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Class 432/258 - Support structure for heat treating ceramics (e.g., saggars, etc.)


Subclass of Class 432 - Heating
Definition: Apparatus comprising structure for supporting a rigid or
No. of patents: 211
Last issue date: 03/13/2012


1            
NumberTitleIssue Date
8133049Modular refractory support system
A variable modular support system for use in a kiln, as well as a method of constructing such a support system in a kiln, comprises plurality of refractory blocks each having an upper surface and a lower surface and at least one transverse recess in either the upper...
03/13/2012
8118591Heat shield plate for substrate annealing apparatus
A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield p...
02/21/2012
8087931Device for supporting articles to be fired that has a defined compensation of thermal expansions
The present invention relates to a device for supporting, stacking, and transporting kiln run, in particular for firing ceramic products, comprising an assembly of supports and support beams, like carrier beams and cross beams, on which, in particular one or several...
01/03/2012
8002542Heat treatment jig and heat treatment jig set
A heat treatment jig includes a holding concave portion to hold an object and a void part formed near the holding concave portion and a thermal history variation of the object in a heat treatment process is reduced thereby. ...
08/23/2011
7717705Supporting device for articles to be fired that has an elastic support fixing
The present invention relates to a device for supporting, stacking and transporting kiln run, in particular, when firing ceramic products, comprising an assembly from supports and support beams, in particular carrier beams, cross beams, large plates or similar, on w...
05/18/2010
7618256Seal hardening furnace of liquid crystal display device having rack bar
A seal hardening furnace is presented in which seal lines in a liquid crystal display panel are hardened. The seal hardening furnace includes a cassette having a rack bar structure. The rack bar structure has rack bars for supporting the substrate along one directio...
11/17/2009
7484958Vertical boat for heat treatment and method for producing the same
A vertical boat 10 for heat treatment comprising a top plate 1, a bottom plate 2, and a column member fixed between the top plate and the bottom plate, a plurality of grooves 8 being formed in the column member, and a supporting part for ...
02/03/2009
7442038Heat treatment jig for semiconductor silicon substrate
This invention provides a heat treatment jig for semiconductor silicon substrates, which, in respective heat treatment of hydrogen annealing or argon annealing, can handle enlargement of the diameter of wafers to be treated and can also prevent slipping and dislocat...
10/28/2008
7413702Advanced sintering process and tools for use in metal injection molding of large parts
Tools and methods are provided for use in a process for sintering a metal injection molded body where the body comprises a material and having a first end, a second end, and a flowpath extending therebetween, the flowpath having a diameter. The tool assembly compris...
08/19/2008
7387835Silicon carbide-coated carbonaceous material and carbonaceous material to be coated with silicon carbide
The invention provides a SiC coated carbonaceous material and a carbonaceous material to be coated with SiC each of which is reduced in contents of such impurities as nitrogen and boron. The SiC coated carbonaceous material comprises a carbonaceous material and a Si...
06/17/2008
7384264Grid support system
A furnace furniture system comprises multiple shelves supported by a multiplicity of legs, each shelf having multiple openings therethrough. Each leg comprises: (i) at least one modular body having a bottom recess and a top protrusion, the top protrusion adapted to ...
06/10/2008
7377776Semiconductor wafer baking apparatus
A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space there...
05/27/2008
7362778Plesiochronous demultiplexer
A desynchronizer for extracting and desynchronizing a tributary signal from a multiplex signal at its original data rate has a buffer memory for temporarily storing tributary data bits extracted from the multiplex signal, an adjustable oscillator for generating a re...
04/22/2008
7357632Automated wood-fired pottery kiln
A kiln and method of firing a kiln are provided for use in connection with the firing of small-scale pottery firing. The kiln includes a kiln wall that defines a main kiln volume that is no larger than 60 cubic feet and is less than 10 cubic feet in one embodiment. ...
04/15/2008
7334690Substrate supporting rod and substrate cassette using the same
A substrate-supporting rod (4) includes a resin body (41) and a metal rod (43). The resin body (41) includes a body portion (411) being cylinder-shaped and having a first through hole (413) in a direction of the axis thereof...
02/26/2008
7331780Heat treatment jig for semiconductor wafer
A heat treatment jig by the invention comprising: the diameter of a disk-type structure being 60% or more of that of loaded semiconductor wafers; the thickness being 1.0 mm or more but 10 mm or less; the surface roughness Ra of 0.1 μm or more but 100 μm or less at...
02/19/2008
7332691Cooling plate, bake unit, and substrate treating apparatus
A bake unit includes a cooling plate for cooling a substrate and a lift pin assembly for loading a substrate on the cooling plate. When a wafer is cooled on the cooling plate, a guide groove is formed at the cooling plate to allow a space between the wafer and the c...
02/19/2008
7332228Coated refractory metal plate having oxide surface layer, and setter which uses the same and which is used in sintering
A setter used in sintering and having an oxide coating layer is configured such that oxide powder of at least one of, or a mixture of oxide powders of two or more of alumina, silica, zirconia, yttria, titania, magnesia, and calcia is deposited to at least one surfac...
02/19/2008
7329947Heat treatment jig for semiconductor substrate
When a two-division structure heat treatment jig for semiconductor substrate that includes a silicon first jig that comes into direct contact with a semiconductor substrate that is heat treated and supports the semiconductor substrate, and a second jig (holder) that...
02/12/2008
7326309Method of producing ceramic laminate body
This invention provides a method of producing a ceramic laminate body capable of suppressing the occurrence of de-lamination and cracks, and providing high reliability. This method comprises a heat-bonding step of covering a full periphery of side surfaces of cerami...
02/05/2008
7283734Rapid thermal processing apparatus and method of manufacture of semiconductor device
A rapid thermal processing apparatus comprises a processing chamber which subjects a semiconductor substrate to rapid thermal processing. A substrate support part is arranged in the processing chamber and supports the substrate. A lamp part optically irradiates the ...
10/16/2007
7278813Automated processing system
An automated processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress wafers or articles. Process chambers are located in the process...
10/09/2007
7241141Low contact SiC boat for silicon nitride stress reduction
A vertical wafer boat for supporting at least one semiconductor wafer, formed by a process includes forming a plurality of angled support grooves into a plurality of support members with a groove-making machine. Each support member extends along a longitudinal axis ...
07/10/2007
7223950Microwave burning furnace including heating element having two types of materials
A microwave burning furnace including a housing constituted by a metal on which a microwave is to be irradiated, a metallic door provided in the housing, a burning chamber provided in the housing and surrounded by a material having a low microwave absorption charact...
05/29/2007
7219802Thin wafer insert
A plastic insert (20) is configured to provide support of thin wafers (49) in wafer carriers (45) configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the, methods...
05/22/2007
7210924Heat treatment system and a method for cooling a loading chamber
There is provided a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer trans...
05/01/2007
7204887Wafer holding, wafer support member, wafer boat and heat treatment furnace
The present invention provides a wafer holder, a wafer support member, a wafer boat and a heat treatment furnace, which are capable of sufficiently suppressing slip dislocations, without lowering productivity and at low cost, in the high temperature heat treatment o...
04/17/2007
7204888Lift pin assembly for substrate processing
Embodiments of the present invention provide an apparatus for constraining and supporting the lift pins to prevent or minimize lateral movement of the lift pins that causes substrate hand-off problems and associated degradation in substrate processing characteristic...
04/17/2007
7201280Wafer boat for consolidation of porous thin layer
A wafer boat for consolidation of a porous oxide layer structure is provided. The wafer boat includes at least one support plate including: a first plate for supporting a substrate with the porous oxide layer by face-to-face contact; a second plate radially extendin...
04/10/2007
7184657Enhanced rapid thermal processing apparatus and method
A heating arrangement heats a first major surface of a workpiece with an illumination energy such that a first portion of the illumination energy is directly incident upon the first major surface of the workpiece and a second portion of the illumination energy is di...
02/27/2007
7163393Heat treatment jig for semiconductor silicon substrate
This invention provides a heat treatment jig for semiconductor silicon substrates, which, in respective heat treatment of hydrogen annealing or argon annealing, can handle enlargement of the diameter of wafers to be treated and can also prevent slipping and dislocat...
01/16/2007
7160105Temperature controlled vacuum chuck
A temperature controllable vacuum chuck includes a mounting bracket, a porous plate, a heating element, and a temperature sensor. The porous plate is mounted to the mounting bracket and is configured for securing a substrate to the vacuum chuck when air is suctioned...
01/09/2007
7150628Single-wafer type heat treatment apparatus for semiconductor processing system
A single-substrate heat-processing apparatus (2) for a semiconductor processing system includes a process container (4) configured to accommodate a target substrate (W). A support member (6) is disposed in the process container (4) and co...
12/19/2006
7125600Setter, method for manufacturing ceramic substrate, and ceramic substrate
A setter and a method for manufacturing a ceramic substrate are capable of suppressing deformation such as warpage occurring in a ceramic substrate after baking. A ceramic green sheet 4 is mounted and baked on a mount surface of a zirconia setter wherein an average ...
10/24/2006
7090751Apparatus and methods for electrochemical processing of microelectronic workpieces
A processing chamber comprising a reaction vessel having an electro-reaction cell including a virtual electrode unit, an electrode assembly disposed relative to the electro-reaction cell to be in fluid communication with the virtual electrode unit, and an electrode ...
08/15/2006
7077917High-pressure processing chamber for a semiconductor wafer
A processing chamber having an improved sealing means is disclosed. The processing chamber comprises a lower element, an upper element, and a sealing means that tightly holds the lower element to the upper element to define a processing volume that is maintained usi...
07/18/2006
7077913Apparatus for fabricating a semiconductor device
A semiconductor fabricating apparatus having a structure, which facilitates a loading and unloading operation of wafers while having a low effect by a high temperature during a heat treatment. The semiconductor fabricating apparatus includes a plurality of ring-shap...
07/18/2006
7066731Method for conditioning/heat treatment
A method for heat treatment of printing plates includes arranging a plurality of printing plates into a stack, interspersing a plurality of thermally conductive plates at a plurality of levels in the stack, and placing the stack of plurality of printing plates with ...
06/27/2006
7060422Method of supercritical processing of a workpiece
An apparatus for supercritical processing and non-supercritical processing of a workpiece comprises a transfer module, a supercritical processing module, a non-supercritical processing module, and a robot. The transfer module includes an entrance. The supercritical ...
06/13/2006
7056848Nonporous keatite glass ceramic support plate for transporting products during heat treatment, method of making same and method of transporting products therewith
The support plate for transporting products during thermal treatment at firing temperatures is a nonporous keatite glass ceramic supporting member without a glassy surface layer. It has a nubby structure on an underside thereof and preferably C-shaped rounded edges....
06/06/2006
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