U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Icon_funbox Did You Know...

...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.

Newsletter  PatentStorm News

Make the Most of Our Site

See this month's Top Inventors and Most Cited Patents.

Stay on top of the latest innovations by subscribing to an RSS feed.

Registered users: Manage your profile.

 

Class 430/189 - Quinone diazide containing


Subclass of Class 430 - Radiation imagery chemistry: process, composition, or product thereof
Definition: Compositions wherein the radiation-sensitive diazo compound
No. of patents: 107
Last issue date: 03/02/2010


1      
NumberTitleIssue Date
7670745Alkali soluble polymer and positive working photosensitive resin composition using the same
The invention provides an alkali soluble polymer including a specific vinylketone phenol and a derivative thereof as radical polymerizable monomers and a positive working photosensitive resin composition containing the alkali soluble polymer and a photosensitizing a...
03/02/2010
7368216Photosensitive resin composition and manufacturing method of semiconductor device using the same
A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor device using the composition. ...
05/06/2008
7368205Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitiv...
05/06/2008
7354779Topography compensated film application methods
Methods for applying topographically compensated film in a semiconductor wafer fabrication process are disclosed. The processes include premapping a surface of a wafer so as to determine the local topography (e.g., z-height) of the wafer and then applying a variable...
04/08/2008
7255970Photoresist composition for imaging thick films
The present invention provides for a light-sensitive photoresist composition useful for imaging thick films, comprising a polymer which is insoluble in an aqueous alkali developer but becomes soluble prior to development, a photoacid generator which produces a stron...
08/14/2007
7238455Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
The invention provides a positive-working photosensitive resin composition comprising an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH2OH group but not a phenolic hydroxyl group, a method for producing a p...
07/03/2007
7189488Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor
A polyimide precursor in accordance with the present invention contains amide acid ester units, either imide units or amide acid units, and fluorine atoms bonded to some of these structural units. A polyimide precursor resin composition in accordance with the presen...
03/13/2007
7144662Photoresist composition having a high heat resistance
The present invention relates to a photoresist composition having high heat resistance used in the production process of an LCD, and more particularly, to a photoresist composition having high heat resistance, capable of decreasing process tact (a way), of process s...
12/05/2006
7060410Novolak resin solution, positive photoresist composition and preparation method thereof
There is provided a method of producing a resist composition which yields a resist composition with good storage stability, and no fluctuation in characteristics between production lots. There are provided: a novolak resin solution formed by adding benzoquinone to a...
06/13/2006
7026091Positive photoresist composition and patterning process using the same
A positive photoresist with uniform reactivity for use in a thick film lithography process, includes thermal curing during soft-baking and photo dissociation through UV exposure. The positive photoresist comprises a phenolic resin, a resin with acid labile groups, a...
04/11/2006
7022452Contrast enhanced photolithography
Contrast enhanced photolithography methods and devices formed by the same are described. In accordance with these methods, a photoresist layer is formed on a substrate. A contrast enhancing system including a solution or dispersion of a photobleachable dye is formed...
04/04/2006
7015256Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same
A photosensitive composition for forming a dielectric of the present invention comprising inorganic particles, an alkali developable resin and additives, wherein the additives comprise a compound having a quinonediazido group (C1), a compound containing at least two...
03/21/2006
6916593Resist composition
Although use of a nitrogen-containing compound as a basic compound component of a resist composition makes it possible to ease the T-top problem at an acid dissociation constant pKa falling within a range of 2 to 6, it is accompanied with the problem that the reacti...
07/12/2005
6875554Positive photosensitive polyimide resin composition
A positive photosensitive polyimide resin composition comprising: (a) a solvent-soluble polyimide comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one solvent solubilizing funct...
04/05/2005
6864032Method for forming azo colorant using diazo compound and coupler having leaving group and recording material using the coupler
The present invention provides a method for forming an azo colorant by reaction of a diazo compound and a coupler. The coupler has a leaving group at the coupling position thereof, such that a coupling reaction rate is faster than it would be if the coupler did not ...
03/08/2005
6849372Method of manufacturing imaging compositions
The present invention provides methods of forming and using thermally imageable composite elements which may be developed into lithographic printing plates. More specifically, the present invention provides a method of forming thermally imageable composite elements ...
02/01/2005
6824947Photosensitive composition comprising a phenol resin having a urea bond in the main chain
Photosensitive compositions comprising a phenol resin having a urea bond in the main chain, planographic printing plate precursors containing the photosensitive compositions, and methods for preparing planographic printing plates using the planographic printing plat...
11/30/2004
6790580Resist material and method for forming a resist pattern with the resist material
A resist material is made of a polymer or copolymer having a cyclic hydrocarbon as a skeletal structure and an alkali-soluble group to which a protective group is attached as a side chain. Because of the protective group, the resist material is insoluble in alkali s...
09/14/2004
6780561Polybenzoxazole precursor and coating composition using the same
Provided is a polybenzoxazole precursor having a high purity which does not contain ionic by-products. The above polybenzoxazole precursor comprises a repetitive unit represented by Formula (1): wherein A1 rep...
08/24/2004
6653043Active particle, photosensitive resin composition, and process for forming pattern
Active particles which when incorporated into a photosensitive composition containing base resin and diazonium-series photosensitizer provide improvement in at least one or both of sensitivity and resolutionn. The active particles include a particulate ca...
11/25/2003
6641971Resist compositions comprising silyl ketals and methods of use thereof
A chemically amplified resist composition comprises an aqueous base soluble polymer or copolymer having one or more polar functional groups, wherein at least one of the functional groups is protected with a cycloaliphatic silyl ketal group but may also in...
11/04/2003
6566040Method of manufacturing a semiconductor device and semiconductor device manufactured by the method
First, a hole pattern or a separation pattern of a first resist that is capable of supplying acid is formed on a semiconductor substrate. Then, a crosslinked film (organic frame) is formed on the side wall of the first resist pattern to obtain a resist pa...
05/20/2003
6436593Positive photosensitive resin composition, process for producing pattern and electronic parts
Disclosed are a positive type photosensitive resin composition which comprises (A) a polyimide precursor or a polyoxazole precursor having a group represented by --OR, wherein R represents a monovalent group constituting a acetal or ketal, an alkoxyalkyl ...
08/20/2002
6384103Radiation-sensitive resin composition
Radiation-sensitive resin composition having excellent and well-balanced various properties required for photoresist, such as sensitivity, pattern profile and heat resistance. The radiation-sensitive resin composition comprises an alkali-soluble resin and...
05/07/2002
6274286Resist compositions
A chemically amplified positive resist composition comprising at least one basic compound of the following general formula (1) or (2): ##STR1## wherein R1, R2, R3, R7, and R8 are independently normal,...
08/14/2001
5928833Radiation-sensitive materials
A radiation sensitive material comprises particles including a water-insoluble heat-softenable core surrounded by a shell which is soluble or swellable in aqueous medium. The material also includes a radiation sensitive component which, on exposure to rad...
07/27/1999
5928841Method of photoetching at 180 to 220
Disclosed is a method of forming a pattern on a substrate, comprising a step of forming a light-sensitive layer containing an aromatic compound on a substrate, a step of patternwise exposing the light-sensitive layer with a light having a wavelength range...
07/27/1999
5908730Chemical-sensitization photoresist composition
Proposed is a positive- or negative-working chemical-sensitization photoresist composition having advantages in respect of the contrast and resolution of patterning, photosensitivity and cross sectional profile of the patterned resist layer as well as in ...
06/01/1999
5866295Photosensitive quinolone compounds and a process of preparation
The present invention relates to novel photosensitive quinolone compounds, specifically novel 3-diazo 2,4-quinolinedione compounds, that may be used in a variety of applications, such as, photosensitive coating compositions, pharmaceuticals, agricultural,...
02/02/1999
5648195Radiation-sensitive resist composition comprising a diazoketone
A radiation-sensitive resist composition for manufacturing highly resolved relief structures is characterized by the following components: a film-forming base polymer; a radiation-active component that releases an acid when irradiated; a radiation-sensitive ester-f...
07/15/1997
5637436Method for removing photoresist composition from substrate surfaces
Ternary mixtures of C4 to C8 alkyl acetate, C4 to C8 alkyl alcohol, and water, formulated to have a flash point of above 100° F., are disclosed, particularly for use in edge residue removal processes in the fab...
06/10/1997
5582952Photosensitive lithographic printing plate containing a two-equivalent coupler residue-containing polymer
A photosensitive lithographic printing plate which provides a wide range of proper conditions for development, high impression capacity, a flexible film sufficient in adhesion to a support and excellent processing suitability with a weakly alkaline develo...
12/10/1996
5558971Resist material
A resist material comprising (a) a terpolymer, (b) a photoacid generator, and (c) a solvent has high light sensitivity, heat resistance, adhesiveness, resolution, etc., and is suitable for forming a pattern of rectangular shape....
09/24/1996
5543265Photoresist solution capable of being applied as an aerosol containing 3 to 12 percent by weight solvent
Changing (varying, irregular) resist thickness on semiconductor wafers having irregular top surface topography or having different island sizes, affects the percent reflectance (and absorption efficiency) of incident photolithographic light, and consequen...
08/06/1996
5518864Method of forming polyimide film pattern
Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R1 represents a tetravalent organic g...
05/21/1996
5482816Radiation-sensitive composition
A radiation-sensitive composition comprising (A) a polymer having a recurring unit represented by formula (1): ##STR1## wherein R1 represents a substituted methyl group, a substituted ethyl group, a silyl group, a germyl group or an alkoxy...
01/09/1996
5426017Composition and method for removing photoresist composition from substrates surfaces
Ternary mixtures of C4 to C8 alkyl acetate, C4 to C8 alkyl alcohol, and water, formulated to have a flash point of above 100° F., are disclosed, particularly for use in edge residue removal processes in the fab...
06/20/1995
5348835Photosensitive resin composition for forming polyimide film pattern comprising an o-quinone diazide photosensitive agent
Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R1 represents a tetravalent organic g...
09/20/1994
5346803Photoresist composition comprising a copolymer having a di-t-butyl fumarate
A photoresist composition comprises a polymer of the following formula (1): ##STR1## wherein R1 is a substituted or unsubstituted aromatic group or --(CH2)p --SiR3 wherein R3 is a methyl or ethyl grou...
09/13/1994
5340682Positive-working radiation-sensitive mixture and copying material produced therefrom comprising an ଱-carbonyl-଱-sulfonyl diazomethane, a water-insoluble binder and an acid cleavable compound
A positive-working radiation-sensitive mixture is disclosed which contains as essential constituents: a) an ଱-carbonyl-଱-sulfonyl-diazomethane, which forms a strong acid on irradiation, of the general formula I ##STR1## in which R1
08/23/1994
1      
 
Sign InRegister
Username  
Password   
forgot password?