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| Number | Title | Issue Date |
| 8029918 | Brazing method and brazed structure A brazing method includes assembling a first member and a second member, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and made of a Ni—Cr alloy including more than about 15% and le... | 10/04/2011 |
| 7985488 | Ultrathin copper foil with carrier and printed circuit board using same An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature envir... | 07/26/2011 |
| 7927715 | Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same A clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a copper layer bonded to at least one face of the metallic layer, wherein the copper layer has a {100} cube texture in which a deviating angle Δφ ... | 04/19/2011 |
| 7892655 | Ultrathin copper foil with carrier and printed circuit board using same An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature envir... | 02/22/2011 |
| 7771841 | Ultrathin copper foil with carrier and printed circuit board using same An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature envir... | 08/10/2010 |
| 7393594 | Laminated metal thin plate formed by electrodeposition and method of producing the same A laminated metal thin plate produced by electrodeposition is composed of a plurality of metal layers provided by at least two kinds of materials different in composition from each other. The laminated metal thin plate includes a first layer excellent in mechanical ... | 07/01/2008 |
| 7381475 | Treated copper foil and circuit board An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility w... | 06/03/2008 |
| 7368046 | Layered composite material for plain bearings, production and use thereof The invention is a method for the production of a composite multilayer material having a backing layer, a bearing metal layer of a copper alloy or an aluminum alloy, a nickel intermediate layer and an overlay consisting of about 0-20 wt. % copper and about 0-20 wt. ... | 05/06/2008 |
| 7344785 | Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same A copper foil 1 comprises a roughened plating layer 2, a Ni—Co alloy plating layer 3, a zinc galvanized (underlying) layer 4, a chromate treatment layer 5, and a silane coupling treatment layer 6 on a surface to be bonded ... | 03/18/2008 |
| 7341796 | Copper foil having blackened surface or layer A copper foil with a blackened surface or layer wherein one or both surfaces of a copper foil is subject to black treatment, and having a color difference ΔL*≦−70 and chroma C*≦15 of a black-treated surface when measured by a color difference meter represente... | 03/11/2008 |
| 7335428 | Cooking vessel comprising a base made of a multilayer material and a side wall, and article of multilayer material The invention relates to a cooking vessel comprising a base made of a multilayer material and a side wall, the said multilayer material comprising, in succession from the outside of the vessel to the inside of the vessel: an outer part, having a thickness eE | 02/26/2008 |
| 7300706 | High-carbon steel wire with nickel sub coating A wire for external exposure, i.e. without chemical binding with a polymer or rubber matrix. The wire has a steel core, a nickel sub-coating and a zinc or zinc alloy top coating above the nickel sub-coating. The steel core has a carbon content exceeding 0.20%. The w... | 11/27/2007 |
| 7296370 | Electroplated metals with silvery-white appearance and method of making Metals having a silvery-white appearance and methods of producing the same. In one embodiment, the composite material of the present invention comprises a metallic core, a first layer, and a second layer. The first layer encases the external surfaces of the metallic... | 11/20/2007 |
| 7287468 | Nickel alloy plated structure A structure and associated methods of formation. The structure includes a layered configuration comprising a copper layer, a first layer, and a second layer. The copper layer consists essentially of copper. The first and second layers are disposed on opposite sides ... | 10/30/2007 |
| 7282255 | Flexible printed circuit board and process for producing the same The present invention relates to a flexible printed circuit board which has extremely high adhesion performance and on which very fine circuit patterns can be formed by etching, and to a method for producing the same. In the present invention, in the flexible printe... | 10/16/2007 |
| 7279231 | Electroless plating structure The present invention relates to a cobalt electroless plating bath composition. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures in semiconductor devices. ... | 10/09/2007 |
| 7274091 | Semiconductor device and method of manufacturing a semiconductor device There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a se... | 09/25/2007 |
| 7267861 | Solder joints for copper metallization having reduced interfacial voids A metal interconnect structure (100) comprising a bond pad (101), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction, and 30 or less volume percent composed of crystal grains, w... | 09/11/2007 |
| 7268021 | Lead frame and method of manufacturing the same A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of... | 09/11/2007 |
| 7247396 | Highly oriented perpendicular magnetic recording media A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma... | 07/24/2007 |
| 7220494 | Metal dusting resistant product A product resistant or immune to carburization, metal dusting, coking, oxidation, and having sufficient mechanical strength for use at temperatures greater than 400° C. The product consists of a load-bearing member and a corrosion resistant member, wherein the corr... | 05/22/2007 |
| 7217464 | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose ... | 05/15/2007 |
| 7211340 | Thin film structures providing strong basal plane growth orientation and magnetic recording media comprising same A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of crystalline layers, the intermediate crystalline layer providing one of the ... | 05/01/2007 |
| 7205667 | Semiconductor device having copper wiring A first interlayer insulating film made of insulting material is formed over an underlying substrate. A via hole is formed through the first interlayer insulating film. A conductive plug made of copper or alloy mainly consisting of copper is filled in the via hole. ... | 04/17/2007 |
| 7172818 | Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having de... | 02/06/2007 |
| 7173510 | Thermal fuse and method of manufacturing fuse A thermal fuse includes a fusible alloy including tin, a couple of lead conductors connected to both ends of the fusible alloy, respectively, and a surface layer on the lead conductors, respectively. The surface layer is made of tin or alloy including tin as main su... | 02/06/2007 |
| 7169486 | Highly oriented perpendicular magnetic recording media A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma... | 01/30/2007 |
| 7166732 | Copper (I) compounds useful as deposition precursors of copper thin films Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes. ... | 01/23/2007 |
| 7163753 | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc di... | 01/16/2007 |
| 7148085 | Gold spot plated leadframes for semiconductor devices and method of fabrication A leadframe for use with integrated circuit chips comprising a plated layer of gold selectively covering areas of said leadframe intended for solder attachment; and said gold layer providing a visual distinction to said areas. ... | 12/12/2006 |
| 7132158 | Support layer for thin copper foil A composite material useful for the manufacture of a circuit has a support layer, a metal foil layer having opposing first and second sides and a thickness of 15 microns or less and a release layer effective to facilitate separation of the metal foil layer from the ... | 11/07/2006 |
| 7108923 | Copper foil for printed circuit board with taking environmental conservation into consideration A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of co... | 09/19/2006 |
| 7097915 | Separator plate for manufacturing printed circuit board components A separator plate for the production of printed circuit board components by pressing individual layers, which separator plate includes a metallic core layer and a coating on at least one side of the core layer, wherein the coating on the core layer, which is made of... | 08/29/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7052779 | Copper foil for fine pattern printed circuits and method of production of same Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit lines, etc. at the time of formation of fine patterns, and superior in ... | 05/30/2006 |
| 7052781 | Flexible copper foil structure and fabrication method thereof A new copper foil structure with enhanced flexibility and its fabrication method thereof are disclosed. This inventive structure includes a copper base foil having a matte side and shiny side, and a more thermally stable deposited layer overlying at least the matte ... | 05/30/2006 |
| 7049007 | Composite foil and its manufacturing process A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group includin... | 05/23/2006 |
| 7029761 | Bonding layer for bonding resin on copper surface A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromi... | 04/18/2006 |
| 7022419 | Composite plating film and a process for forming the same A composite nickel and copper alloy plating film (3) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high resistance of the film. The film may further contain self-lubri... | 04/04/2006 |
| 6994917 | Composite material and method for manufacturing the same A plate of an expanded metal and two metal plates are overlaid on one another. The expanded metal plate has a plurality of meshes. The linear expansion coefficient of the expanded metal is equal to or less than 8×10−6/° C., and the thermal conductivit... | 02/07/2006 |
