Did You Know...
...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8163601 | Chip-exposed semiconductor device and its packaging method A method of making a chip-exposed semiconductor package comprising the steps of: plating a plurality of electrode on a front face of each chip on a wafer; grinding a backside of the wafer and depositing a back metal then separating each chips; mounting the chips wit... | 04/24/2012 |
| 8114709 | Electronic device and lead frame A lead frame facilitates the handling, positioning, attachment, and/or continued integrity of multiple dies, without the use of multiple separate parts, such as jumpers. The lead frame includes a number of structures, each of which is attached to at least one lead. ... | 02/14/2012 |
| 8101463 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device includes placing a chip on a carrier, and applying an electrically conducting layer to the chip and the carrier. The method additionally includes converting the electrically conducting layer into an electrically insul... | 01/24/2012 |
| 8101462 | Method for manufacturing semiconductor device, and semiconductor device A method for manufacturing a semiconductor device includes: when bonding a bump of an IC chip to a bonding position of a wiring pattern that is formed on an insulating film base member and has a surface covered by a plating layer, forming a plating layer around the ... | 01/24/2012 |
| 8088649 | Radiation-emitting semiconductor body with carrier substrate and method for the producing the same A radiation-emitting semiconductor body with a carrier substrate and a method for producing the same. In the method, a structured connection is produced between a semiconductor layer sequence (2) and a carrier substrate wafer (1). The semiconductor lay... | 01/03/2012 |
| 8084299 | Semiconductor device package and method of making a semiconductor device package A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the ... | 12/27/2011 |
| 8076181 | Lead plating technique for singulated IC packages A packaging technique is described for QFNs, DFN, and other surface mount packages that allows the sides of leads to be plated with a wettable metal prior to the lead frames being singulated from the lead frame sheet. The leads of the lead frames in the sheet are sh... | 12/13/2011 |
| 8071426 | Method and apparatus for no lead semiconductor package A leadframe for use in fabricating a no lead semiconductor package contains connecting bars between individual electrical contact pads. For embodiments having a die pad, the leadframe further includes connecting bars between the contact pads and the die pad. The low... | 12/06/2011 |
| 8048718 | Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portion A partly finished product of a semiconductor device includes a resin body encapsulating a semiconductor chip, first and second leads extended outwardly from the resin body, a dam bar connected between said first and second leads, and an excess resin portion protrudi... | 11/01/2011 |
| 7998790 | Integrated circuit packaging system with isolated pads and method of manufacture thereof A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulat... | 08/16/2011 |
| 7968376 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the su... | 06/28/2011 |
| 7863102 | Integrated circuit package system with external interconnects within a die platform The present invention provides an integrated circuit package system comprising: attaching a die platform to an integrated circuit die; mounting the integrated circuit die over an external interconnect with a bottom side of the external interconnect partially within ... | 01/04/2011 |
| 7858443 | Leadless integrated circuit package having standoff contacts and die attach pad A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding mat... | 12/28/2010 |
| 7846774 | Multiple row exposed leads for MLP high density packages A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe wi... | 12/07/2010 |
| 7824963 | Inkjet printed leadframe Apparatuses and methods for inkjet printing electrical interconnect patterns such as leadframes for integrated circuit devices are disclosed. An apparatus for packaging includes a thin substrate adapted for high temperature processing, and an attach pad and contact ... | 11/02/2010 |
| 7736951 | Circuit component and method of manufacture An inductor, a semiconductor component including the inductor, and a method of manufacture. A leadframe has a plurality of conductive strips and a flag. A ferrite core is mounted on a die attach material disposed on the conductive strips and a semiconductor die is m... | 06/15/2010 |
| 7709294 | Die attach area cut-on-fly method and apparatus A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the c... | 05/04/2010 |
| 7704793 | Electronic part and method for manufacturing the same A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate, al... | 04/27/2010 |
| 7687317 | Semiconductor device having tape carrier with bendable region A tape carrier includes: a base film with insulating property; a wiring pattern provided on the base film within a product region, the product region being demarcated by a cutting line so as to divide the tape carrier into individual products by cutting along the ta... | 03/30/2010 |
| 7666710 | Method of manufacturing photo couplers A method of manufacturing photo couplers is provided. At first, a receiver lead-frame array is cut from a lead-frame matrix having a transmitter lead-frame array and the receiver lead-frame array. Then, the receiver lead-frame array is overturned and placed on the l... | 02/23/2010 |
| 7601562 | Microelectronic component assemblies having lead frames adapted to reduce package bow The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-... | 10/13/2009 |
| 7521290 | Method of manufacturing circuit device The method of the present invention includes a first step of preparing a substrate in which a plurality of circuit boards are integrally connected to one another, each of the circuit boards having conductive patterns which include pads formed on a surface of the cir... | 04/21/2009 |
| 7435624 | Method of reducing mechanical stress on a semiconductor die during fabrication A method of reducing mechanical stress on an integrated circuit is disclosed including applying solder columns to the substrate for adding structural support to the package during the fabrication process. ... | 10/14/2008 |
| 7413930 | Lead frame and method of manufacturing the lead frame A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of... | 08/19/2008 |
| 7414303 | Lead on chip semiconductor package The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in th... | 08/19/2008 |
| 7410830 | Leadless plastic chip carrier and method of fabricating same A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that... | 08/12/2008 |
| 7411280 | Chip support of a leadframe for an integrated circuit package The central region of a leadframe (101, 201, 301, 401, 501, 601, 701, 801, 901, 1001, 1101, 1201), is selectively etched to leave upright portions (104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204). Subsequently, during the packaging proce... | 08/12/2008 |
| 7407834 | Manufacturing method of a semiconductor device A non-leaded resin-sealed semiconductor device is manufactured by the steps of providing a metal substrate having a front surface, a rear surface, a chip fixing partition part, partition parts arranged around the chip fixing partition part, and grooves defined betwe... | 08/05/2008 |
| 7408242 | Carrier with reinforced leads that are to be connected to a chip This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a... | 08/05/2008 |
| 7405106 | Quad flat no-lead chip carrier with stand-off A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second le... | 07/29/2008 |
| 7387916 | Sharp corner lead frame An integrated circuit package lead frame, comprising a plurality of leads and a spine electrically connected to said plurality of leads, said spine comprising indentations between a pair of said leads. The indentations prevent the pair of leads from becoming electri... | 06/17/2008 |
| 7372130 | Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device hole and at the other end into the holes; a semiconductor chip having a... | 05/13/2008 |
| 7372170 | Flip chip interconnection pad layout A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from the signal pads; and has the signal pads on the corresponding packag... | 05/13/2008 |
| 7371616 | Clipless and wireless semiconductor die package and method for making the same A method for making a semiconductor die package is disclosed. In some embodiments, the method includes using a leadframe structure including at least one lead structure having a lead surface. A semiconductor die having a first surface and a second surface is attache... | 05/13/2008 |
| 7372133 | Microelectronic package having a stiffening element and method of making same A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact l... | 05/13/2008 |
| 7368320 | Method of fabricating a two die semiconductor assembly A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the die paddle, a second semiconductor die secured by a backside thereof... | 05/06/2008 |
| 7364947 | Method for cutting lead terminal of package type electronic component In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse surface of each lead terminal before molding the molded part while lea... | 04/29/2008 |
| 7361531 | Methods and apparatus for Flip-Chip-On-Lead semiconductor package Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabri... | 04/22/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7354804 | Method for fabricating lead frame and method of fabricating semiconductor device using the same A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower su... | 04/08/2008 |
