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| Number | Title | Issue Date |
| 8173488 | Electronic device and method of manufacturing same This application relates to a method of manufacturing a semiconductor device comprising: providing multiple chips each comprising contact elements on a first main face of each of the multiple chips, and a first layer applied to each of the first main faces of the mu... | 05/08/2012 |
| 8168473 | Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same Disclosed are molded ultra-thin semiconductor die packages, systems that incorporate such packages, and methods of making such packages. An exemplary package comprises a leadframe having an aperture formed between the leadframe's first and second surfaces, and a plu... | 05/01/2012 |
| 8148203 | Technique for stable processing of thin/fragile substrates A semiconductor on insulator (SOI) wafer includes a semiconductor substrate having first and second main surfaces opposite to each other. A dielectric layer is disposed on at least a portion of the first main surface of the semiconductor substrate. A device layer ha... | 04/03/2012 |
| 8138023 | Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof A method for manufacturing a semiconductor device includes the steps of (a) preparing a wafer including a first circuit formation region and a first surrounding region, (b) laminating a first chip on the first circuit formation region, (c) pouring a first underfill ... | 03/20/2012 |
| 8124454 | Die separation Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced p... | 02/28/2012 |
| 8080447 | Method of manufacturing semiconductor device including exposing a dicing line on a wafer A method of manufacturing a semiconductor device, including the following steps, forming a resin layer on a surface of a semiconductor chip, the surface is provided with a bump formed thereon, the resin layer having photosensitivity and adhesiveness, exposing an upp... | 12/20/2011 |
| 8062930 | Sub-module conformal electromagnetic interference shield The present invention relates to a manufacturing process of a sub-module having an electromagnetic shield. Initially, a meta-module having circuitry for two or more sub-modules is formed. An overmold body is placed over the circuitry for all of the sub-modules. The ... | 11/22/2011 |
| 8058103 | Semiconductor substrate cutting method A method for cutting a semiconductor substrate having a front face formed with functional devices together with a die bonding resin layer. A wafer having a front face formed with functional devices is irradiated with laser light while positioning a light-converging ... | 11/15/2011 |
| 8039312 | Method for forming a capped micro-electro-mechanical system (MEMS) device A capped micro-electro-mechanical systems (MEMS) device is formed using a device wafer and a cap wafer. The MEMS device is located on a frontside of the device wafer. A frontside of a cap wafer is attached to the frontside of the device wafer. A first stressor layer... | 10/18/2011 |
| 8039311 | Leadless semiconductor chip carrier system A semiconductor package system includes: providing a semiconductor die with bonding pad on the semiconductor die; attaching the semiconductor die to an intermediate layer; attaching one end of a bonding wire to the bonding pad; forming a bonding ball at the other en... | 10/18/2011 |
| 8039310 | Method of manufacturing semiconductor device with improved design freedom of external terminal A semiconductor method comprises a method for making a device comprising: a base; a semiconductor chip provided on the base which includes a first main surface 20a on which a plurality of electrode pads is provided, a surface protecting film provided o... | 10/18/2011 |
| 8034663 | Low cost die release wafer Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, re... | 10/11/2011 |
| 8012804 | Method and system for mounting lasers on energy assisted magnetic recording heads A method and system for providing energy assisted magnetic recording (EAMR) heads including EAMR transducers are described. The method and system include aligning a laser bar to the EAMR heads on a substrate. The laser bar includes lasers in locations corresponding ... | 09/06/2011 |
| 8008127 | Method of fabricating an integrated circuit having a multi-layer structure with a seal ring A plurality of IC regions are formed on a semiconductor wafer, which is cut into individual chips incorporating ICs, wherein wiring layers and insulating layers are sequentially formed on a silicon substrate. In order to reduce height differences between ICs and scr... | 08/30/2011 |
| 7993973 | Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure The present invention provides a structure combining an IC integrated substrate and a carrier, which comprises a carrier and an IC integrated substrate formed on the carrier. The interface between the IC integrated substrate and the carrier has a specific area at wh... | 08/09/2011 |
| 7989266 | Methods for separating individual semiconductor devices from a carrier A wafer of integrated circuits may be bonded to a carrier wafer using a layer of bonding material. The thickness of the wafer of integrated circuits may then be reduced using a series of grinding operations. After grinding, backside processing operations may be perf... | 08/02/2011 |
| 7985622 | Method of forming collapse chip connection bumps on a semiconductor substrate A method of forming collapse chip connection bumps on a semiconductor substrate is provided. The method includes providing a semiconductor substrate having a plurality of bump vias on a top surface of the semiconductor substrate and electroplating the plurality of b... | 07/26/2011 |
| 7960213 | Electronic package structure and method An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the... | 06/14/2011 |
| 7960212 | Structure of high performance combo chip and processing method A method for fabricating a chip package is achieved. A seed layer is formed over a silicon wafer. A photoresist layer is formed on the seed layer, an opening in the photoresist layer exposing the seed layer. A first solder bump is formed on the seed layer exposed by... | 06/14/2011 |
| 7927920 | Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package In a method of manufacturing an electronic component package, first, there is fabricated a wafer incorporating a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages, and a retainer for retaining the plural... | 04/19/2011 |
| 7923296 | Board on chip package and method of manufacturing the same A ball grid array type board on chip package may include an integrated circuit chip having an active surface that supports a plurality of contact pads. An interposer may be adhered to the active surface of the integrated circuit chip. At least one hole may be provid... | 04/12/2011 |
| 7915085 | Molded chip fabrication method A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A ... | 03/29/2011 |
| 7901989 | Reconstituted wafer level stacking A stacked microelectronic assembly is fabricated from a structure which includes a plurality of first microelectronic elements having front faces bonded to a carrier. Each first microelectronic element may have a first edge and a plurality of first traces extending ... | 03/08/2011 |
| 7897434 | Methods of fabricating solar cell chips A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process rout... | 03/01/2011 |
| 7892892 | Semiconductor device and method for manufacturing thereof A semiconductor device has a first semiconductor chip 10 molded with a resin 12, a first metal 14 provided in the resin 12 in a circumference of the first semiconductor chip 10, and being exposed on a lower surface of the resin ... | 02/22/2011 |
| 7892891 | Die separation Techniques for dicing wafer assemblies containing multiple metal device dies, such as vertical light-emitting diode (VLED), power device, laser diode, and vertical cavity surface emitting laser device dies, are provided. Devices produced accordingly may benefit from... | 02/22/2011 |
| 7838338 | Fabricating process of thermal enhanced substrate A fabricating process of a thermal enhanced substrate is provided for fabricating thermal conduction blocks to increase the heat dissipation area. A metallic substrate having a first surface and a second surface opposite to the first surface is provided. A first sha... | 11/23/2010 |
| 7838337 | Semiconductor device and method of forming an interposer package with through silicon vias A semiconductor device is fabricated by providing a carrier for supporting the semiconductor device. A first semiconductor die is mounted to the carrier. The first semiconductor die has a contact pad. A first dummy die is mounted to the carrier. The first dummy die ... | 11/23/2010 |
| 7824962 | Method of integrated circuit fabrication A method for fabricating an integrated circuit including forming a first trench in a rear side of a semiconductor wafer, wherein the first trench has a depth extending partially through a thickness of the semiconductor wafer, coating the rear side with a layer of co... | 11/02/2010 |
| 7820485 | Method of forming a package with exposed component surfaces A method of forming a semiconductor package includes forming a coating over a first device, attaching the first device to a substrate using an adhesive, encapsulating the first device using an encapsulant material, releasing the first device from the substrate using... | 10/26/2010 |
| 7807504 | Semiconductor module A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a s... | 10/05/2010 |
| 7799610 | Method of fabricating a stacked die having a recess in a die BGA package Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies are provided. ... | 09/21/2010 |
| 7795076 | Method, system, and apparatus for transfer of dies using a die plate having die cavities A method, system, and apparatus for transfer of dies using a die plate having die cavities is described herein. The die plate has a planar body. The body has a plurality of cells or cavities which are open at the first surface of the body. Each cell has a hole exten... | 09/14/2010 |
| 7795077 | Memory card and method for fabricating the same A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit op... | 09/14/2010 |
| 7776654 | Method of producing electronic apparatus To provide a method of producing an electronic apparatus that is inexpensive, contributes to high productivity, and can achieve good communication characteristics. A method of producing an electronic apparatus composed of an IC chip (100) having an external e... | 08/17/2010 |
| 7767495 | Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material A semiconductor device and manufacturing method. One embodiment provides at least two semiconductor chips. A dielectric material is applied to the at least two semiconductor chips to attach the at least two semiconductor chips to each other. A portion of the dielect... | 08/03/2010 |
| 7749809 | Methods and systems for packaging integrated circuits Panel level methods and systems for packaging integrated circuits are described. In a method aspect of the invention, a substrate formed from a sacrificial semiconductor wafer is provided having a plurality of metallized device areas patterned thereon. Each device a... | 07/06/2010 |
| 7745260 | Method of forming semiconductor package A method of forming a semiconductor package (10) including forming a plurality of cavities (14) in a substrate (12). An electrically conductive pattern (16) is formed on the substrate (12) and over the cavities (14). An elec... | 06/29/2010 |
| 7732257 | Semiconductor device and method of fabricating the same A semiconductor device and a fabricating method thereof are provided. The semiconductor device can include a first chip having transistors of only the NMOS type, a second chip having transistors of only the PMOS type, and an interconnection electrically connecting t... | 06/08/2010 |
| 7727809 | Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device The invention proposes a method and an apparatus for attaching a plurality of components having different arrangement densities or arrangement intervals, which can achieve shorter takt time. An object is to provide a low-cost manufacturing method of a semiconductor ... | 06/01/2010 |
