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| Number | Title | Issue Date |
| 8007275 | Methods and apparatuses for heating semiconductor wafers Methods and apparatuses for heat treatment of semiconductor wafers are disclosed herein. A method of heating a semiconductor wafer in accordance with one embodiment includes heating the wafer in a loading enclosure of a heat treatment system above an ambient tempera... | 08/30/2011 |
| 7887323 | Method and apparatus for manufacturing semiconductor device A method and apparatus for manufacturing a semiconductor device is disclosed. In particular, the application discloses a method that performs a lithography process using a material capable of increasing a depth of focus so as to prevent efficiency of the lithography... | 02/15/2011 |
| 7806684 | Method of semiconductor process and semiconductor apparatus system A method of a semiconductor process is provided. The semiconductor process at least includes a first high temperature furnace process and a second high temperature furnace process. In the method, the first high temperature furnace process is performed on a first waf... | 10/05/2010 |
| 7527497 | Heat treating apparatus, heat treating method, and storage medium A heat treating apparatus includes a heating plate for heating a substrate coated with a coating liquid, a cooling plate for cooling the substrate and a heat pipe provided in the cooling plate, a cooling chamber being moved together with the cooling plate by the dri... | 05/05/2009 |
| 7410355 | Method for the heat treatment of substrates A substrate undergoes a semiconductor fabrication process at different temperatures in a reactor without changing the temperature of the reactor. The substrate is held suspended by flowing gas between two heated surfaces of the reactor. Moving the two heated surface... | 08/12/2008 |
| 7347656 | Vacuum processing apparatus and semiconductor manufacturing line using the same A vacuum processing apparatus is composed of a cassette block and a vacuum processing block. The cassette block has a cassette table for mounting a plurality of cassettes containing a sample and an atmospheric transfer means. The vacuum processing block has a plural... | 03/25/2008 |
| 7314343 | Miniature manipulator for servicing the interior of nuclear steam generator tubes A manipulator for servicing tubes extending through a tube sheet having three major components: a base member, a block member, and a foot member. The base member has a holder for supporting tooling or inspection devices. The base member also has at least one gripper... | 01/01/2008 |
| 7226512 | Load lock system for supercritical fluid cleaning A substrate is transferred from an environment at about vacuum into a load lock through a first door. The substrate is then sealed within the load lock. The pressure within the load lock is raised to a high pressure above vacuum. A second door coupling the load lock... | 06/05/2007 |
| 7207766 | Load lock chamber for large area substrate processing system A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration... | 04/24/2007 |
| 7204887 | Wafer holding, wafer support member, wafer boat and heat treatment furnace The present invention provides a wafer holder, a wafer support member, a wafer boat and a heat treatment furnace, which are capable of sufficiently suppressing slip dislocations, without lowering productivity and at low cost, in the high temperature heat treatment o... | 04/17/2007 |
| 7203563 | Automatic N2 purge system for 300 mm full automation fab A system for manufacturing semiconductor integrated circuit (IC) devices, including an operating control system, a process intermediate station in communication with the operating control system, and a gas purge device, wherein the gas purge device is included in th... | 04/10/2007 |
| 7179334 | System and method for performing semiconductor processing on substrate being processed A semiconductor process system (10) includes a measuring section (40), an information processing section (51), and a control section (52). The measuring section (40) measures a characteristic of a test target film formed on a targe... | 02/20/2007 |
| 7150628 | Single-wafer type heat treatment apparatus for semiconductor processing system A single-substrate heat-processing apparatus (2) for a semiconductor processing system includes a process container (4) configured to accommodate a target substrate (W). A support member (6) is disposed in the process container (4) and co... | 12/19/2006 |
| 7121821 | Device for heating preforms provided with supporting ring A device for heating parisons made of a thermoplastic material and having a supporting ring for blow molding hollow bodies, having a conveyor means, a plurality of holding means which are arranged on the conveyor means and grip the head area of the parisons between ... | 10/17/2006 |
| 7117046 | Cascaded control of an average value of a process parameter to a desired value At least one of the multiple process parameters (MPPs) is a controllable process parameter (CTPP) and one is a targeted process parameter (TPP). The process also has a defined target limit (DTV) representing a first limit on an actual average value (AAV) of the TPP.... | 10/03/2006 |
| 7115304 | High throughput surface treatment on coiled flexible substrates One or more substrates may be coiled into one or more coils in such a way that adjacent turns of the coils do not touch one another. The one or more coiled substrates are placed in a treatment chamber where substantially an entire surface of the one or more coiled s... | 10/03/2006 |
| 7073311 | Odor control cassette A film is provided for use in a cassette. Preferably, the cassette is used in a waste disposal system. The film is a high density polyethylene film resin having both a low melt index and a high density, thereby providing improved odor control capabilities and enhanc... | 07/11/2006 |
| 7064089 | Plasma treatment apparatus and method for plasma treatment A plasma treatment apparatus and a method for plasma treatment are provided that made possible to control accurately a distance between plasma and an object to be treated (hereinafter referred to as an object), and that facilitated a transportation of a substrate th... | 06/20/2006 |
| 7056806 | Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces The present disclosure provides methods and apparatus useful in depositing materials on batches of microfeature workpieces. One implementation provides a method in which a quantity of a first precursor gas is introduced to an enclosure at a first enclosure pressure.... | 06/06/2006 |
| 7024266 | Substrate processing apparatus, method of controlling substrate, and exposure apparatus A substrate processing apparatus includes a first chamber, a second chamber which has a first valve, a second valve and a chuck, wherein a substrate is transferred to the second chamber through the first valve, held by the chuck in the second chamber, and then trans... | 04/04/2006 |
| 6949143 | Dual substrate loadlock process equipment One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. T... | 09/27/2005 |
| 6940047 | Heat treatment apparatus with temperature control system A floating substrate reactor allows heat treatment of a series of semiconductor substrates, one by one. The heat treatment occurs while flowing gas suspends a substrate between two heated surfaces of the reactor. The two heated surfaces each have multiple heating zo... | 09/06/2005 |
| 6936108 | Heat treatment device A film-forming unit of the invention includes: a processing furnace, gas-supplying means that supplies a process gas into the processing furnace, heating means that heats an inside of the processing furnace to a predetermined process-temperature, and a normal-pressu... | 08/30/2005 |
| 6932938 | Method and apparatus for containing and ejecting a thixotropic metal slurry A container system including a vessel for holding a thixotropic semi-solid aluminum alloy slurry during its processing as a billet and an ejection system for cleanly discharging the processed thixotropic semi-solid aluminum billet. The crucible is preferably formed ... | 08/23/2005 |
| 6912762 | Pallet de-banding machine with improved analytical abilities An automated de-banding machine which can perform by scanning the surface of the pallet to determine the number and position of bands to be removed. The machine also is capable of analyzing to determine the overlay bands from underlay bands. The overlay bands are re... | 07/05/2005 |
| 6907364 | Methods and apparatus for deriving thermal flux data for processing a workpiece Presented are methods, systems, and apparatus for deriving heat flux information and using heat flux information for a workpiece used in temperature sensitive processes. ... | 06/14/2005 |
| 6905333 | Method of heating a substrate in a variable temperature process using a fixed temperature chuck A method is provided for heating a substrate in a process chamber using a heated chuck. In accordance with the method, the substrate is lowered onto the chuck and heated to a first temperature less than a temperature of the chuck. The substrate is then raised away f... | 06/14/2005 |
| 6902395 | Multilevel pedestal for furnace A pedestal for use in a high temperature vertical furnace for the processing of semiconductor wafers provides a closure and heat insulation for the lower end of the furnace and is a wafer boat support. The pedestal, comprising quartz-enveloped insulation material, s... | 06/07/2005 |
| 6896513 | Large area substrate processing system A system and method for processing large area substrates is provided. In one embodiment, a processing system includes a transfer chamber having at least one processing chamber and a substrate staging system coupled thereto. The staging system includes a load lock ch... | 05/24/2005 |
| 6796795 | Method and apparatus for loading substrate in semiconductor manufacturing apparatus A method and apparatus for loading a substrate is applied to a semiconductor manufacturing apparatus in which a substrate is carried in a vacuum-processing chamber, and loaded on a heated processing table, and further is applied with predetermined processing in a co... | 09/28/2004 |
| 6764304 | Furnace having increased energy efficiency and reduced pollutant formation A furnace design that combines the benefits of oxygen enriched combustion, intense flame radiation, highly preheated combustion air, exhaust gas recirculation, buoyancy driven flows and NOx reburn chemistry in a single unit to significantly reduce energy ... | 07/20/2004 |
| 6746240 | Process tube support sleeve with circumferential channels A support sleeve for supporting a high temperature process tube comprises one or more circumferential channels, each channel connected to either a feed for gas or a vacuum exhaust. One circumferential channel opens to the top surface of the sleeve, on which the proc... | 06/08/2004 |
| 6746237 | Method and device for heat treating substrates Method and device for the heat treatment of substrates, wherein the substrates are positioned in the vicinity of a heated, essentially flat furnace body extending over the surface of the substrate. In order to provide a reproducible treatment when treating a number ... | 06/08/2004 |
| 6682343 | Substrate processing apparatus A substrate processing apparatus includes a substrate holder for holding a substrate with a holding angle of 45 degrees to 90 degrees with respect to a horizontal plane, a conveying system to convey the substrate with the substrate holder, a process chamb... | 01/27/2004 |
| 6672864 | Method and apparatus for processing substrates in a system having high and low pressure areas A positive pressure gradient is maintained across an open access port of an interface chamber such as a load lock chamber which provides an interface between a low pressure chamber such as a transfer or buffer chamber, and a high pressure area such as a s... | 01/06/2004 |
| 6582221 | Wafer boat and method for treatment of substrates A substrate holder for vertical furnaces is configured to support substrates in slots at inner portions of the substrates, rather than solely at the edges. The holder allows sufficient clearance above substantially the entire front face of the substrate t... | 06/24/2003 |
| 6561796 | Method of semiconductor wafer heating to prevent bowing Bowing of semiconductor wafers during heating is reduced by heating the wafers in a gas with a thermal conductivity and mean free path greater than that of oxygen, or by heating the wafers in a processing chamber under a pressure less than 0.1 Torr. In on... | 05/13/2003 |
| 6511315 | Substrate processing apparatus In a substrate processing apparatus, processing units are stacked in a multistage manner around a transport robot arranged at the center of a processing area for forming a processing part. In a second hierarchy, rotary coating units are arranged through a... | 01/28/2003 |
| 6450805 | Hot plate cooling method and heat processing apparatus In a heat processing apparatus for heating a wafer on a hot plate, a black plate having at least a rear face practically having a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles ont... | 09/17/2002 |
| 6444974 | Method for transferring a dummy wafer Dummy wafers of SiC having low light transmission properties to light from the light source of a photo-sensor are used, and when wafers undergoes a heat treatment, the dummy wafers are transferred from a wafer cassette to a wafer boat in which the number ... | 09/03/2002 |
