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"I watched his countenance closely, to see if he was not deranged ... and I was assured by other senators after he left the room that they had no confidence in it."
U.S. Senator Smith of Indiana ; After seeing Samuel Morse demonstrate the telegraph.
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| Number | Title | Issue Date |
| 8158335 | High etch resistant material for double patterning The present invention includes a lithography method comprising forming a first patterned insist layer including at least one opening therein over a substrate. A water-soluble polymer layer is formed over the first patterned resist layer and the substrate, whereby a ... | 04/17/2012 |
| 8153350 | Method and material for forming high etch resistant double exposure patterns The present invention includes a lithography method comprising forming a first patterned resist layer including at least one opening therein over a substrate. A protective layer is formed on the first patterned resist layer and the substrate whereby a reaction occur... | 04/10/2012 |
| 8153351 | Methods for performing photolithography using BARCs having graded optical properties Photolithography methods using BARCs having graded optical properties are provided. In an exemplary embodiment, a photolithography method comprises the steps of depositing a BARC overlying a material to be patterned, the BARC having a refractive index and an absorba... | 04/10/2012 |
| 8148052 | Double patterning for lithography to increase feature spatial density A method of forming a pattern in at least one device layer in or on a substrate comprises: coating the device layer with a first photoresist layer; exposing the first photoresist using a first mask; developing the first photoresist layer to form a first pattern on t... | 04/03/2012 |
| 8129096 | Method for manufacturing conductive member pattern A method capable of easily and simply manufacturing a conductive member pattern such as a nano-size fine wiring or electrode is disclosed. Specifically, the disclosed method for manufacturing a conductive member pattern includes the steps of: forming an ion-exchange... | 03/06/2012 |
| 8114577 | Method for making light blocking plate An exemplary method for making a plurality of light blocking plates is provided. Firstly, a photoresist layer is formed on a substrate. Secondly, the photoresist layer is exposed using a gray scale photomask. Thirdly, the photoresist layer is developed to form a plu... | 02/14/2012 |
| 8105760 | Patterning process and pattern surface coating composition A pattern is formed by applying a first positive resist composition comprising a polymer comprising recurring units which become alkali soluble under the action of acid onto a substrate to form a first resist coating, heat treating, exposing, heat treating, developi... | 01/31/2012 |
| 8101339 | Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board A photosensitive resin composition according to the invention comprises (A) a binder polymer, (B) a photopolymerizing compound with an ethylenic unsaturated group and (C) a photopolymerization initiator, wherein component (B) contains a compound represented by the f... | 01/24/2012 |
| 8053175 | Method of forming measuring targets for measuring dimensions of substrate in substrate manufacturing process A method of forming measuring targets for measuring the dimensions of a substrate during a substrate manufacturing process is provided. First, a board having a base layer and a conductive layer is provided, wherein the conductive layer is disposed on a surface of th... | 11/08/2011 |
| 8039204 | Manufacturing method of silicon carbide semiconductor apparatus A manufacturing method of a silicon carbide semiconductor apparatus is provided. The method includes forming a first resist pattern on a surface of a silicon carbide layer formed on a silicon carbide substrate, implanting a first conduction type impurity ion in the ... | 10/18/2011 |
| 8003306 | Methods of forming electronic devices by ion implanting A method of forming an electronic device is provided that includes forming a resist layer over a substrate having a first region, a second region, and a third region. The method further includes directing radiation through a reticle, wherein the reticle comprises di... | 08/23/2011 |
| 7993817 | Structure with self aligned resist layer on an insulating surface and method of making same A structure is provided with a self-aligned resist layer on an insulator surface and non-lithographic method of fabricating the same. The non-lithographic method includes applying a resist on a structure comprising at least one of interconnects formed in an insulato... | 08/09/2011 |
| 7964336 | Metal or metal compound pattern and forming method of pattern, and electron emitting device, electron source, and image-forming apparatus using the pattern The present invention is to provide a method for forming various patterns such as a metal or metal compound pattern, in which the amounts of the materials constituting the pattern which are removed during the formation step can be suppressed to the minimum. The meth... | 06/21/2011 |
| 7846646 | Resist pattern forming method, thin-film pattern forming method, and microdevice manufacturing method A resist pattern forming method comprises the steps of plasma-processing a surface of an acid-feedable resist layer formed and patterned on a surface of a substrate in a gas atmosphere containing a fluorocarbon; attaching a resin composition crosslinkable in the pre... | 12/07/2010 |
| 7838202 | Method for manufacturing patterned thin-film layer A method for manufacturing a patterned thin-film layer includes the steps of: providing a substrate with a plurality of banks thereon, the plurality of banks defining a plurality of spaces therein for receiving ink therein, each of the banks having a top surface; pr... | 11/23/2010 |
| 7807337 | Inductor for a system-on-a-chip and a method for manufacturing the same An inductor for a system-on-a-chip and a method for manufacturing the inductor are disclosed. The inductor comprises a conductive line formed by connecting a plurality of conductive patterns grown from a seed layer formed on a lower wiring. The method comprises usin... | 10/05/2010 |
| 7745101 | Nanoparticle patterning process A method of making a metallic pattern (250) comprises: depositing a layer of photoresist (130) on a substrate (110); forming a pattern on the photoresist; depositing a layer of metal nanoparticles (190) on the photoresist and pattern; rem... | 06/29/2010 |
| 7718350 | Method of metal plating by using frame The frame plating process of the invention comprises the dry film resist pattern formation step at which a part of the dry film resist is located in such a way as to cap the upper position of the given pattern of opening concavity corresponding to the site needing f... | 05/18/2010 |
| 7642040 | Method of fabricating periodic domain inversion structure Providing a fabrication method of a periodic domain inversion structure. A nonlinear optical ferroelectric material substrate is provided. A photoresist layer is formed on the upper and the lower surface of the substrate, and periodic gratings formed by interference... | 01/05/2010 |
| 7608389 | Photoresists processable under biocompatible conditions for multi-biomolecule patterning Novel photoresist materials, which can be photolithographically processed in biocompatible conditions are presented in this invention. Suitable lithographic scheme for the use of these and analogous resists for biomolecule layer patterning on solid substrates are al... | 10/27/2009 |
| 7582412 | Multilayer photoresist systems Multilayer photoresist systems are provided. In particular aspects, the invention relates to underlayer composition for an overcoated photoresist, particularly an overcoated silicon-containing photoresist. Preferred underlayer compositions comprise one or more resin... | 09/01/2009 |
| 7575853 | Method of forming thin film pattern and method of forming magnetoresistive element The present invention provides a thin film pattern forming method capable of forming a thin film pattern having small dimensions at higher precision. A thin film pattern forming method of the invention includes: a step of forming a first thin film on a substrate; a ... | 08/18/2009 |
| 7569333 | Wiring line structure and method for forming the same The wiring line structure comprises a transparent substrate, a barrier layer, a metal layer, and a photosensitive protecting layer. The barrier layer and a metal layer are successively disposed on the transparent substrate. The photosensitive protecting layer is for... | 08/04/2009 |
| 7504199 | Method of forming metal pattern having low resistivity Disclosed herein is a method for forming a metal pattern with a low resistivity. The method comprises the steps of: (i) coating a photocatalytic compound onto a substrate to form a photocatalytic film layer; (ii) coating a water-soluble polymeric compound onto the p... | 03/17/2009 |
| 7498120 | Vacuum compatible high frequency electromagnetic and millimeter wave source components, devices and methods of micro-fabricating Vacuum compatible high frequency electromagnetic and millimeter wave source components, devices and methods of micro-fabricating such components and devices are disclosed. Embodiments of the methods may include using a UV-curable photoresist, such as SU-8 to form st... | 03/03/2009 |
| 7488570 | Method of forming metal pattern having low resistivity A method for forming a metal pattern with a low resistivity. The method may include the steps of: (i) coating a photocatalytic compound onto a substrate to form a photocatalytic film layer; (ii) coating a water-soluble polymeric compound onto the photocatalytic film... | 02/10/2009 |
| 7444196 | Optimized characterization of wafers structures for optical metrology A patterned structure in a wafer is created using one or more fabrication treatment processes. The patterned structure has a treated and an untreated portion. One or more diffraction sensitivity enhancement techniques are applied to the structure, the one or more di... | 10/28/2008 |
| 7419769 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 t... | 09/02/2008 |
| 7399579 | Fabrication of metallic microstructures via exposure of photosensitive composition A method of forming microstructures. An article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental metal. Additional conductive material may t... | 07/15/2008 |
| 7399582 | Material for forming fine pattern and method for forming fine pattern using the same In the method wherein a resist pattern is miniaturized effectively by applying a fine pattern forming material, the fine pattern forming material used for providing with a cured coated layer pattern, wherein development defects are reduced by water development is of... | 07/15/2008 |
| 7378228 | Positive type photosensitive epoxy resin composition and printed circuit board using the same A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring... | 05/27/2008 |
| 7378225 | Method of forming a metal pattern on a substrate The invention relates to a method of providing two distinct photoimageable film compositions, in particular, two distinct dry film compositions, on a substrate. Each of the two photoimageable film compositions is selected to have a different developing speed and/or ... | 05/27/2008 |
| 7378227 | Method of making a printed wiring board with conformally plated circuit traces A PWB or multilayer board with circuit traces is treated by a process that serves to reduce the incident of failure of the board. The process includes the steps of applying a thin commoning layer of copper onto a catalyzed surface of the board substrate and the circ... | 05/27/2008 |
| 7378229 | Pattern formation method In a pattern formation method, pattern exposure is performed by selectively irradiating, with exposing light, a resist film formed on a substrate and made of a resist including a carboxylic acid derivative. A first resist pattern is formed by developing the resist f... | 05/27/2008 |
| 7371247 | Method and apparatus for penetrating tissue A tissue penetrating system includes a plurality of penetrating members each having a tip. A penetrating member driver is coupled to the plurality of penetrating members. Each tip of a penetrating member is uncovered during launch of the penetrating member by the pe... | 05/13/2008 |
| 7368227 | Method to print photoresist lines with negative sidewalls It is very difficult to produce a negative wall angle from either negative or positive-tone chemically amplified resists, especially by e-beam lithography. This problem has now been overcome by first forming a photoresist pedestal in the conventional way, followed b... | 05/06/2008 |
| 7365007 | Interconnects with direct metalization and conductive polymer Embodiments include an interconnect or trace of electrically conductive material with a contact surface, and a dielectric layer overlying the contact surface with a via formed on the dielectric layer and to the contact surface. The via sidewalls and perimeter are la... | 04/29/2008 |
| 7364840 | Controlled shrinkage of bilayer photoresist patterns A technique is disclosed that combines a bilayered photoresist structure, similar to that which is already in use in the MR head industry, with a post development UV irradiation treatment which reduces the manufacturable feature-size to be below the resolution limit... | 04/29/2008 |
| 7354623 | Surface modification of a porous organic material through the use of a supercritical fluid An organic layer, such as a porous low-K dielectric in an IC, contains pores open at its surface. To close the pores, the organic layer is contacted by a supercritical fluid that is a solvent for the layer. After a small amount of the surface and the wall of the ope... | 04/08/2008 |
| 7351518 | Composition which forms an electrically conductive resist layer and a method for patterning a photoresist using the resist layer A composition is specified which forms an electrically conductive resist layer and comprises a resin that can be crosslinked to form a base polymer, an organic compound that can be crosslinked to form an electrically conductive substance, a crosslinking agent having... | 04/01/2008 |
