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| Number | Title | Issue Date |
| 8183089 | Method for manufacturing package system incorporating flip-chip assembly A method for manufacturing a package system includes: providing a first semiconductor die; mounting a second semiconductor die on the first semiconductor die using an inter-die interconnect to form a flip-chip assembly; and attaching the flip-chip assembly on a pack... | 05/22/2012 |
| 8178392 | Electronic system with expansion feature An electronic system is provided including forming a substrate having a radiating patterned pad, mounting an electrical device having an external interconnect over the radiating patterned pad with the external interconnect offset from the radiating patterned pad, an... | 05/15/2012 |
| 8168472 | Semiconductor device having a semiconductor chip, and method for the production thereof A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the flip-chip contacts are surrounded by an electrically insulating layer as underfill material, the layer havi... | 05/01/2012 |
| 8168471 | Semiconductor device and manufacturing method of a semiconductor device A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounte... | 05/01/2012 |
| 8143098 | Integrated circuit packaging system with interposer and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing an interposer having device contacts, interconnect contacts, and test pads including the interconnect contacts along an interconnect perimeter region of the interposer, the device ... | 03/27/2012 |
| 8143099 | Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer The present invention relates to a method of manufacturing a semiconductor package capable of simplifying a process and remarkably reducing a production cost by including the steps of: preparing a different bonded panel including at least one metal layer; forming a ... | 03/27/2012 |
| 8138019 | Integrated (multilayer) circuits and process of producing the same A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material, forming at least a second element ha... | 03/20/2012 |
| 8138020 | Wafer level integrated interconnect decal and manufacturing method thereof A wafer level integrated interconnect decal manufacturing method and wafer level integrated interconnect decal arrangement. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal ... | 03/20/2012 |
| 8138018 | Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring board A manufacturing method of a semiconductor device includes a film state underfill resin adhering step wherein film state underfill resin in a semi-cured state is adhered on the first surface of the board main body without forming a gap between the first surface of th... | 03/20/2012 |
| 8138021 | Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components Packaged semiconductor components, apparatus for packaging semiconductor devices, methods of packaging semiconductor devices, and methods of manufacturing apparatus for packaging semiconductor devices. One embodiment of an apparatus for packaging semiconductor devic... | 03/20/2012 |
| 8133761 | Packaged system of semiconductor chips having a semiconductor interposer A semiconductor system (200) of one or more semiconductor interposers (201) with a certain dimension (210), conductive vias (212) extending from the first to the second surface, with terminals and attached non-reflow metal studs (215 | 03/13/2012 |
| 8129221 | Semiconductor package and method of forming the same Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the... | 03/06/2012 |
| 8119450 | Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots A method for forming metallurgical interconnections and polymer adhesion of a flip chip to a substrate includes providing a chip having a set of bumps formed on a bump side thereof and a substrate having a set of interconnect points on a metallization thereon, provi... | 02/21/2012 |
| 8119449 | Method of manufacturing an electronic part mounting structure An electronic part mounting structure includes electronic part having a plurality of electrode terminals, a substrate provided with connection terminals in locations corresponding to these electrode terminals, and protruding electrode for connecting one of electrode... | 02/21/2012 |
| 8119451 | Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package A method of manufacturing a semiconductor package, includes the steps of: forming a substrate on which a semiconductor chip is to be mounted; and mounting the semiconductor chip on the substrate through connection bumps, the substrate forming step including a first ... | 02/21/2012 |
| 8097492 | Method and manufacture of silicon based package and devices manufactured thereby A Silicon Based Package (SBP) is formed starting with a thick wafer, which serves as the base for the SBP, composed of silicon which has a first surface and a reverse surface which are planar. Then form an interconnection structure including metal capture structures... | 01/17/2012 |
| 8093101 | Electronic device and method of fabricating the same There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and... | 01/10/2012 |
| 8088646 | Check valve package for PB-free, single piece electronic modules Check valve package for pb-free, single piece electronic modules, the package having an exterior and an interior, and at least one electronic device mounted within the interior of the package electrically connected to a lead-free solder ball grid array on a surface ... | 01/03/2012 |
| 8088647 | Bumping free flip chip process Methods, systems, and apparatuses for an integrated circuit package assembly process are provided. A wafer is received having a surface defined by a plurality of integrated circuit regions. Electrical conductors are accessible through corresponding first openings in... | 01/03/2012 |
| 8084298 | Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor A process for replacing a semiconductor chip of such a flip-chip module and a suitable flip-chip module and an apparatus for implementing the method are disclosed. The flip-chip module comprises at least one semiconductor chip and a substrate. The semiconductor chip... | 12/27/2011 |
| 8076180 | Repairable semiconductor device and method Repairable semiconductor device and method. In one embodiment a method, provides a first body having a first semiconductor chip and a first metal layer. A second body includes a second semiconductor chip and a second metal layer. Metal of the first metal layer is re... | 12/13/2011 |
| 8071425 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus The flip chip mounted body of the present invention includes: a circuit board (213) having a plurality of connection terminals (211); a semiconductor chip (206) having a plurality of electrode terminals (207) that are disposed opposing th... | 12/06/2011 |
| 8062928 | Semiconductor device having a semiconductor chip, and method for the production thereof A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the flip-chip contacts are surrounded by an electrically insulating layer as underfill material, the layer havi... | 11/22/2011 |
| 8062926 | Manufacturing method for RFID tag An RFID tag manufacturing method is including application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip, placement process in which the ... | 11/22/2011 |
| 8062927 | Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same A wiring board is provided with an external connection terminal to which an electrode terminal of an electronic component is to be connected. The external connection terminal is formed so that a portion thereof is electrically connected to a pad portion exposed from... | 11/22/2011 |
| 8058100 | Method for fabricating chip scale package structure with metal pads exposed from an encapsulant A chip scale package structure and a method for fabricating the same are disclosed. The method includes forming metal pads on a predetermined part of a carrier; mounting chips on the carrier, each of the chips having a plurality of conductive bumps soldered to the m... | 11/15/2011 |
| 8053277 | Three-dimensional integrated circuits with protection layers A semiconductor structure includes a first die comprising a first substrate and a first bonding pad over the first substrate, a second die having a first surface and a second surface opposite the first surface, wherein the second die is stacked on the first die and ... | 11/08/2011 |
| 8048716 | Structure of embedded active components and manufacturing method thereof A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the molding plate as first. A dielectric layer covers the molding plate t... | 11/01/2011 |
| 8043893 | Thermo-compression bonded electrical interconnect structure and method An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a f... | 10/25/2011 |
| 8034659 | Production method of semiconductor device and bonding film To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and pr... | 10/11/2011 |
| 8034661 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP A semiconductor device has a stress relief buffer mounted to a temporary substrate in locations designated for bump formation. The stress relief buffer can be a multi-layer composite material such as a first compliant layer, a silicon layer formed over the first com... | 10/11/2011 |
| 8034660 | PoP precursor with interposer for top package bond pad pitch compensation An electronic assembly adapted for forming package on package (PoP) devices includes a package substrate having a molded IC die thereon that defines a mold cap height and substrate contact pads lateral to the molded IC die. An interposer including an interposer subs... | 10/11/2011 |
| 8021922 | Remote chip attachment A method of attaching a pair of chips, each having primary contacts that can be mated to each other, involves forming one or more secondary contacts on each of the two chips of a shape sufficient to prevent an initial attachment material from contacting any of the p... | 09/20/2011 |
| 8021921 | Method of joining chips utilizing copper pillar A copper pillar may be provided on a chip and a first tin-containing layer may be provided over the copper pillar. A second tin-containing layer may be provided on a substrate. The first tin-containing layer may be joined with the second tin-containing layer during ... | 09/20/2011 |
| 8017437 | Method for manufacturing a semiconductor package A method of manufacturing a semiconductor package which includes mounting a first chip on a first substrate by a flip chip method, the first substrate having a pre-designed pattern formed thereon; forming at least one bump by performing soldering, on at least one pr... | 09/13/2011 |
| 8012801 | Flip chip mounting process and flip chip assembly A flip chip mounting process includes the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (II), then bringing a semiconductor chip ( | 09/06/2011 |
| 8012800 | Method of fabricating a stacked type chip package structure and a stacked type package structure A method of fabricating a stacked type chip package structure is provided. The method includes following steps. First, a substrate, a first chip, and a second chip are provided. A number of bumps are disposed on a surface of the second chip. The second chip is then ... | 09/06/2011 |
| 8008124 | Adhesive film for semiconductor and semiconductor device using the adhesive film An adhesive film for a semiconductor containing an (A) ester (meth)acrylate copolymer and a (B) thermoplastic resin other than the ester (meth)acrylate copolymer, and composed so as to satisfy the following formula (1) for two hours from 10 minutes after starting me... | 08/30/2011 |
| 8003439 | Board on chip package and manufacturing method thereof A method of manufacturing a board on chip package including laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; patterning the dry film in accordance with a circuit wire through light exposure and developing process, and for... | 08/23/2011 |
| 7993969 | Method for producing a module with components stacked one above another The invention relates to a method in which components (101, 102) are provided, movement elements (104) are in each case applied to surfaces of a number of the components (101), and the components (101, 102) are stacked, so that one or a p... | 08/09/2011 |
