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Class 430/296 - Electron beam imaging


Subclass of Class 430 - Radiation imagery chemistry: process, composition, or product thereof
Definition: Processes wherein the radiation used for imaging the medium
No. of patents: 1434
Last issue date: 05/15/2012


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NumberTitleIssue Date
8178281Method for improving sensitivity of resist
It is an object of the present invention to improve sensitivity of a resist made from hydrosilsesquioxane when a pattern is formed in the resist by irradiation with a charged particle beam. The method for improving sensitivity of a resist of the present invention is...
05/15/2012
8178280Self-contained proximity effect correction inspiration for advanced lithography (special)
A lithography method is disclosed. An exemplary lithography method includes providing an energy sensitive resist material on a substrate; providing a desired pattern; performing a lithography process on the substrate, wherein the lithography process includes exposin...
05/15/2012
8124319Semiconductor lithography process
A semiconductor lithography process. A photoresist film is coated on a substrate. The photoresist film is subjected to a flood exposure to blanket expose the photoresist film across the substrate to a first radiation with a relatively lower dosage. The photoresist f...
02/28/2012
8105753System, method and apparatus for pattern clean-up during fabrication of patterned media using forced assembly of molecules
A pattern clean-up for fabrication of patterned media using a forced assembly of molecules is disclosed. E-beam lithography is initially used to write the initial patterned bit media structures, which have size and positioning errors. Nano-sized protein molecules ar...
01/31/2012
8105754Functionalized fullerenes for nanolithography applications
A method for electron beam nanolithography without the need for development step involves depositing a film of a resist comprising functionalized fullerenes on a substrate, and writing features by exposure to an electron beam with an accelerating voltage and dose ra...
01/31/2012
8101337Method of synthesizing ITO electron-beam resist and method of forming ITO pattern using the same
Provided is a method of synthesizing an ITO electron beam resist and a method of forming an ITO pattern. The ITO electron beam resist is synthesized by dissolving indium chloride tetrahydrate and tin chloride dihydrate in 2-ethoxy ethanol. The method of forming an I...
01/24/2012
7998658Pattern forming method
A first resist film is formed on a substrate, and first pattern exposure is performed such that the first resist film is irradiated with exposure light through a first mask. Then, the first resist film is developed, thereby forming a first resist pattern out of the ...
08/16/2011
7993813Apparatus and method for conformal mask manufacturing
A manufacturing process technology creates a pattern on a first layer using a focused ion beam process. The pattern is transferred to a second layer, which may act as a traditional etch stop layer. The pattern can be formed on the second layer without irradiation by...
08/09/2011
7972764Electron beam writing method, fine pattern writing system, method for manufacturing uneven pattern carrying substrate, and method for manufacturing magnetic disk medium
When writing elements of a fine pattern on a substrate applied with a resist by scanning an electron beam on the substrate, the electron beam is scan controlled so as to completely fill the shape of each of the elements by vibrating the electron beam rapidly in a ra...
07/05/2011
7939246Charged particle beam projection method
A deposition energy distribution when a charged particle beam is made incident upon a resist film, is approximated by a sum of element distributions having Gaussian distributions. A pattern area density map partitioning the pattern layout plane into small regions, i...
05/10/2011
7914970Mixed lithography with dual resist and a single pattern transfer
An inorganic electron beam sensitive oxide layer is formed on a carbon based material layer or an underlying layer. The inorganic electron beam sensitive oxide layer is exposed with an electron beam and developed to form patterned oxide regions. An ultraviolet sensi...
03/29/2011
7883831Method for translating a structured beam of energetic particles across a substrate in template mask lithography
The present inventors have developed an accurate method for forming a plurality of images on a substrate. The present method provides an improved pattern replication technique that provides submicron resolution, for example 20 nm or less, especially 10 nm or less. T...
02/08/2011
7820362Method of pattern delineation
A method of delineating a lithographic pattern on a material. A pattern to be delineated is divided according to first and second fields by first and second methods of division. Pattern segments contained in the first fields are divided in the X-direction, and data ...
10/26/2010
7736838Methods for forming pattern using electron beam and cell masks used in electron beam lithography
Provided methods for forming a pattern using electron beam and cell masks for electron beam lithography. The methods may include forming a resist layer on a substrate, the resist layer including a first region, a second region surrounding the first region, and a thi...
06/15/2010
7704677Method of patterning conductive polymer layer, organic light emitting device, and method of manufacturing the organic light emitting device
A method of patterning a conductive polymer, an organic light emitting device (OLED) manufactured using the method of patterning a conductive polymer, and a method of manufacturing the OLED are provided. The method of patterning a conductive polymer includes forming...
04/27/2010
7674570Mask pattern inspection method, exposure condition verification method, and manufacturing method of semiconductor device
A mask pattern inspection method includes: transferring a mask pattern onto a conductor substrate or a semiconductor substrate; preparing a sample including a substrate surface pattern in an electrically conductive state to the substrate, the substrate surface patte...
03/09/2010
7655381Method for producing resist substrates
The invention relates to a method for producing a substrate having a resist layer in the form of a relief structure, which represents a diffraction structure. The resist layer at least in certain areas adjoins a conductive layer, which scatters the primary electrons...
02/02/2010
7608387Method for fabricating mold core
An exemplary method for fabricating a mold core includes the following steps. First, a substrate is provided. Second, a photo resist layer is formed on the substrate, the photo resist layer has a top surface. Third, the photo resist layer is etched using a direct wr...
10/27/2009
7553606Methods of forming patterns in semiconductor devices using photo resist patterns
Disclosed is a method of forming patterns in semiconductor devices by using photo resist patterns. These methods comprise forming photo resist patterns on a substrate. Inferior patterns are selected among the photo resist patterns. The inferior patterns are eliminat...
06/30/2009
7534552Lithographic apparatus and device manufacturing method
In known lithographic apparatus the projection beam is symmetrical, while the process window can be asymmetrical. The invention addresses this problem by providing a lithographic apparatus comprising an illumination system configured to condition a radiation beam; a...
05/19/2009
7531293Radiation sensitive self-assembled monolayers and uses thereof
The invention is directed to a radiation sensitive compound comprising a surface binding group proximate to one end of the compound for attachment to a substrate, and a metal binding group proximate to an opposite end of the compound. The metal binding group is not ...
05/12/2009
7442924Repetitive circumferential milling for sample preparation
A method of sample extraction entails making multiple, overlapping cuts using a beam, such as a focused ion beam, to create a trench around a sample, and then undercutting the sample to free it. Because the sidewalls of the cut are not vertical, the overlapping cuts...
10/28/2008
7435517Method for reducing the fogging effect
A method for reducing the fogging effect in an electron beam lithography system wherein the exposure is controlled in order to obtain resulting pattern after processing which conforms to design data. A model for the fogging effect is fitted by individually changing ...
10/14/2008
7425396Method for reducing an overlay error and measurement mark for carrying out the same
A method for reducing an overlay error of structures of a layer to be patterned relative to those of a reference layer includes formation of standard measurement marks assigned to one another in the two layers for determining an overlay error and for setting up furt...
09/16/2008
7419764Method of fabricating nanoimprint mold
Provided is a method of fabricating a nanoimprint mold which can form sub-100 nm fine pattern structures. The method includes forming patterns on a first substrate using an E-beam lithography (EBL) process, and transferring the patterns formed on the first substrate...
09/02/2008
7414240Particle remover, exposure apparatus having the same, and device manufacturing method
A particle remover includes an irradiation unit for irradiating plural lights onto a target from different directions, and for scanning the lights on the target, and a collector for collecting particles carried as a result of scanning of the lights. ...
08/19/2008
7407736Methods of improving single layer resist patterning scheme
Methods for improving a single layer resist (SLR) patterning scheme, and in particular, its SLR layer and anti-reflective coating (ARC) etch selectivity, are disclosed. In one method, a patterned SLR layer over an anti-reflective coating (ARC) is provided and at lea...
08/05/2008
7407738Fabrication and use of superlattice
This disclosure relates to a system and method for fabricating and using a superlattice. A superlattice can be fabricated by applying alternating material layers on a ridge and then removing some of the alternating layers to expose edges. These exposed edges can be ...
08/05/2008
7390614Lithographic apparatus and device manufacturing method
A lithographic projection apparatus includes an alignment sensor having an electron beam source constructed and arranged to provide an electron beam for impinging on an alignment marker on a substrate, and a back-scattered electron detector constructed and arranged ...
06/24/2008
7388216Pattern writing and forming method
A pattern forming method is proposed for easy correction of a pattern-size variation occurring in an etching process. An energy beam is radiated onto a resist-applied target while the energy beam is adjusted to correct the pattern-size variation occurring in the etc...
06/17/2008
7385209Micromachining process, system and product
Ion beam lithography technique wherein a higher amount of radiation energy is deposited to predetermined regions in the bulk if a suitable substrate. By selecting the radiation nature, its energy and the irradiation parameters a structure can be created in the bulk ...
06/10/2008
7384710Method of forming exposure mask pattern, exposure mask pattern, and method of producing semiconductor device
A method of forming an exposure mask pattern providing edge division points P at edges of a design pattern (1) by predetermined intervals and correcting edge positions for each divided edge portion, wherein, for the design pattern (1), rectangular patt...
06/10/2008
7384711Stencil mask having main and auxiliary strut and method of forming the same
A stencil mask includes a membrane forming thin layer having membrane areas and a border area that limits the membrane areas. The membrane areas have a plurality of pattern areas which include an aperture through which particle beams can permeate and non-pattern are...
06/10/2008
7384724Method for fabricating optical devices in photonic crystal structures
A method for manufacturing optical components in a three-dimensional photonic crystal lattice. A first resist (9) is coated on a substrate (10) and exposed to an e-beam (11), to produce an imaged area (12). Another resist coating is appli...
06/10/2008
7374868Composition for an organic bottom anti-reflective coating and method for forming pattern using the same
Disclosed are a composition for an organic bottom anti-reflective coating able to improve the uniformity of a photoresist pattern with respect to an ultra-fine pattern formation process among processes for manufacturing semiconductor device, which prevents scattered...
05/20/2008
7371483Method for manufacturing mask for focus monitoring, and method for manufacturing semiconductor device
Disclosed is a method for manufacturing a mask for focus monitoring, comprising forming a first opening portion and a second opening portion in a surface region of a transparent substrate, the second opening portion having a pattern shape corresponding to a pattern ...
05/13/2008
7368791Multi-gate carbon nano-tube transistors
According to one aspect of the invention, a semiconducting transistor is described. The channel portion of the transistor includes carbon nanotubes formed on top of an insulating layer which covers a local bottom gate. Source and drain conductors are located at ends...
05/06/2008
7368735Charged beam drawing data creation method, charged beam drawing method, charged beam drawing apparatus and semiconductor device manufacturing method
Drawing-data creating method includes selecting charged beam drawing-apparatus dividing drawing area into main fields, subfields and unit fields (U-fields), dividing design data (D-data) corresponding to pattern drawn on area into first D-data corresponding to main ...
05/06/2008
7368227Method to print photoresist lines with negative sidewalls
It is very difficult to produce a negative wall angle from either negative or positive-tone chemically amplified resists, especially by e-beam lithography. This problem has now been overcome by first forming a photoresist pedestal in the conventional way, followed b...
05/06/2008
7364840Controlled shrinkage of bilayer photoresist patterns
A technique is disclosed that combines a bilayered photoresist structure, similar to that which is already in use in the MR head industry, with a post development UV irradiation treatment which reduces the manufacturable feature-size to be below the resolution limit...
04/29/2008
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