing the same A method of manufacturing a semiconductor device is disclosed, which includes at least the steps of preparing a laminated structure including a single chip or a plurality of chips, and dividing the laminated structure into a plurality of sub-laminated structures. A ... | 02/16/2010 |
| 7662670 | Manufacturing method of semiconductor device A glass substrate is bonded through a resin to the top surface of a semiconductor wafer on which a first wiring is formed. A V-shaped groove is formed by notching from the back surface of the wafer. A second wiring connected with the first wiring and extending over ... | 02/16/2010 |
| 7659147 | Method for cutting solid-state image pickup device In a method for cutting a solid-state image pickup device of the present invention, a glass cover plate is diced with a surface thereof being protected, so that chipping of the glass cover plate can be significantly prevented. In addition, since a CCD wafer is adher... | 02/09/2010 |
| 7651889 | Electromagnetic shield formation for integrated circuit die package Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated... | 01/26/2010 |
| 7608484 | Non-pull back pad package with an additional solder standoff Disclosed herein is a method of manufacturing a semiconductor package with a solder standoff on lead pads that reach to the edge of the package (non-pullback leads). It includes encapsulating a plurality of die on a lead frame strip. The lead frame strip comprises a... | 10/27/2009 |
| 7582513 | Electronic device and method for producing electronic devices One aspect includes an electronic device including an integrated component with a substrate. An electrically conductive first layer region is arranged at the substrate, wherein the layer thickness of the first layer region is greater than 10 micrometers or greater t... | 09/01/2009 |
| 7572674 | Method for manufacturing semiconductor device In a production of a semiconductor device, after a step in which a thermosetting resin is thermally cured to seal a semiconductor chip with the resin and before a step in which a characteristic of the semiconductor chip is inspected, the thermosetting resin is baked... | 08/11/2009 |
| 7569423 | Wafer-level-chip-scale package and method of fabrication A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a conductive ball disposed on the semiconductor substrate and electrically conn... | 08/04/2009 |
| 7563643 | Wafer processing apparatus A wafer processing apparatus (10), for processing a wafer (20) with a surface protective film (110) attached on the front surface (21) on which at least one circuit pattern is formed, includes a dicing tape application unit (30) fo... | 07/21/2009 |
| 7517726 | Wire bonded chip scale package fabrication methods In one embodiment the present invention includes a method of manufacturing a chip scale package. Embodiments of the present invention include sawing kerfs between semiconductor device boundaries on opposite sides of the wafer and filling the kerfs with mold compound... | 04/14/2009 |
| 7517724 | Dicing/die bonding sheet The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesi... | 04/14/2009 |
| 7517725 | System and method for separating and packaging integrated circuits A method of separating an IC. The method includes dicing a semiconductor wafer. The semiconductor wafer includes multiple ICs. The diced wafer is secured to a stretchable substrate. The stretchable substrate can be stretched so as to form corresponding spaces betwee... | 04/14/2009 |
