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| Number | Title | Issue Date |
| 8178285 | Method for manufacturing piezoelectric/electrostrictive film type element A manufacturing method for a piezoelectric/electrostrictive film type element and a film constituting a laminated vibrator made of laminations of an electrode film and a piezoelectric/electrostrictive film in a plane position. The piezoelectric/electrostrictive film... | 05/15/2012 |
| 8173357 | Method of forming etching mask, etching method using the etching mask, and method of fabricating semiconductor device including the etching method The method of forming an etching mask includes: forming a mask layer on an object layer that is to be etched, to form an etching mask used in etching the object layer; forming a first mask layer on the mask layer, the first mask layer having a first pattern that is ... | 05/08/2012 |
| 8173358 | Method of forming fine patterns of a semiconductor device A method of forming fine patterns of a semiconductor device includes forming a plurality of first mask patterns on a substrate such that the plurality of first mask patterns are separated from one another by a space located therebetween, in a direction parallel to a... | 05/08/2012 |
| 8173356 | Three dimensional scaffold and method of fabricating the same A three dimensional scaffold having a three dimensional structure is easily fabricated by employing a lithography process used in a semiconductor manufacturing process. A method of fabricating the same is also disclosed have a conformational structure. In the method... | 05/08/2012 |
| 8163466 | Method for selectively adjusting local resist pattern dimension with chemical treatment A method forms a first patterned mask (comprising rectangular features and/or rounded openings) on a planar surface and forms a second patterned mask on the first patterned mask and the planar surface. The second patterned mask covers protected portions of the first... | 04/24/2012 |
| 8158332 | Method of manufacturing a semiconductor device A method of fabricating a semiconductor device according to an embodiment includes: forming a first resist pattern made of a first resist material on a workpiece material; irradiating an energy beam onto the first resist pattern, the energy beam exposing the first r... | 04/17/2012 |
| 8137898 | Method for manufacturing semiconductor device Disclosed is a method for manufacturing a semiconductor device. The method comprises: forming a resist layer over a substrate; exposing the resist layer to light thereby to form a first exposed pattern and a second exposed pattern on the resist layer, the second exp... | 03/20/2012 |
| 8133661 | Superimpose photomask and method of patterning Provided is a photomask that includes a substrate having a first region and a second region, a first pattern disposed in the first region of the substrate, and a second pattern disposed in the second region of the substrate. The first and second patterns are a decom... | 03/13/2012 |
| 8110339 | Multi-tone resist compositions Multi-tone resists can enhance the resolution limit of a lithographic process by advantageously using the changeable solubility of a resist composition as a function of lithographic radiation dosage. By imaging a multi-tone resist with different doses of lithographi... | 02/07/2012 |
| 8110341 | Method for manufacturing a semiconductor device by using first and second exposure masks A method is disclosed for manufacturing a semiconductor device. The method includes: forming a substrate including a cell region and an outside region, wherein the outside region is adjacent to the cell region; forming a line-shaped pattern over the substrate using ... | 02/07/2012 |
| 8110340 | Method of forming a pattern of a semiconductor device A pattern for a gate line is formed using a first photoresist pattern and a first BARC layer. A pad and patterns for a select line, which has a width that is larger than that of the gate line, are formed using a second photoresist pattern and a second BARC layer. Th... | 02/07/2012 |
| 8101338 | Method of forming micro pattern of semiconductor device The present invention relates to a method of forming a micro pattern of a semiconductor device. According to an aspect of the present invention, a first photoresist layer and a second photoresist layer with different exposure types are formed over a semiconductor su... | 01/24/2012 |
| 8053174 | Manufacturing method for wiring In the case in which a film for a resist is formed by spin coating, there is a resist material to be wasted, and the process of edge cleaning is added as required. Further, when a thin film is formed on a substrate using a vacuum apparatus, a special apparatus or eq... | 11/08/2011 |
| 8043794 | Method of double patterning, method of processing a plurality of semiconductor wafers and semiconductor device A method of double patterning is disclosed. The method includes forming a first photosensitive layer; exposing the first photosensitive layer using a first reticle; developing the first photosensitive layer thereby forming a first image pattern including first eleme... | 10/25/2011 |
| 8043795 | Method of forming resist pattern Disclosed is a method of forming a resist pattern, including: applying a positive resist composition on a support 1 to form a first resist film 2; selectively exposing the first resist film 2 through a first mask pattern, and developing it to fo... | 10/25/2011 |
| 8039203 | Integrated circuits and methods of design and manufacture thereof Integrated circuits and methods of manufacture and design thereof are disclosed. For example, a method of manufacturing includes depositing a gate material over a semiconductor substrate, and depositing a first resist layer over the gate material. A first mask is us... | 10/18/2011 |
| 8026044 | Method of forming fine patterns of semiconductor device A method of forming fine patterns on a semiconductor substrate includes forming a first pattern, including first line patterns having a feature size F and an arbitrary pitch P, and forming a second pattern, including second line patterns disposed between adjacent fi... | 09/27/2011 |
| 8003302 | Method for fabricating patterns using a photomask Disclosed herein is a method for fabricating a pattern using a photomask that includes forming a first light shielding layer pattern over a substrate; forming a first resist layer pattern aligned to the first light shielding layer pattern over the first light shield... | 08/23/2011 |
| 8003303 | Intensity selective exposure method and apparatus A gradated photomask is provided. The photomask includes a first region including a first plurality of sub-resolution features and a second region including a second plurality of sub-resolution features. The first region blocks a first percentage of the incident rad... | 08/23/2011 |
| 8003301 | Manufacturing method for semiconductor device A manufacturing method for a semiconductor device having patterns including two adjacent sides forming a corner portion with an external angle and a periodic pattern with a high density arrangement in the same layer is provided with (a) the step of exposing the firs... | 08/23/2011 |
| 7998660 | Exposure method An exposure method is disclosed. A wafer coated with a photoresist layer having an exposure threshold dose is provided. The wafer has at least a central region and a peripheral region. Then, a compensating light beam having a first dose directs on the photoresist la... | 08/16/2011 |
| 7939247 | Process of patterning small scale devices A process is provided that includes forming a first mask on an underlying layer, where the mask has two adjacent portions with an open gap therebetween, and depositing a second mask material within the open gap and at an inclined angle with respect to an upper surfa... | 05/10/2011 |
| 7914974 | Anti-reflective imaging layer for multiple patterning process Novel methods of double patterning a photosensitive resin composition are provided. The methods involve applying the photosensitive composition to a substrate and thermally crosslinking the composition. The crosslinked layer can be used to provide reflection control... | 03/29/2011 |
| 7906271 | System and method for making photomasks The present disclosure is directed a method for preparing a system of photomask patterns for implementing a drawn pattern on a substrate with a multi-patterning lithography process. The method comprises receiving data describing a drawn pattern. A first photomask pa... | 03/15/2011 |
| 7887997 | Manufacturing method for conducting films on two surfaces of transparent substrate of touch control circuit A manufacturing method for conducting films on two opposite surfaces of a transparent substrate of a touch control circuit, includes: contacting a first photoresist layer having photosensitive and discolored emulsion on a first conducting coat formed on a first surf... | 02/15/2011 |
| 7887995 | Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed ... | 02/15/2011 |
| 7887996 | Method of pattern transfer Pattern transfer is achieved by forming a first patterned hard mask layer with a circuit pattern and a plurality of dummy patterns on a substrate, forming a second pattern mask layer on the substrate, exposing the circuit pattern of the first pattern mask layer, and... | 02/15/2011 |
| 7883834 | Method for forming pattern In an exposure step, a combination of a first photomask and a second mask is used. The first mask has a real pattern corresponding to the pattern actually formed on the film to be processed, and a dummy pattern added for controlling pattern pitch in the first photom... | 02/08/2011 |
| 7858293 | Method for double imaging a developable anti-reflective coating A method for double patterning a thin film on a substrate is described. The method includes forming the thin film to be patterned on the substrate, forming a developable anti-reflective coating (ARC) layer on the thin film, and forming a layer of photo-resist on the... | 12/28/2010 |
| 7851135 | Method of forming an etching mask pattern from developed negative and positive photoresist layers The present invention relates to a method of forming an etching mask pattern from developed negative and positive photoresist layers. According to the present invention, a negative photoresist layer is formed over a substrate. Some regions of the negative photoresis... | 12/14/2010 |
| 7829266 | Multiple exposure technique using OPC to correct distortion Accurate ultrafine patterns are formed using a multiple exposure technique comprising implementing an OPC procedure to form an exposure reticle to compensate for distortion of an overlying resist pattern caused by an underlying resist pattern. Embodiments include fo... | 11/09/2010 |
| 7820366 | Method of writing identifying information on wafer A method of writing identifying information comprises: the step of forming a metal film on a wafer; the step of forming a resist layer on the metal film; the step of exposing the resist layer by projecting a pattern for an alignment mark on the resist layer; the fir... | 10/26/2010 |
| 7794921 | Imaging post structures using x and y dipole optics and a single mask A photolithographic method uses different exposure patterns. In one aspect, a photo-sensitive layer on a substrate is subject to a first exposure using optics having a first exposure pattern, such as an x-dipole pattern, followed by exposure using optics having a se... | 09/14/2010 |
| 7790358 | Pattern formation method, electronic circuit manufactured by the same, and electronic device using the same There is provided a method for forming a continuous thin film circuit pattern with good precision, at low cost and with low environmental burden; an electronic circuit fabricated by the same, and an electronic device including the same. There are a step for f... | 09/07/2010 |
| 7781152 | Ozone-assisted lithography process with image enhancement for CPP head manufacturing A method for forming a bi-layer lift-off mask, including a hardened photoresistive stencil layer on a PMGI layer, for use in fabricating GMR read-head sensors with trackwidths of less than 0.1 microns and TMJ MRAM devices of similar critical dimensions. The stencil ... | 08/24/2010 |
| 7781153 | Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor A polymer resin composition, a method for forming a pattern using the polymer resin composition, and a method for fabricating a capacitor using the polymer resin composition are disclosed. The polymer resin composition includes about 75 to 93 percent by weight of a ... | 08/24/2010 |
| 7776515 | Method for forming a pattern on a semiconductor device using an organic hard mask A composition for the organic hard mask includes a polyamic acid compound, and a method for forming a pattern is used in a manufacturing process of semiconductor devices by coating the composition for organic hard mask film on an underlying layer, and depositing a s... | 08/17/2010 |
| 7749687 | Pattern forming method used in semiconductor device manufacturing and method of manufacturing semiconductor device A method of forming a pattern on a photosensitive resin film in lithography, a method of forming a pattern for a semiconductor device, and a method of manufacturing a semiconductor device using the patterned film are disclosed. In an aspect of the invention, there i... | 07/06/2010 |
| 7741015 | Patterning process and resist composition A pattern is formed by applying a positive resist composition comprising a polymer comprising 7-oxanorbornane ring-bearing recurring units and acid labile group-bearing recurring units and an acid generator onto a substrate to form a resist film, heat treating and e... | 06/22/2010 |
| 7709186 | Method for exposing photoresist film of semiconductor device A method for exposing photoresist film of semiconductor device is disclosed. In accordance with the method, wafer is sequentially shifted the wafer by a predetermined distance so that the exposed regions before and after each shift have an overlapping region having ... | 05/04/2010 |
