Bizarre Patents
Vehicular Impact Signaling Device
An apparatus for the deployment of a visible plume to alert other motorists that a proximate motor vehicle has been involved in a collision.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7989148 | Method for forming photoelectric composite board In a method for forming a photoelectric composite board (10) on which a photoelectric transducer (5) is mounted, photo-masks (111, 112, 113) which are used in processes to form the photoelectric composite board (10) are respectively dispo... | 08/02/2011 |
| 7754416 | Process for producing resist pattern and conductor pattern This process for producing a resist pattern includes: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a ph... | 07/13/2010 |
| 7553609 | Manufacturing method of piezoelectric vibrating piece, piezoelectric vibrating piece, piezoelectric vibrator, oscillator, electronic equipment and radio-controlled timepiece There are provided a piezoelectric vibrating piece, which has been more miniaturized and whose efficiency has been more increased, by easily and certainly electrode-dividing an exciting electrode, and a manufacturing method of the same. There is provided a manufactu... | 06/30/2009 |
| 7435537 | Fluorinated half ester of maleic anhydride polymers for dry 193 nm top antireflective coating application The present invention discloses a composition suitable for use as a top antireflective coating and barrier layer for 193 nm lithography. The inventive composition is soluble in aqueous base solutions and has low refractive index at 193 nm. The inventive composition ... | 10/14/2008 |
| 7427360 | Process and ink for making electronic devices A process for making an electronic device comprising a dielectric substrate laminated with an electrically conductive metal or alloy which comprises applying a non-aqueous etch-resistant ink by ink jet printing to selected areas of the metal or alloy, exposing the e... | 09/23/2008 |
| 7425276 | Method for etching microchannel networks within liquid crystal polymer substrates The present invention provides for a method for the fabrication of microchannels, and more particularly to the fabrication of microchannels for use in Microelectromechanical (MEMS) devices and MEMS related devices. In accordance with an embodiment of the present inv... | 09/16/2008 |
| 7425403 | Composition for forming anti-reflective coating for use in lithography A composition for forming anti-reflective coating for use in a lithographic process in manufacture of a semiconductor device, comprising as a component a resin containing cyanuric acid or a derivative thereof, or a resin containing a structural unit derived from cya... | 09/16/2008 |
| 7419768 | Methods of fabricating integrated circuitry The invention includes methods of fabricating integrated circuitry and semiconductor processing polymer residue removing solutions. In one implementation, a method of fabricating integrated circuitry includes forming a conductive metal line over a semiconductor subs... | 09/02/2008 |
| 7415761 | Method of manufacturing multilayered circuit board An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an... | 08/26/2008 |
| 7381508 | Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same An integrated circuit semiconductor device including a cell region formed in a first portion of a silicon substrate, the cell region including a first trench formed in the silicon substrate, a first buried insulating layer filled in the first trench, a first insulat... | 06/03/2008 |
| 7371485 | Multi-step process for etching photomasks Method and apparatus for etching a metal layer disposed on a substrate, such as a photolithographic reticle, are provided. In one aspect, a method is provided for processing a photolithographic reticle including positioning the reticle on a support member in a proce... | 05/13/2008 |
| 7371499 | Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same A photoresist resin composition comprises about 10 to about 35% by weight of an acryl-based copolymer, about 5 to about 10% by weight of a quinone diazide compound, about 55 to about 80% by weight of a solvent, and about 0.01 to about 0.5% by weight of a silane-base... | 05/13/2008 |
| 7361614 | Method of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry This invention includes methods of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry, and to methods of forming trench isolation in the fabrication of integrated circuitry. In one implementation, a method of depositing a silico... | 04/22/2008 |
| 7354865 | Method for removal of pattern resist over patterned metal having an underlying spacer layer A method of removing the pattern resist that remains on a microchip wafer after etching a patterned layer that is supported by a spacer layer. After the etch, the wafer is cleaned with a develop clean process that removes polymer residues from the pattern resist sur... | 04/08/2008 |
| 7344826 | Method for forming a capacitor In a method for forming a photoresist pattern, a method for forming a capacitor, and a capacitor manufactured using the same, a light is selectively irradiated onto a selected portion of a photoresist film formed on a substrate. An interfered light generated from th... | 03/18/2008 |
| 7338614 | Vapor HF etch process mask and method A method of processing a semiconductor wafer provides a wafer, and then forms an organic mask on at least a portion of the wafer. The method then applies a vapor etching process to the wafer through holes in the organic mask. ... | 03/04/2008 |
| 7326523 | Low refractive index polymers as underlayers for silicon-containing photoresists A new underlayer composition that exhibits high etch resistance and improved optical properties is disclosed. The underlayer composition comprises a vinyl or acrylate polymer, such as a methacrylate polymer, the polymer comprising at least one substituted or unsubst... | 02/05/2008 |
| 7323292 | Process for using photo-definable layers in the manufacture of semiconductor devices and resulting structures of same A process and related structure are disclosed for using photo-definable layers that may be selectively converted to insulative materials in the manufacture of semiconductor devices, including for example dynamic random access memories (DRAMs), synchronous DRAMs (SDR... | 01/29/2008 |
| 7320855 | Silicon containing TARC/barrier layer A top anti-reflective coating material (TARC) and barrier layer, and the use thereof in lithography processes, is disclosed. The TARC/barrier layer may be especially useful for immersion lithography using water as the imaging medium. The TARC/barrier layer comprises... | 01/22/2008 |
| 7318992 | Lift-off positive resist composition A lift-off positive resist composition capable of forming a fine lift-off pattern is provided. This composition comprises a base resin component (A) and an acid generator component (B) generating an acid under exposure, wherein the base resin component (A) is a sili... | 01/15/2008 |
| 7317602 | Electrostatic discharge guide and liquid crystal display utilizing same An electrostatic discharge guide comprises a ground wire isolated from a data line. The ground wire has a main ground segment and at least one electrostatic discharge triggering segment connected to the main ground segment. ... | 01/08/2008 |
| 7303855 | Photoresist undercoat-forming material and patterning process An undercoat-forming material comprising a novolak resin having a fluorene or tetrahydrospirobiindene structure, an organic solvent, an acid generator, and a crosslinker, optionally combined with an intermediate layer having an antireflective effect, has an absorpti... | 12/04/2007 |
| 7297452 | Photosensitive resin composition, thin film panel made with photosensitive composition, and method for manufacturing thin film panel A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The surfactant includes an organic fluorine compound having the structure a first silicone compound having... | 11/20/2007 |
| 7279257 | Pattern forming method, method of manufacturing thin film transistor substrate, method of manufacturing liquid crystal display and exposure mask The invention relates to a pattern forming method, a method of manufacturing a TFT substrate, a method of manufacturing a liquid crystal display and an exposure mask and provides a pattern forming method, a method of manufacturing a TFT substrate, a method of manufa... | 10/09/2007 |
| 7276327 | Silicon-containing compositions for spin-on arc/hardmask materials Antireflective compositions characterized by the presence of an Si-containing polymer having pendant chromophore moieties are useful antireflective coating/hardmask compositions in lithographic processes. These compositions provide outstanding optical, mechanical an... | 10/02/2007 |
| 7271410 | Active matrix circuit An active matrix circuit comprises a semiconductor layer, and a p-type impurity region provided in said semiconductor layer, and an interlayer insulating film comprising silicon nitride provided over said semiconductor layer. ... | 09/18/2007 |
| 7267859 | Thick porous anodic alumina films and nanowire arrays grown on a solid substrate The presently disclosed invention provides for the fabrication of porous anodic alumina (PAA) films on a wide variety of substrates. The substrate comprises a wafer layer and may further include an adhesion layer deposited on the wafer layer. An anodic alumina templ... | 09/11/2007 |
| 7268070 | Profile improvement method for patterning There is a grain phenomenon issue of rough sidewall for patterning. Thus, imprecise grain profiles would be observed. As the critical dimensions of integrated circuit microelectronics fabrication device have decreased, the effect of grain phenomenon have become more... | 09/11/2007 |
| 7259104 | Sample surface processing method A surface processing method of a sample having a mask layer that does not contain carbon as a major component formed on a substance to be processed, the substance being a metal, semiconductor and insulator deposited on a silicon substrate, includes the steps of inst... | 08/21/2007 |
| 7256667 | Waveguide device and method for making same A monolithic micromachined waveguide device or devices with low-loss, high-power handling, and near-optical frequency ranges is set forth. The waveguide and integrated devices are capable of transmitting near-optical frequencies due to optical-quality sidewall rough... | 08/14/2007 |
| 7255892 | Molecular layer and method of forming the same A molecular layer includes a Langmuir-Blodgett (LB) film of a molecule connected to a plurality of active device molecules, the molecule having a moiety with first and second connecting groups at opposed ends of the moiety. Each of the plurality of active device mol... | 08/14/2007 |
| 7253115 | Dual damascene etch processes A dual damascene trench etching process includes a two-step BARC etching process, a first BARC etch step using a fluorocarbon-based plasma, and a second BARC etch step using an O2/N2-based plasma. The first BARC etch step removes a first portio... | 08/07/2007 |
| 7246434 | Method of making a surface mountable PCB module A printed-circuit board (PCB) module has co-planar solder pads on a bottom surface. The solder pads can be surface-mounted to pads on a main board, allowing the PCB module to be surface mounted without wire leads extending from the PCB module substrate. A cavity is ... | 07/24/2007 |
| 7248235 | Display, method of manufacturing the same, and method of driving the same A display includes in each of display areas: a reflective area containing a non-light-emitting display element for effecting a display by means of a liquid crystal display element reflecting external light; and a light-emitting area containing a light-emitting displ... | 07/24/2007 |
| 7237115 | Authenticating concealed private data while maintaining concealment A method of and system for authenticating concealed and statistically varying multi-dimensional data comprising: acquiring an initial measurement of an item, wherein the initial measurement is subject to measurement error; applying a transformation to the initial me... | 06/26/2007 |
| 7229915 | Method for manufacturing semiconductor device A first insulating film, a second insulating film, a third insulating film, an antireflective film, and a resist film are formed in this order on a lower-layer wiring. After dry etching the third insulating film and the second insulating film, using the resist film ... | 06/12/2007 |
| 7226867 | Method of etching a metal layer using a mask, a metallization method for a semiconductor device, a method of etching a metal layer, and an etching gas Methods for etching a metal layer and a metallization method of a semiconductor device using an etching gas that includes Cl2 and N2 are provided. A mask layer is formed on the metal layer, the etching gas is supplied to the metal layer, and th... | 06/05/2007 |
| 7215456 | Method for patterning self-assembled colloidal photonic crystals and method for fabricating 3-dimensional photonic crystal waveguides of an inverted-opal structure using the patterning method A method for patterning self-assembled colloidal photonic crystals and a method for fabricating three-dimensional photonic crystal waveguides having an inverted-opal structure using the patterning method. The patterning method includes depositing first and second co... | 05/08/2007 |
| 7208420 | Method for selectively etching an aluminum containing layer A method of forming conductive connections for semiconductor devices is provided. An organic low-k dielectric layer is formed over a wafer. A conductive aluminum containing layer is formed over the organic low-k dielectric layer. The wafer is placed in an etch chamb... | 04/24/2007 |
| 7208805 | Structures comprising a layer free of nitrogen between silicon nitride and photoresist The invention includes a semiconductor processing method. A first material comprising silicon and nitrogen is formed. A second material is formed over the first material, and the second material comprises silicon and less nitrogen, by atom percent, than the first ma... | 04/24/2007 |
