Did You Know...
...that one person who claimed to be the inventor of the television is Russian emigre Vladimir Zworykin? In 1929 David Sarnoff, founder of RCA, asked Zworykin what it would take to develop TV for commercial use. He said: a year and a half and $100,000. In reality, it took 20 years and $50 million! Before his death in 1982 at the age of 92, Zworykin said of his invention: "The technique is wonderful. It is beyond my expectations. But the programs! I would never let my children even come close to this thing."
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| Number | Title | Issue Date |
| 8163469 | Coating and developing apparatus, coating and developing method, and storage medium A coating and developing apparatus has: a treatment block-including a water repellent module performing water repellent treatment on a substrate, a coating module, and a developing module; a substrate side-surface portion water repellent module for performing water ... | 04/24/2012 |
| 8148054 | Immersion multiple-exposure method and immersion exposure system for separately performing multiple exposure of micropatterns and non-micropatterns This invention discloses an immersion multiple-exposure method including a first exposure step of performing, using a first mask, immersion exposure of a photoresist film formed on a substrate, a cleaning step of clearing the surface of the substrate, and a second e... | 04/03/2012 |
| 8110345 | High resolution lithography system and method Provided are a high resolution lithography system and method. In one example, a method for producing a pattern on a substrate includes separating the pattern into at least a first sub-pattern containing lines oriented in a first direction and a second sub-pattern co... | 02/07/2012 |
| 8105765 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device by performing divisional exposure on a predetermined area on a wafer, through two or more reticles, on each of which a mask pattern region is formed. The method includes arranging the reticles such that an outer most ... | 01/31/2012 |
| 8097402 | Using electric-field directed post-exposure bake for double-patterning (D-P) The invention provides a method of processing a substrate using Double-Patterning (D-P) processing sequences and Electric-Field Enhanced Layers (E-FELs). The D-P processing sequences and E-FELs can be used to create lines, trenches, vias, spacers, contacts, and gate... | 01/17/2012 |
| 8092986 | Exposure methods The present disclosure provides an exposure method for a semiconductor device, in which whether a specific pattern corresponds to a sparse area or a dense area is decided to employ a specific phase-shift mask and by which critical dimension uniformity and resolution... | 01/10/2012 |
| 8071278 | Multiple patterning technique using a single reticle Double patterning using a single reticle. A blading technique may be used to allow a single reticle to be used for double patterning. The reticle is placed into a lithographic apparatus and a first portion of the pattern is exposed onto a first photoresist overlayin... | 12/06/2011 |
| 7981595 | Reduced pitch multiple exposure process A lithographic method to enhance image resolution in a lithographic cluster using multiple projections and a lithographic cluster used to project multiple patterns to form images that are combined to form an image having enhanced resolution. ... | 07/19/2011 |
| 7977038 | Substrate processing method, substrate processing system, and computer-readable recording medium recording program thereon In the present invention, the position of a substrate on a thermal plate is detected when baking after exposure is performed in a first round of patterning. In a second round of patterning, the setting position of the substrate is adjusted based on a detection resul... | 07/12/2011 |
| 7968277 | Imaging post structures using X and Y dipole optics and a single mask A photolithographic method uses different exposure patterns. In one aspect, a photo-sensitive layer on a substrate is subject to a first exposure using optics having a first exposure pattern, such as an x-dipole pattern, followed by exposure using optics having a se... | 06/28/2011 |
| 7955787 | Plasma display panel manufacturing method The present invention provides a method of manufacturing a PDP that prevents defects due to dust adhering to a photomask, for example, from occurring in a structure of the PDP. In photolithography, exposure is performed twice in a same process, and photomask (22 | 06/07/2011 |
| 7919231 | Photolithographic method and mask devices utilized for multiple exposures in the field of a feature A photolithographic method for forming a plurality of characters on a device utilizes a mask set that includes a plurality of photolithographic masks, wherein each mask includes at least one non-opaque mask character field area that surrounds a non-opaque mask chara... | 04/05/2011 |
| 7901872 | Exposure process and photomask set used therein An exposure process is described, for defining in a photoresist layer a plurality of first patterns having a first pitch and a second pattern between them that is wider than one first pattern. A first exposure step is conducted to the photoresist layer with a first ... | 03/08/2011 |
| 7887999 | Method of making a pillar pattern using triple or quadruple exposure Methods of making pillar shaped device array using a triple or quadruple exposure technique are described. A plurality of pillar shaped devices are formed arranged in a hexagonal or rectangular pattern. ... | 02/15/2011 |
| 7879537 | Reticle and technique for multiple and single patterning Double patterning is achieved with a single reticle while maintaining the integrity of in-scribe patterns and without blading the reticle. In-scribe structures may or may not be double patterning. For example, elements such as electrical test structures might have f... | 02/01/2011 |
| 7867698 | Reticle system for manufacturing integrated circuit systems A reticle system that includes: providing a reticle system; and assigning two or more of an image pattern onto the reticle system to form one or more layers of an integrated circuit system by grouping and pairing each of the image pattern onto the reticle system acc... | 01/11/2011 |
| 7862991 | Method for fabricating recess pattern in semiconductor device A method for fabricating a recess pattern in a semiconductor device includes forming a photoresist layer over a substrate including active regions, performing a first photo-exposure process on the photoresist layer using a photo mask including repeatedly formed line... | 01/04/2011 |
| 7851141 | Flat panel display manufacturing A method includes exposing a photo-resist layer using a first exposure machine that has a first resolution to cause the photo-resist layer to have an exposed portion and an un-exposed portion. The photo-resist layer is exposed using a second exposure machine that ha... | 12/14/2010 |
| 7838208 | Programmable self-aligning liquid magnetic nanoparticle masks and methods for their use Magnetic nanoparticle masks for lithographic applications of a substrate and methods for producing such masks via defining regions of localized magnetic field maxima and minima on a substrate are provided. Also provided are methods for producing multi-component patt... | 11/23/2010 |
| 7838209 | Method of reducing the impact of stray light during optical lithography, devices obtained thereof and masks used therewith A method of reducing the influence of the spread of the transmitted light on the feature size during optical lithography is disclosed. The method comprises at least two irradiation steps. During a first irradiation the resist is exposed with the original mask, i.e.,... | 11/23/2010 |
| 7829269 | Dual tone development with plural photo-acid generators in lithographic applications A method and system for patterning a substrate using a dual tone development process is described. The method comprises use of plural photo-acid generators with or without a flood exposure of the substrate to improve process latitude for the dual tone development pr... | 11/09/2010 |
| 7816072 | Positive resist composition and method for forming resist pattern A positive resist composition for producing MEMS using an electron beam, the composition comprising a resin component (A) that displays increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid upon irradiation, wh... | 10/19/2010 |
| 7807342 | Transmission mask with differential attenuation to improve ISO-dense proximity An apparatus, system and method to compensate for the proximity effects in the imaging of patterns in a photolithography process. A light exposure of a photoresist layer is effectuated in predetermined patterns through an exposure mask having light-transmissive open... | 10/05/2010 |
| 7807343 | EDA methodology for extending ghost feature beyond notched active to improve adjacent gate CD control using a two-print-two-etch approach In accordance with various embodiments, semiconductor devices and methods of forming semiconductor devices having non-rectangular active regions are provided. An exemplary method includes using a first mask to form a plurality of first features over a non-rectangula... | 10/05/2010 |
| 7749690 | Die identification systems and methods Systems and methods are disclosed herein to provide die identification. For example, in accordance with an embodiment of the present invention, a wafer patterning technique is disclosed that provides multiple-exposure patterning to provide a unique identifying mark ... | 07/06/2010 |
| 7749691 | Method of manufacturing a photoelectric conversion device using a plurality of reticles A method of manufacturing a photoelectric conversion device. The method includes the steps of arranging a plurality of reticles, on each of which a mask pattern region is formed, in an arrangement direction and using at least two of the plurality of reticles in the ... | 07/06/2010 |
| 7736844 | Overlay mark and method of forming the same An overlay mark may include a main overlay pattern and an auxiliary overlay pattern, wherein the main overlay pattern may have an opening exposing a substrate and the auxiliary overlay pattern may be formed in the opening. The auxiliary overlay pattern may be spaced... | 06/15/2010 |
| 7723016 | Method for forming resist pattern and method for manufacturing a semiconductor device The resist material contains a photo-acid generator having an absorption peak to exposure light having a wavelength of less than 300 nm, and a second photo-acid generator having an absorption peak to exposure light having a wavelength of 300 nm or more. The method f... | 05/25/2010 |
| 7674574 | Method of arranging mask patterns A method of arranging mask patterns, which includes a first mask has a first mask pattern, a second mask has a second mask pattern. The distance between the first mask boundary and the first mask pattern boundary is different form the distance between the second mas... | 03/09/2010 |
| 7601485 | Exposure method An exposure method for exposing a resist film disposed on one surface of a wafer includes a first exposure step of locating an exposure mask at a first predetermined position with respect to the wafer, and exposing the resist film. The exposure method further includ... | 10/13/2009 |
| 7553611 | Masking of repeated overlay and alignment marks to allow reuse of photomasks in a vertical structure In formation of monolithic three dimensional memory arrays, a photomask may be used more than once. Reuse of a photomask creates second, third or more instances of reference marks used by the stepper to achieve alignment (alignment marks) and to measure alignment ac... | 06/30/2009 |
| 7517642 | Plane waves to control critical dimension The present invention describes an aperture including: an opaque plate; two sliver openings located in the opaque plate, the two sliver openings having rectangular shapes, the two sliver openings being parallel to each other. The present invention further describes ... | 04/14/2009 |
| 7473523 | Systems and methods for modifying features in a semi-conductor device Systems and methods for modifying features of a semiconductor device. The systems and methods of the invention modify features of a semiconductor device according to the amount of exposure dose of light to which a common reticle field of a semiconductor device is ex... | 01/06/2009 |
| 7442477 | Exposing apparatus and exposing method, for maskless exposure of substrate to be exposed, and plotter and plotting method for directly plotting on object to be plotted An exposing apparatus for irradiating desired spots on a substrate to be exposed relatively moving with respect to two or more light sources arranged along the direction of the relative movement to form a desired exposure pattern using the light sources comprises a ... | 10/28/2008 |
| 7435535 | Method for forming patterned insulating elements and methods for making electron source and image display device A method for forming patterned insulating elements on a substrate includes a plurality of exposure steps of exposing a photosensitive paste provided on the substrate through at least one mask having a predetermined pattern; a developing step of developing the expose... | 10/14/2008 |
| 7432024 | Lithographic template and method of formation and use This invention relates to semiconductor devices, microelectronic devices, micro electro mechanical devices, microfluidic devices, photonic devices, and more particularly to a lithographic template, a method of forming the lithographic template and a method for formi... | 10/07/2008 |
| 7432041 | Method and systems to print contact hole patterns A method for forming an arbitrary pattern of sub-micron contact holes in a substrate using a combination of interferometric photolithography and optical photolithography with a non-critical mask. The substrate is covered with a photosensitive material and is exposed... | 10/07/2008 |
| 7422842 | Reduced loss high efficiency diffractive and associated methods A sub-wavelength anti-reflective diffractive structure is incorporated with a base diffractive structure having a small period to form a high efficiency diffractive structure. In the high efficiency diffractive structure, the anti-reflective structure and/or the bas... | 09/09/2008 |
| 7422841 | Exposure control for phase shifting photolithographic masks Mask and integrated circuit fabrication approaches are described to facilitate use of masks where substantially all of a layout is defined using phase shifting. Exposure settings including relative dosing between the phase shift mask and the trim masks are described... | 09/09/2008 |
| 7419767 | Phase-shifting mask and method of forming pattern using the same A phase-shifting mask suppresses increase of the minimum pattern-element size due to optical proximity effect. The mask a first pattern region formed on a transparent substrate, including a first blocking part for forming at least one first pattern element. The mask... | 09/02/2008 |
