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| Number | Title | Issue Date |
| 8158324 | Positive-type photosensitive resin composition A positive-type photosensitive resin composition, including: (a) a novolac resin; (b) a polymer including, as a main component, a structure represented by formula (1) and/or formula (2): | 04/17/2012 |
| 7910281 | Positive resist composition for thin-film implantation process and method for forming resist pattern A positive resist composition for a thin-film implantation process of the present invention includes: a resin component (A) with an acid-dissociable dissolution inhibiting group, whose alkali solubility increases by the action of an acid; an acid generator component... | 03/22/2011 |
| 7851121 | Photosensitive polyimide composition and polyimide precursor composition There is provided a photosensitive composition including a polyimide or polyimide precursor. The polyimide and polyimide precursor of the present invention includes a group of a first acid-cleavable group, a first base-cleavable group or a first thermally-cleavable ... | 12/14/2010 |
| 7674566 | Positive photosensitive resin composition The present invention provides a positive photosensitive resin composition, characterized by comprising 1 to 50 parts by mass of a photo-acid generator and 0.01 to 70 parts by mass of a terpene compound in combination with 100 parts by mass of a hydroxypolyamide hav... | 03/09/2010 |
| 7638254 | Positive photosensitive resin composition, method for forming pattern, and electronic part Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than ... | 12/29/2009 |
| 7592119 | Photosensitive polyimide resin composition The developability of a photosensitive polyimide resin composition with a weakly alkaline aqueous solution is improved without reduction in the solubility in general-purpose organic solvents even when a part of the diamine component is replaced with a diaminopolysil... | 09/22/2009 |
| 7435525 | Positive photosensitive resin composition, method for forming pattern, and electronic part Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than ... | 10/14/2008 |
| 7416830 | Photosensitive resin compositions A positive-working photosensitive composition comprising one or more polybenzoxazole precursor polymers, a diazonaphthoquinone photoactive compound which is the condensation product of a compound containing from 2 to about 9 aromatic hydroxyl groups with a 5-naphtho... | 08/26/2008 |
| 7416822 | Resin and resin composition Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and n represent integers, X represents at least one tetravalent organic g... | 08/26/2008 |
| 7407731 | Photosensitive resin compositions A photosensitive resin composition comprising: (a) at least one polybenzoxazole precursor polymer; (b) at least one compound having Structure VI ... | 08/05/2008 |
| 7378230 | Photoresist composition for multi-micro nozzle head coater The present invention relates to a photoresist composition for an MMN (multi-micro nozzle) head coater, more particularly to a photoresist composition comprising a novolak resin with a molecular weight ranging from 2000 to 12,000, a diazide photoactive compound, an ... | 05/27/2008 |
| 7378215 | Positive photoresist composition A positive photoresist composition comprising an alkali-soluble resin, a 1,2-quinonediazide compound, an organic solvent, and a fluorinated organosilicon compound of formula (1) serving as a surfactant can be effectively coated to uniformity over large areas and is ... | 05/27/2008 |
| 7374856 | Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film A positive photosensitive siloxane composition having high photosensitivity and having such properties as high heat resistance, high transparency and low dielectric constant may be used to form a planarization film for a TFT substrate, an interlayer dielectrics or a... | 05/20/2008 |
| 7371500 | Positive photosensitive insulating resin composition and cured product thereof Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group, (C) crosslinked fine particles, (D) a compound containing at least two... | 05/13/2008 |
| 7371499 | Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same A photoresist resin composition comprises about 10 to about 35% by weight of an acryl-based copolymer, about 5 to about 10% by weight of a quinone diazide compound, about 55 to about 80% by weight of a solvent, and about 0.01 to about 0.5% by weight of a silane-base... | 05/13/2008 |
| 7371501 | Photosensitive resin composition and method for manufacturing semiconductor apparatus using the same A photosensitive resin composition comprises: a polybenzoxazole precursor (A); a naphthoquinone diazide photosensitizer (B); and a specific phenolic hydroxyl group-containing compound (C). ... | 05/13/2008 |
| 7368216 | Photosensitive resin composition and manufacturing method of semiconductor device using the same A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor device using the composition. ... | 05/06/2008 |
| 7368205 | Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitiv... | 05/06/2008 |
| 7364832 | Wet developable hard mask in conjunction with thin photoresist for micro photolithography A novel process for using a hard mask or protective layer in conjunction with an extremely thin photoresist is provided. In this process, a thin film of the protective layer is coated on the surface of a substrate that is to be selectively modified by reactive ion e... | 04/29/2008 |
| 7361449 | Specific dye compound, optical information recording medium comprising specific dye, and information recording method using this optical information recording medium The present invention provides an optical information recording medium comprising a substrate having disposed thereon a recording layer, wherein the recording layer includes a recording dye represented by the following formula (I) or (II): | 04/22/2008 |
| 7361445 | Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin fil... | 04/22/2008 |
| 7358035 | Topcoat compositions and methods of use thereof A topcoat composition that includes a fluorine-containing polymer and a casting solvent selected from the group consisting of α,α,α-trifluorotoluene, 2,2,3,3,4,4,5,5-octafluoropentyl-1,1,2,2-tetrafluoroethyl ether (OFP-TFEE), and a mixture consisting of a hydroph... | 04/15/2008 |
| 7358025 | Photoresist undercoat-forming material and patterning process A material comprising a specific bisphenol compound with a group of many carbon atoms is useful in forming a photoresist undercoat. The undercoat-forming material, optionally combined with an intermediate layer having an antireflective effect, has an absorptivity co... | 04/15/2008 |
| 7348122 | Photosensitive resin composition and method for manufacturing semiconductor device using the same A photosensitive resin composition comprising: a quinone diazide sulfonic acid ester of a phenol compound represented by formula (I) as defined in the specification; and a polybenzoxazole precursor, and a method for manufacturing a semiconductor device using the sam... | 03/25/2008 |
| 7338737 | Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The solvent includes a diethylene glycol dialkyl ether that includes an alkyl group including one to five carbon atoms, an ethyl 3-ethoxy propionate,... | 03/04/2008 |
| 7335319 | Semiconductor stress buffer coating edge bead removal compositions and method for their use An edge bead remover composition that includes at least one ketone selected from the group consisting of: wherein R1 and R2 are independently selected from the group consisting of: | 02/26/2008 |
| 7332254 | Positive photosensitive insulating resin composition, cured product thereof, and electronic component Disclosed is a positive photosensitive insulating resin composition including: (A) an alkali soluble resin, (B) a compound having a quinonediazide group, and (C) an epoxy resin having a softening p... | 02/19/2008 |
| 7314702 | Composition for a bottom-layer resist A composition for a bottom-layer resist, having superior anti-refractivity and dry-etch resistance for use in a bi-layer resist process employing a light source at a wavelength of 193 nm or below, is disclosed. The composition for the bottom-layer resist contains a ... | 01/01/2008 |
| 7314701 | Radiation-sensitive resin composition A positive tone radiation-sensitive resin composition comprising (A) a 1-substituted imidazole, (B) a photoacid generator, and (C-a) a resin protected by an acid-dissociable group, insoluble or scarcely soluble in alkali, but becoming soluble in alkali when the acid... | 01/01/2008 |
| 7312014 | Resist compositions The present invention relates to a resist composition for practical use with high resolution, high sensitivity, superior pattern profile and no outgas in energy irradiation under high vacuum, suitable to an ultra-fine processing technology represented by use of elec... | 12/25/2007 |
| 7303859 | Photoresist, photolithography method using the same, and method for producing photoresist There is provided a positive photoresist for near-field exposure excellent in light utilization efficiency even with small layer thickness of the photoresist layer for image formation, and allowing for reduced pattern edge roughness, and a photolithography method in... | 12/04/2007 |
| 7297452 | Photosensitive resin composition, thin film panel made with photosensitive composition, and method for manufacturing thin film panel A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The surfactant includes an organic fluorine compound having the structure a first silicone compound having... | 11/20/2007 |
| 7291439 | Photoresist composition, method for forming film pattern using the same, and method for manufacturing thin film transistor array panel using the same A photoresist composition, a method for forming a film pattern using the photoresist composition, and a method for manufacturing a thin film transistor array panel using the photoresist composition are provided. In one embodiment, a photoresist composition includes ... | 11/06/2007 |
| 7279263 | Dual-wavelength positive-working radiation-sensitive elements A positive-working radiation-sensitive composition for use with a radiation source comprises one or more polymers capable of being eluted in an alkaline aqueous solution and a development-enhancing compound. The invention provides a positive-working photosensitive c... | 10/09/2007 |
| 7267929 | Negative photosensitive resin composition A negative photosensitive resin composition comprising an alkali-soluble photosensitive resin (A) having acidic groups and having at least three ethylenic double bonds per molecule, an ink repellent (B) made of a polymer having polymerized units (b1) having a C... | 09/11/2007 |
| 7259101 | Nanoparticles and method for making the same A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar... | 08/21/2007 |
| 7259100 | Nanoparticles and method for making the same A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar... | 08/21/2007 |
| 7255970 | Photoresist composition for imaging thick films The present invention provides for a light-sensitive photoresist composition useful for imaging thick films, comprising a polymer which is insoluble in an aqueous alkali developer but becomes soluble prior to development, a photoacid generator which produces a stron... | 08/14/2007 |
| 7249953 | Zero insertion force high frequency connector A method for interconnecting two circuit boards includes positioning corresponding shielded land areas on circuit boards, the land areas including conductive core areas and conductive outer areas around the core areas. A block-like signal array is positioned between... | 07/31/2007 |
| 7244542 | Resins and photoresist compositions comprising same Provided are new resins that comprise carbocyclic aryl units with hetero substitution units and photoresists that contain such resins. Particularly preferred photoresists of the invention comprise a deblocking resin that contains hydroxy naphthyl units and can be ef... | 07/17/2007 |
