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| Number | Title | Issue Date |
| 8182969 | Lithographic processing method, and device manufactured thereby A method of splitting a lithographic pattern into two sub-patterns, includes generating test structures corresponding to structures of interest in the lithographic pattern, varying the test structures through a selected range of dimensions, simulating an image of th... | 05/22/2012 |
| 8178263 | Method for a lithographic apparatus A method of increasing a depth of focus of a lithographic apparatus is disclosed. The method includes forming diffracted beams of radiation using a patterning device pattern; and transforming a phase-wavefront of a portion of the diffracted beams into a first phase-... | 05/15/2012 |
| 8173335 | Beam ablation lithography Provided are beam ablation lithography methods capable of removing and manipulating material at the nanoscale. Also provided are nanoscale devices, nanogap field effect transistors, nano-wires, nano-crystals and artificial atoms made using the disclosed methods.... | 05/08/2012 |
| 8163448 | Determination method, exposure method, device fabrication method, and storage medium The present invention provides a method of determining a structure of an antireflection coating formed on a substrate as an exposure target of an exposure apparatus, the method comprising steps of calculating, an intensity distribution of light diffracted by an orig... | 04/24/2012 |
| 8158312 | Exposure method using charged particle beam A charged particle beam exposure method that includes preparing of exposure data for a plurality of device patterns; obtaining of an integral of forward scattering components in an exposure intensity distribution with each of the device patterns near the center of t... | 04/17/2012 |
| 8158311 | Method for managing light exposure mask and light exposure mask An object of the present invention is to provide a method for managing a light exposure mask wherein: a mask inspection or a wafer inspection, in order to manage a contamination of a light exposure mask by a growing foreign matter, is not necessary; the method has g... | 04/17/2012 |
| 8142964 | Method of designing sets of mask patterns, sets of mask patterns, and device manufacturing method In a multiple-exposure lithographic process a developed resist pattern derived from a first exposure is present within a second resist layer that is exposed in a second exposure of the multiple-exposure lithographic process. The second mask pattern used in the secon... | 03/27/2012 |
| 8142965 | Method and system for measuring in patterned structures A sample having a patterned area and a method for use in controlling a pattern parameter is presented. The sample comprises at least one test structure having a patterned region similar to a pattern in the patterned area, the patterns in the patterned area and in th... | 03/27/2012 |
| 8142966 | Substrate matrix to decouple tool and process effects A method of characterizing a process by selecting the process to characterize, selecting a parameter of the process to characterize, determining values of the parameter to use in a test matrix, specifying an eccentricity for the test matrix, selecting test structure... | 03/27/2012 |
| 8137875 | Method and apparatus for overlay compensation between subsequently patterned layers on workpiece Methods and apparatuses for patterning workpieces are provided. The methods and apparatuses described herein improve overlay between subsequently patterned layers on a workpiece by introducing an improved alignment method that compensates for workpiece distortions. | 03/20/2012 |
| 8129080 | Variable resist protecting groups A method and system for patterning a substrate using a dual-tone development process is described. The method and system comprise using a resist material having a polymer backbone with a plurality of protecting groups attached thereto to improve process latitude and... | 03/06/2012 |
| 8119312 | Manufacturing method for a semiconductor device In a manufacturing method for divisionally exposing a wafer, a focus correction processing is performed after a shot is moved to a position where the focus correction processing for all foci is enabled when the shot is at a wafer outer periphery, and a portion overl... | 02/21/2012 |
| 8119313 | Method for manufacturing semiconductor device A method for manufacturing a semiconductor device, includes: supplying a liquid resist containing a water-repellent additive to a surface of a rotating semiconductor wafer fixed to a rotary support to form a resist film to a design thickness on the surface of the se... | 02/21/2012 |
| 8110325 | Substrate treatment method A substrate treatment method including a first treatment process (S13 to S16) for exposing, heating, and developing a substrate on which a first resist is formed, thereby forming a first resist pattern, and a second treatment process (S17 to S | 02/07/2012 |
| 8105738 | Developing method Disclosed is a developing method that performs a developing for forming a second resist pattern after forming and exposing a resist film on a surface of a substrate on which a first resist pattern is formed. The method includes a first process for developing the sub... | 01/31/2012 |
| 8105737 | Method of correcting patterns for semiconductor device A method of correcting patterns includes attaining a correcting amount distribution map using a photo mask, the photo mask including a transparent substrate having first and second surfaces opposite to each other and a mask pattern on the first surface, attaining a ... | 01/31/2012 |
| 8067135 | Metrology systems and methods for lithography processes Metrology systems and methods for lithography processes are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a mask having a plurality of corner rounding test patterns formed thereon. A first semiconductor device is p... | 11/29/2011 |
| 8067134 | Method of iterative compensation for non-linear effects in three-dimensional exposure of resist The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optica... | 11/29/2011 |
| 8057972 | Constant current multi-beam patterning The invention relates to a method for forming a pattern on a substrate surface of a target by means of a beam of electrically charged particles in a number of exposure steps, where the beam is split into a patterned beam and there is a relative motion between the su... | 11/15/2011 |
| 8057970 | Method and system for forming circular patterns on a surface A method for forming circular patterns on a surface using a character projection (CP) charged particle beam writer is disclosed, wherein circular patterns of different sizes may be formed using a single CP character, by varying dosage. A method for forming circular ... | 11/15/2011 |
| 8057971 | Method of compensation for bleaching of resist during three-dimensional exposure of resist The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optica... | 11/15/2011 |
| 8048600 | Parameter extracting method A parameter extracting method capable of accurately and effectively extracting parameters used for charged particle beam exposure. The method comprises the steps of forming an unknown parameter layer on a known parameter layer, forming a resist on the unknown parame... | 11/01/2011 |
| 8043772 | Manufacturing method and manufacturing system of semiconductor device In an exposure process forming a predetermined circuit pattern of a semiconductor device on a wafer, a resist dimension of the resist pattern formed on a wafer and a focus position in the exposure process at a past time are measured. A resist dimension and a focus p... | 10/25/2011 |
| 8029954 | Exposure method and memory medium storing computer program A method comprises determining an exposure condition by executing a process including computing an image formed on an image plane under the current exposure condition while changing the exposure condition, and evaluating a line width of the computed image, and expos... | 10/04/2011 |
| 8021809 | Device manufacturing method, lithographic system, lithographic apparatus and design for manufacturing system In an embodiment, a device manufacturing method for transferring a pattern from a patterning device onto a substrate includes receiving a design layout information associated with a device, determining the pattern from the design layout information, providing the pa... | 09/20/2011 |
| 8017289 | Method for manufacturing a surface and integrated circuit using variable shaped beam lithography A method is disclosed in which a plurality of variable shaped beam (VSB) shots is used to form a desired pattern on a surface. In this method some shots within the plurality of shots overlap each other. Additionally, the union of any subset of the plurality of shots... | 09/13/2011 |
| 8017288 | Method for fracturing circular patterns and for manufacturing a semiconductor device A method for manufacturing a semiconductor device using a photomask and optical lithography is disclosed, wherein circular patterns on the semiconductor wafer are formed by using circular patterns on the photomask, which is manufactured using a charged particle beam... | 09/13/2011 |
| 8007968 | Substrate processing method, program, computer-readable storage medium and substrate processing system In the present invention, patterning for the first time is performed on a film to be worked above the front surface of a substrate, and the actual dimension of the pattern formed by the patterning for the first time is measured. Based on the dimension measurement re... | 08/30/2011 |
| 7985516 | Substrate processing method, computer-readable storage medium and substrate processing system A processing temperature of thermal processing is corrected based on measurement of a first dimension of a resist pattern on a substrate from a previously obtained relation between a dimension of a resist pattern and a temperature of thermal processing, a second dim... | 07/26/2011 |
| 7985517 | Lithography simulation method, computer program product, and pattern forming method A lithography simulation method for estimating an optical image to be formed on a substrate when a mask pattern is transferred onto the substrate includes dividing the mask pattern into first calculation areas having sizes determined by a range affected by OPC, the ... | 07/26/2011 |
| 7977018 | Exposure data preparation method and exposure method In the exposure data preparation method for charged particle beam exposure in which an exposure object is exposed while dose is adjusted for each pattern, the method including the steps of: classifying a pattern in terms of a target linewidth; setting a standard cha... | 07/12/2011 |
| 7977019 | Semiconductor device manufacturing method, semiconductor device manufacturing equipment, and computer readable medium A semiconductor device manufacturing method, a semiconductor device manufacturing equipment and a computer readable medium storing a computer program provide for easily identifying a cause of a deviation of pattern dimensions from the objective dimension. A f... | 07/12/2011 |
| 7972755 | Substrate processing method and substrate processing system There is disclosed a substrate processing method by a multi-patterning technique, which comprises a lithography process and an etching process, each of the processes is performed to one substrate at least twice. The substrate processing method is performed by using ... | 07/05/2011 |
| 7968258 | System and method for photolithography in semiconductor manufacturing A method for photolithography in semiconductor manufacturing includes providing one or more masks for a wafer; defining a reference focus plane of a first mask of the one or more masks; defining a reference focus plane of a second mask of the one or more masks; and ... | 06/28/2011 |
| 7968259 | Semiconductor device, method for manufacturing semiconductor device, and computer readable medium In a multi-project-chip semiconductor device, semiconductor elements fabricated on a wafer have a layout that corresponds to an exposure order of a pattern of the semiconductor elements and that is based on information indicating manufacture conditions and the numbe... | 06/28/2011 |
| 7968260 | Substrate processing method, computer-readable storage medium, and substrate processing system The present invention has: a first step of measuring, as an initial condition of a substrate, any of a film thickness of a processing film on the substrate, a refractive index of the processing film, an absorption coefficient of the processing film, and a warpage am... | 06/28/2011 |
| 7966584 | Pattern-producing method for semiconductor device Disclosed is a method of producing a pattern for a semiconductor device, comprising extracting part of a pattern layout, perturbing a pattern included in the part of the pattern layout to generate a perturbation pattern, correcting the perturbation pattern, predicti... | 06/21/2011 |
| 7960078 | Exposure condition setting method, substrate processing device, and computer program A method includes forming a resist film on an etching target layer disposed on a test substrate, and performing sequential light exposure with a predetermined test pattern on the resist film sequentially at a plurality of areas, while respectively using different co... | 06/14/2011 |
| 7955765 | Adjustment method, exposure method, device manufacturing method, and exposure apparatus An adjustment method for adjusting an illumination condition in illuminating an original plate using an illumination optical system and projecting an image of a pattern formed on the original plate onto a substrate through a projection optical system includes measur... | 06/07/2011 |
| 7955766 | Software-controlled maskless optical lithography using fluorescence feedback A software-controlled maskless optical lithography system uses fluorescence feedback to control an aspect of the lithography, such as light source dose, wavelength, or flashing instances or duration, spatial light modulator (SLM) pattern, an optics parameter, a beam... | 06/07/2011 |
