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| Number | Title | Issue Date |
| 4631237 | Wire electrode for spark-eroding systems A wire electrode for a spark-eroding system for erosion cutting of workpieces using intermittent electrical charges includes a core of a current-conducting material and a wire coating of a material with a lower evaporation temperature, for example zinc. T... | 12/23/1986 |
| 4628165 | Electrical contacts and methods of making contacts by electrodeposition Methods for increasing the ductility and reducing the porosity and cracking tendency of a palladium or palladium-silver electrodeposit which comprises providing an underlayer of a palladium/nickel or palladium/cobalt alloy electrodeposit. Also dual layer ... | 12/09/1986 |
| 4624897 | Clad brazing filler for bonding ceramic to metal, glass, or other ceramic and composites using such filler A clad brazing filler for use in bonding a ceramic to a metal, glass or another ceramic having a substantially different thermal expansion coefficient, and composites using such a filler. According to one aspect of the invention, a brazing filler of a cla... | 11/25/1986 |
| 4599279 | Zinc alloy for reducing copper-zinc diffusion A zinc alloy, having a copper layer coated thereon, consists essentially of from about 0.1 to about 0.8 weight percent copper, about 0.01 or more weight percent aluminum; up to about 0.05 weight percent magnesium, the balance being essentially zinc. The c... | 07/08/1986 |
| 4597836 | Method for high-speed production of metal-clad articles A die used for plastic injection molding is masked on its inner surface with a plating resist to leave only a selected area exposed. A conforming anode is fit into the die leaving a small clearance between the die cavity surface and the anode. A metal lay... | 07/01/1986 |
| 4598025 | Ductile composite interlayer for joining by brazing A ceramic part is joined to a metal part by means of a molybdenum copper composite interlayer disposed between, and brazed to, the ceramic part and the metal part.... | 07/01/1986 |
| 4591534 | Wall structure for rocket nozzle extension An improved structural material for the wall of a rocket engine nozzle extension comprising a thin sheet-metal base 12 and a rib wall 16 comprising a grid of intersecting ribs 18 which form internal cavities 20. A surface of the base 12 is plated 14 with ... | 05/27/1986 |
| 4579761 | Method of making aureate colored coins, medallions and tokens and products so made An aureate coin, coin blank, medallion, medallion blank, token or token blank has a coin-shaped core with opposed faces and a peripheral side edge and of mintable metallic material. An electroplated coating of copper and tin completely encases the core an... | 04/01/1986 |
| 4578320 | Copper-nickel alloys for brazed articles The present invention relates to copper-nickel alloys having improved ductility at elevated temperatures. The alloys consist essentially of about 5% to about 45%, preferably about 5% to 35% nickel, about 0.4% to about 1.1%, preferably about 0.6% to about ... | 03/25/1986 |
| 4576659 | Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures The formation of metal oxide contaminants on the surfaces of thin metal films by out-diffusion primarily through the grain boundaries thereof of metal from an underlayer is inhibited by conducting heat cycling of such layered metal structures in an ambien... | 03/18/1986 |
| 4564564 | Superconducting magnet wire A superconducting tape or wire with an improved critical field is formed of alternating layers of a niobium-containing superconductor such as Nb, NbTi, Nb3 Sn or Nb3 Ge with a thickness in the range of about 0.5-1.5 times its coheren... | 01/14/1986 |
| 4546049 | Ornamental composite of a metal alloy surrounding a mineral powder core for use in spectacle frames An ornamental composite material has a covering of an Ni-, Au-, Ag- or Cu-base alloy, and a core of a mineral powder aggregate. A layer of a metal different from the metals of the alloy of the covering can be clad on the inner surface of the covering as n... | 10/08/1985 |
| 4537810 | Metallic endless press band having an embossed surface for use in double band presses in the manufacture of laminates A metallic endless press band with an embossed engraving thereon for use in double band presses for the manufacture of laminates, such as panels, foils, films and the like having textured surfaces wherein a lengthwise and crosswise welding of rolled or el... | 08/27/1985 |
| 4532190 | Metal-ceramics composite materials A metal-ceramics composite material is produced by forming a metal film comprised of three layers on a ceramic substrate, and laminating a metal member thereon, the metal film comprising first layer of Group IV a metal, second layer of Group VIa metal and... | 07/30/1985 |
| 4525434 | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices and clad material containing said alloy A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also ... | 06/25/1985 |
| 4522890 | Multilayer high attenuation shielding structure A composite structure of thin films including alternating layers of relatively high conductivity metals and low conductivity metals to combine the effects of reflection and absorption and thereby maximize the attenuation of the structure. Additionally, a ... | 06/11/1985 |
| 4521476 | Hybrid integrated circuit and preparation thereof A hybrid integrated circuit is prepared by laminating an aluminum-copper clad foil on an insulating layer, etching the aluminum-copper clad foil with etching agents to form an aluminum circuit and a copper circuit and connecting a semiconductor element to... | 06/04/1985 |
| 4510208 | Duplex metal alloy/polymer compositions A multilayer metal/organic polymer composite which has a formable thermoplastic polymer layer, a first metal layer adhered to the polymer layer and a second metal layer adhered to the first metal layer. The first metal layer is formed either from one meta... | 04/09/1985 |
| 4504553 | Covering for photothermal conversion An infrared radiation reflecting substrate, having deposited thereon a first layer formed from a metal or an alloy, and a second layer deposited on the first layer and consisting of a solar radiation absorbing amorphous material, such as amorphous carbon.... | 03/12/1985 |
| 4503112 | Printed circuit material A product useful in the manufacture of printed circuits includes a carrier layer of copper having a thickness on the order of about 10-15 microns. A thin layer of copper having a thickness in the range of 1-12 microns, and which will provide the conductiv... | 03/05/1985 |
| 4463047 | Flexible selective energy control sheet and assembly using the same Flexible selective energy control sheet construction formed of a sheet of substantially transparent polymer thin film plastic material having first and second surfaces. A substantially transparent continuous adhesion promoting layer is adherent to the sec... | 07/31/1984 |
| 4455181 | Method of transfer lamination of copper thin sheets and films A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier s... | 06/19/1984 |
| 4451541 | Soldering composition and method of use A zinc-based composition comprising from 0.01 to 5 percent lead and 0.01 to 20 percent tin, preferably minor amounts of chromium and/or titanium and/or nickel and with the balance being zinc is provided. A minor amount of copper may also be present. The c... | 05/29/1984 |
| 4448854 | Coherent multilayer crystals and method of making A new material consisting of a multilayer crystalline structure which is coherent perpendicular to the layers and where each layer is composed of a single crystalline element. The individual layers may vary from 2Å to 100Å or more in thickness.... | 05/15/1984 |
| 4448853 | Layered active brazing material and method for producing it Layered active brazing material in the form of two microcrystalline or amorphous foils applied to both sides of a ductile metal ribbon acting as a carrier. The foils consist of an alloy containing two or more of the elements Cu, Ti, Ge, Si, Ag, Zr, Ni, Al... | 05/15/1984 |
| 4431709 | Beryllium to metal seals and method of producing the same Beryllium to metal seals are produced by forming on a beryllium surface by cathode sputtering a first metal layer from a group of metals including tantalum, niobium, zirconium, hafnium, titanium or vanadium, an intermediate cathode sputtered layer of a re... | 02/14/1984 |
| 4431710 | Laminate product of ultra thin copper film on a flexible aluminum carrier A copper-clad laminate having special utility in the production of high resolution printed circuit patterns is made by a method which includes as the step of forming an initial copper film by vapor depositing copper directly in contact with an as-rolled a... | 02/14/1984 |
| 4418125 | Multi-layer multi-metal electroplated protective coating This invention is directed to the formation of highly protective electroplated multi-metal coatings over an iron basis metal. The high degree of protection is obtained by the deposition of three sucessive layers of two dissimilar metal layers that form a ... | 11/29/1983 |
| 4415634 | Magnetic disk substrate with a core of synthetic material A substrate for a magnetic recording disk employs an annular core of synthetic material having thin metal foils bonded to opposite faces, the metal foils serving to receive a magnetic recording material to form a magnetic recording structure. The inner su... | 11/15/1983 |
| 4415635 | Electric brush A multifiber electrical brush formed of an electrically conductive matrix material having plural electrically conducting fiber wires embedded therein and extending therefrom, wherein the fiber wires have a diameter varying from 1 to 120μm, a length on th... | 11/15/1983 |
| 4409297 | Composite superconductors A composite superconductor that comprises a first alloy selected from the class consisting of Nb-Sn-X, V-Ga-X, and V-Si-X wherein X is selected from the class consisting of yttrium, tellurium, lanthanum, cerium, gadolinium, erbium, and mixtures thereof an... | 10/11/1983 |
| 4394419 | Printed circuit material A product useful in the manufacture of printed circuits includes a carrier layer of copper having a thickness on the order of about 10-15 microns. A thin layer of copper having a thickness in the range of 1-12 microns, and which will provide the conductiv... | 07/19/1983 |
| 4386139 | Copper foil for a printed circuit and a method for the production thereof Copper foil for a printed circuit, which comprises a copper layer and a vanadium-containing zinc layer formed on one side or each side of said copper layer, and a method for producing the copper foil. The bonding surface preferably contains a chromate sur... | 05/31/1983 |
| 4383003 | Transfer lamination of copper thin sheets and films, method and product A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier s... | 05/10/1983 |
| 4376154 | Copper foil for a printed circuit and a method for the production thereof A copper foil for a printed circuit comprising a copper layer having the bonding surface coated with a tin layer and having said tin layer coated with a vanadium-containing zinc layer which optionally may be given a chromic acid treatment. The invention a... | 03/08/1983 |
| 4371589 | Process for depositing protective coating and articles produced An article of improved wear characteristics and composed of a relatively low wear resistant base metal coated by a particulate refractory metal having a melting point of at least 1490° C. deposited within the near-surface region thereof comprising a base... | 02/01/1983 |
| 4330347 | Resistive coating for current conductors in cryogenic applications This invention relates to a resistive or semiconducting coating for use on current conductors in cryogenic applications. This includes copper-clad superconductor wire, copper wire used for stabilizing superconductor magnets, and for hyperconductors. The c... | 05/18/1982 |
| 4323632 | Metal composites and laminates formed therefrom A metal composite comprising a substrate having a uniformly, mildly etched surface of an aluminum alloy, e.g. an alloy, consisting of at least about 99 wt. % aluminum, and the balance comprising specified quantities of silicon, iron, copper, manganese and... | 04/06/1982 |
| 4291104 | Brazed corrosion resistant lined equipment An improved brazed construction and method for fabrication of equipment having a corrosion resistant liner on a base metal backing is disclosed, and involves incorporating symmetrical convolutions in the liner normal to the direction of maximum thermal ex... | 09/22/1981 |
| 4289834 | Dense dry etched multi-level metallurgy with non-overlapped vias A double level metal interconnection structure and process for making same are disclosed, wherein an etch-stop layer is formed on the first metal layer to prevent over-etching thereof when forming the second level metal line in a via hole in an insulating... | 09/15/1981 |
