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| Number | Title | Issue Date |
| 8147242 | Substrate supporting/transferring tray To provide a substrate supporting/transferring tray, which can be placed on a substrate supporting part arranged in a treatment chamber in which the heat treatment is performed to a substrate, especially on a substrate supporting part having a built-in heating means... | 04/03/2012 |
| 7927096 | Substrate support structure, heat treatment apparatus using same, first sheet-like object for use in the substrate support structure, method of manufacturing the substrate support structure, heat treatment apparatus, and substrate sucking method A heat treatment apparatus includes a support sheet placed on an upper surface of a heat-treating plate. The support sheet has, formed on an upper surface thereof, projections for contacting and supporting a substrate, and a lip for contacting edge regions of the su... | 04/19/2011 |
| 7819658 | Heat treatment system and method therefore Disclosed herein is a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer tra... | 10/26/2010 |
| 7625205 | Heat treatment apparatus and method of manufacturing substrates A heat treatment device and a method of manufacturing substrates capable of reducing the slippage of the substrates when the substrates are supported on support parts comprising plate-like members. The device comprises a support device having the support parts in co... | 12/01/2009 |
| 7517217 | Method and apparatus for heat processing of substrate The present invention relates to a method for heat processing of a substrate having the step of baking a substrate, on which a coating film is formed, at a predetermined high temperature, comprising a first step of increasing the substrate from a predetermined low t... | 04/14/2009 |
| 7429168 | Oven protection system for a thermo-forming machine An oven protection system for a thermo-forming machine having a source of heat for heating a workpiece. The oven protection system includes a barrier that is movable from a stored position to a deployed position between the source of heat and the workpiece in respon... | 09/30/2008 |
| 7362778 | Plesiochronous demultiplexer A desynchronizer for extracting and desynchronizing a tributary signal from a multiplex signal at its original data rate has a buffer memory for temporarily storing tributary data bits extracted from the multiplex signal, an adjustable oscillator for generating a re... | 04/22/2008 |
| 7354874 | Variable exhaust static pressure management apparatus The present invention is directed to a semiconductor apparatus that enables in situ wet processing of semiconductor wafers, and prevents creation of a static pressure within the in situ wet processing system. The apparatus comprises multiple exhaust receptacles. Eac... | 04/08/2008 |
| 7350684 | Apparatus and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 04/01/2008 |
| 7341641 | Bonding device for manufacturing liquid crystal display device A bonding device for manufacturing a liquid crystal display device includes a bonding chamber for bonding first and second substrates and an ionizing device for introducing ionized gas or air into the bonding chamber. ... | 03/11/2008 |
| 7331780 | Heat treatment jig for semiconductor wafer A heat treatment jig by the invention comprising: the diameter of a disk-type structure being 60% or more of that of loaded semiconductor wafers; the thickness being 1.0 mm or more but 10 mm or less; the surface roughness Ra of 0.1 μm or more but 100 μm or less at... | 02/19/2008 |
| 7329947 | Heat treatment jig for semiconductor substrate When a two-division structure heat treatment jig for semiconductor substrate that includes a silicon first jig that comes into direct contact with a semiconductor substrate that is heat treated and supports the semiconductor substrate, and a second jig (holder) that... | 02/12/2008 |
| 7282183 | Atmospheric control in reaction chambers Apparatus and methods are disclosed for controlling atmospheric characteristics inside a chamber. An apparatus comprises a mechanism for diffusively introducing pressurized gas into the apparatus, an outlet element in fluid communication with the mechanism, and a ch... | 10/16/2007 |
| 7259777 | Scanner system Apparatus for holding flat plates of varying sizes, including a base section having a flat surface and including plurality of interconnected channels formed on the surface thereof; at least one port connecting to the channels; a vacuum source connected to the at lea... | 08/21/2007 |
| 7241672 | Method and apparatus for rapid cooldown of annealed wafer A method for annealing a semiconductor substrate. The method includes turning on at least one heat source, heating a semiconductor substrate in a chamber, turning off the at least one heat source, and cooling the semiconductor substrate in the chamber. The heating a... | 07/10/2007 |
| 7241140 | Burning oven A burning oven is provided, and has a housing that surrounds a combustion chamber in which material that is to be burned can be introduced after the housing is opened and can be placed upon a combustion chamber base. A deposit element is disposed externally of the c... | 07/10/2007 |
| 7219802 | Thin wafer insert A plastic insert (20) is configured to provide support of thin wafers (49) in wafer carriers (45) configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the, methods... | 05/22/2007 |
| 7210925 | Heat treatment jig for silicon semiconductor substrate A heat treatment jig for supporting silicon semiconductor substrates by contacting, being loaded onto a heat treatment boat in a vertical heat treatment furnace, comprises; the configuration of a ring or a disc structure with the wall thickness between 1.5 and 6.0 m... | 05/01/2007 |
| 7210924 | Heat treatment system and a method for cooling a loading chamber There is provided a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer trans... | 05/01/2007 |
| 7207763 | Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system A semiconductor manufacturing system and wafer holder for a semiconductor manufacturing system which prevents a semiconductor wafer from being exposed to a process reaction and which includes a reaction tube for providing a sealed process space and a dual boat and w... | 04/24/2007 |
| 7204887 | Wafer holding, wafer support member, wafer boat and heat treatment furnace The present invention provides a wafer holder, a wafer support member, a wafer boat and a heat treatment furnace, which are capable of sufficiently suppressing slip dislocations, without lowering productivity and at low cost, in the high temperature heat treatment o... | 04/17/2007 |
| 7198447 | Semiconductor device producing apparatus and producing method of semiconductor device A semiconductor device producing apparatus is disclosed. The apparatus includes a carrier-holding stage for placing a carrier; first, second and third stages each for holding first and second boats one at a time, each boat holding one or more substrates; a boat tran... | 04/03/2007 |
| 7196419 | Transport speed monitoring apparatus and semiconductor processing system utilizing the same A semiconductor processing system utilizing transport speed monitoring of a wafer boat. The semiconductor processing comprises a process chamber, loading device, and transport speed monitoring device. The loading device transports a boat of wafers into and out of th... | 03/27/2007 |
| 7192494 | Method and apparatus for annealing copper films A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system. ... | 03/20/2007 |
| 7179334 | System and method for performing semiconductor processing on substrate being processed A semiconductor process system (10) includes a measuring section (40), an information processing section (51), and a control section (52). The measuring section (40) measures a characteristic of a test target film formed on a targe... | 02/20/2007 |
| 7175026 | Memory disk shipping container with improved contaminant control A container for disks has an improved latching mechanism. The container comprises a cassette with sidewalls with slots for holding disks in an axial arrangement, two opposite end walls each have a U-shaped recess extending downwardly from the open top, a top cover w... | 02/13/2007 |
| 7163393 | Heat treatment jig for semiconductor silicon substrate This invention provides a heat treatment jig for semiconductor silicon substrates, which, in respective heat treatment of hydrogen annealing or argon annealing, can handle enlargement of the diameter of wafers to be treated and can also prevent slipping and dislocat... | 01/16/2007 |
| 7151239 | Heat treating apparatus and heat treating method A heat treating apparatus is provided to apply a heat treatment on a substrate. Prior to the heat treatment, an exclusive transfer mechanism transfers the substrate from a cooling plate onto a heating plate for heating the substrate. Before mounting the substrate on... | 12/19/2006 |
| 7141309 | High thermal conductive material having high thermal conductivity and process for producing the same A high thermal conductive material includes substantially silicon carbide and metal silicon, and preferably is formed by impregnating the space between the bonded silicon carbide crystals with the metal silicon. The production process comprises adding an organic bin... | 11/28/2006 |
| 7127794 | Auto-boating process According to one embodiment of the invention, a method for auto-boating includes supporting a tape substrate having first and second end portions on a boat, sandwiching the first and second end portions between respective ones of a pair of end sleeves and the boat, ... | 10/31/2006 |
| 7125600 | Setter, method for manufacturing ceramic substrate, and ceramic substrate A setter and a method for manufacturing a ceramic substrate are capable of suppressing deformation such as warpage occurring in a ceramic substrate after baking. A ceramic green sheet 4 is mounted and baked on a mount surface of a zirconia setter wherein an average ... | 10/24/2006 |
| 7115840 | Wafer bake apparatus A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between ... | 10/03/2006 |
| 7094994 | Heat treatment apparatus and method of semiconductor wafer A semiconductor wafer heat treatment apparatus and method, which can carry out a heat treatment to suppress variations in line widths within a surface on a semiconductor wafer and the like, includes: a heating plate for heating a semiconductor wafer to a predetermin... | 08/22/2006 |
| 7047706 | DPA automated assembly and packaging machine This patent relates to a machine that automatically assembles, inspects, and packages disposable prophylaxis angles. The machine includes a movable table including a plurality of fixtures on which angle components are assembled and the assembled angles are inspected... | 05/23/2006 |
| 7032287 | Edge grip chuck An actuated edge grip chuck includes tabs with raised portions that press against the side of a substrate as opposed clamping on the top or bottom surfaces. The edge grip chuck includes a solid-state actuator to move a moveable tab into an open position. The solid-s... | 04/25/2006 |
| 7033168 | Semiconductor wafer boat for a vertical furnace A wafer boat for use in heat treatment of semiconductor wafers in a vertical furnace comprises support rods extending generally vertically when the wafer boat is placed in the vertical furnace. Fingers are supported by and extend along vertical extent of the support... | 04/25/2006 |
| 7021635 | Vacuum chuck utilizing sintered material and method of providing thereof A vacuum chuck for holding a semiconductor wafer during high pressure, preferably supercritical, processing comprising: a wafer holding region for holding the wafer; a vacuum region for applying vacuum to a surface of the wafer, the vacuum region within the wafer ho... | 04/04/2006 |
| 7022192 | Semiconductor wafer susceptor A semiconductor wafer susceptor for batch substrate processing. The susceptor includes a central region in a primary plane and a plurality of flat annular extensions extending below the central region in a secondary plane. The primary and secondary planes are parall... | 04/04/2006 |
| 7018504 | Loadlock with integrated pre-clean chamber A wafer carrier adapted to hold a plurality of wafers and is positioned on an elevator plate in a load lock. The elevator plate is adapted to move between a first position with the carrier in a first chamber of the load lock and a second position with the carrier in... | 03/28/2006 |
| 7005249 | Apparatus for processing substrate and method of processing the same A heating apparatus for a substrate to be processed with a coating film has a chamber with an inner space, a heating plate heating the substrate to be processed in the inner space, and a partition member. The heating plate has a support surface which supports the su... | 02/28/2006 |
