Did You Know...
...that the video game, Pong, was invented by a guy who graduated at the bottom of his engineering class? Nolan Bushnell spent more time running the games at a local amusement park than he did on his studies at the University of Utah. His dreams of working for Disney's amusement empire were dashed when the company wouldn't hire him. Taking a boring job, Nolan daydreamed about electronic versions of popular games. He invented Pong, the first video game, and went on to found Atari Co.
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| Number | Title | Issue Date |
| 8183091 | Semiconductor integrated circuit device and process for manufacturing the same A semiconductor IC includes grooves formed in a substrate to define a first dummy region and second dummy regions formed at a scribing area, and third dummy regions and a fourth dummy region formed at a product area. A width of the first dummy region is greater than... | 05/22/2012 |
| 8183092 | Method of fabricating stacked semiconductor structure A stacked semiconductor structure and fabrication method thereof are provided. The method includes mounting and connecting electrically a semiconductor chip to a first substrate, mounting on the first substrate a plurality of supporting members corresponding in posi... | 05/22/2012 |
| 8178393 | Semiconductor package and manufacturing method thereof A semiconductor chip, semiconductor package including the same, and a method of manufacturing the semiconductor chip and semiconductor package to block up electrical contacts between bonding wires and the semiconductor chip by providing insulation over the edge of t... | 05/15/2012 |
| 8168474 | Self-dicing chips using through silicon vias Systems and methods simultaneously form first openings and second openings in a substrate. The first openings are formed smaller than the second openings. The method also simultaneously forms a first material in the first openings and the second openings. The first ... | 05/01/2012 |
| 8153476 | Electronic component and method of manufacturing the same An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and... | 04/10/2012 |
| 8153475 | Back-end processes for substrates re-use A method for fabricating optical devices on a reusable handle substrate. The method includes providing a handle substrate having a surface region. The method also includes forming a plurality of optical device using at least an epitaxial growth process overlying the... | 04/10/2012 |
| 8143105 | Semiconductor seal ring and method of manufacture thereof An improved semiconductor seal ring and method therefore is described. The seal ring comprises a thick layer wherein at least a portion of the thick layer is removed from a singulation street prior to singulation, thereby avoiding damage to the thick layer during th... | 03/27/2012 |
| 8124455 | Wafer strength reinforcement system for ultra thin wafer thinning A wafer strength reinforcement system is provided including providing a wafer, providing a tape for supporting the wafer, and positioning a wafer edge support material for location between the tape and the wafer. ... | 02/28/2012 |
| 8119453 | Chip-size-package semiconductor chip and manufacturing method A method of manufacturing semiconductor chips includes preparing a semiconductor substrate having on its front side a plurality of chip forming areas; sticking a support to the front surface of the substrate via an adhesive sheet; forming through holes extending fro... | 02/21/2012 |
| 8110441 | Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die A semiconductor device is made by mounting a plurality of semiconductor die to a substrate, depositing an encapsulant over the substrate and semiconductor die, forming a shielding layer over the semiconductor die, creating a channel in a peripheral region around the... | 02/07/2012 |
| 8105877 | Method of fabricating a stacked type chip package structure A stacked type chip package structure including a package structure, a corresponding substrate, and a number of second bumps is provided. The package structure includes a first chip, a second chip, a number of first bumps, and a first underfill. The first chip is di... | 01/31/2012 |
| 8101466 | SOI substrate and method for manufacturing SOI substrate An SOI substrate and a manufacturing method of the SOI substrate, by which enlargement of the substrate is possible and its productivity can be increased, are provided. A step (A) of cutting a first single crystal silicon substrate to form a second single crystal si... | 01/24/2012 |
| 8101465 | Method of fabricating a semiconductor device with a back electrode A semiconductor device capable of stabilizing operations thereof is provided. This semiconductor device comprises a substrate provided with a region having concentrated dislocations at least on part of the back surface thereof, a semiconductor element layer formed o... | 01/24/2012 |
| 8097493 | Method of manufacturing semiconductor light emitting elements A method of manufacturing semiconductor light emitting elements with improved yield and emission power uses laser lift-off and comprises the steps of forming a semiconductor grown layer formed of a first semiconductor layer, an active layer, and a second semiconduct... | 01/17/2012 |
| 8071429 | Wafer dicing using scribe line etch Embodiments of a method for separating dies from a wafer having first and second sides. The process embodiment includes masking the first side of the wafer, the mask including openings therein to expose parts of the first side substantially aligned with scribe lines... | 12/06/2011 |
| 8058105 | Method of fabricating a packaging structure A method of fabricating a packaging structure includes cutting a panel of packaging substrate into a plurality of packaging substrate blocks each having a plurality of packaging substrate units; mounting and packaging a semiconductor chip on each of the packaging su... | 11/15/2011 |
| 8053279 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray s... | 11/08/2011 |
| 8043897 | Method for forming micro-electro-mechanical system (MEMS) package A method for forming a micro-electro-mechanical systems (MEMS) package includes following steps. A plurality of MEMS units are formed on a substrate, and each of the MEMS units includes at least a MEMS sensing element and a first chamber over the MEMS sensing elemen... | 10/25/2011 |
| 8043896 | Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package including an inclined via hole In a semiconductor chip, a body has a top surface where a pattern is formed, an underside surface opposing the top surface and a plurality of side surfaces. A plurality of electrode pads are formed on the top surface of the body to connect to an external terminal. A... | 10/25/2011 |
| 8039315 | Thermally enhanced wafer level package A method of forming a package structure includes providing a plurality of dies; attaching the plurality of dies onto a heat-dissipating plate; and sawing the heat-dissipating plate into a plurality of packages, each including one of the plurality of dies and a piece... | 10/18/2011 |
| 8039314 | Metal adhesion by induced surface roughness Back side metal (BSM) delamination induced by chip dicing of silicon wafers is avoided by roughening the polished silicon surface at chip edges by etching. The Thru-Silicon-Via (TSV) structures used in 3D chip integration is masked at the back side from roughening t... | 10/18/2011 |
| 8039313 | Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate A semiconductor device and method for producing such a device is disclosed. One embodiment provides a semiconductor functional wafer having a first and second main surface. Component production processes are performed for producing a component functional region at t... | 10/18/2011 |
| 8030136 | Semiconductor device and method of conforming conductive vias between insulating layers in saw streets A semiconductor device is made by disposing a plurality of semiconductor die on a carrier and creating a gap between each of the semiconductor die. A first insulating material is deposited in the gap. A portion of the first insulating material is removed. A conducti... | 10/04/2011 |
| 8017441 | Method for manufacturing IC tag inlet An IC tag inlet (100) is configured by: an upper side antenna (102) and a lower side antenna (103) sandwiching a semiconductor chip (101) that includes an upper electrode (132) and a lower electrode (133) from both upper and... | 09/13/2011 |
| 8017442 | Method of fabricating a package structure A method fabricates a packaging structure, including cutting a complete panel of packaging substrates with a large area into a plurality of packaging substrate blocks each having a plurality of packaging substrate units; mounting a semiconductor chip on each of the ... | 09/13/2011 |
| 8012806 | Multi-directional trenching of a die in manufacturing superjunction devices A method of manufacturing a superjunction device includes providing a semiconductor wafer having at least one die. At least one first trench having a first orientation is formed in the at least one die. At least one second trench having a second orientation that is ... | 09/06/2011 |
| 8012805 | Manufacturing method for semiconductor chips, and semiconductor chip In a manufacturing method for performing plasma etching on a second surface of a semiconductor wafer that has a first surface where an insulating film is placed in dividing regions and the second surface which is opposite from the first surface and on which a mask f... | 09/06/2011 |
| 8008129 | Method of making semiconductor device packaged by sealing resin member A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposi... | 08/30/2011 |
| 8003441 | Manufacturing method of semiconductor device A manufacturing method of a semiconductor device according to the present invention comprises: laminating a surface protective sheet to a circuit surface side of a wafer formed with grooves which divide each circuit wherein an adhe... | 08/23/2011 |
| 7998793 | Light illumination during wafer dicing to prevent aluminum corrosion Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing st... | 08/16/2011 |
| 7993974 | Method for manufacturing a semiconductor device A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch ca... | 08/09/2011 |
| 7993976 | Semiconductor device and method of forming conductive vias with trench in saw street A semiconductor wafer has a plurality of semiconductor die separated by a peripheral region. A trench is formed in the peripheral region of the wafer. A via is formed the die. The trench extends to and is continuous with the via. A first conductive layer is deposite... | 08/09/2011 |
| 7993975 | Method of manufacturing semiconductor device including mounting and dicing chips A semiconductor-device manufacturing method includes: forming terminals on a wafer and across each of dicing lines along which the wafer is cut into a plurality of semiconductor chips; preparing a plurality of pre-cut substrates each including a substrate body capab... | 08/09/2011 |
| 7981727 | Electronic device wafer level scale packages and fabrication methods thereof Electronic device wafer level scale packages and fabrication methods thereof. A semiconductor wafer with a plurality of electronic devices formed thereon is provided. The semiconductor wafer is bonded with a supporting substrate. The back of the semiconductor substr... | 07/19/2011 |
| 7972904 | Wafer level packaging method A wafer level packaging method is revealed. Firstly, a wafer with a plurality of bumps disposed on a surface is provided. Placing a dielectric tape on a mold plate is followed. Then, the wafer is laminated with the mold plate to make the dielectric tape be compliant... | 07/05/2011 |
| 7968378 | Electronic device One embodiment provides a method of manufacturing semiconductor devices. For example, a sawn and expanded wafer is utilized having dielectrical material deposited between the diced and deposited chips. The method includes placing at least two chips on a metallic lay... | 06/28/2011 |
| 7968377 | Integrated circuit protruding pad package system An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated ... | 06/28/2011 |
| 7968379 | Method of separating semiconductor dies A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The ... | 06/28/2011 |
| 7964448 | Electronic device and method of manufacturing same This application relates to a method of manufacturing a semiconductor device comprising: providing a metal carrier; placing the metal carrier into a mold for forming a molded structure holding the metal carrier; segmenting the metal carrier into at least two disconn... | 06/21/2011 |
| 7964449 | Method for manufacturing semiconductor chip and method for processing semiconductor wafer In a laser processing step S3, boundary sections among semiconductor elements 2 of a resist film 4 are exposed to a laser beam 13a, to thus form in the resist film 4 boundary grooves 5—which partition the semiconduc... | 06/21/2011 |
