Class 428/674 - Cu-base component

Subclass of Class 428 - Stock material or miscellaneous articles
Definition: Subject matter in which a component contains 40 percent
No. of patents: 393
Last issue date: 09/01/2009

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Number	Title	Issue Date
7582362	Thermal spray compositions for abradable seals A thermal spray composition and method of deposition for abradable seals for use in gas turbine engines, turbochargers and steam turbines. The thermal spray composition includes a solid lubricant and a ceramic preferably comprising 5 to 60 wt % total of the composit...	09/01/2009
7449249	Spray powder The invention relates to a spray powder for coating a substrate (2), in particular for coating a bearing part (2) of a bearing apparatus, the spray powder having at least the following composition: zinc=5% to 30% by weight, tin=1% to 10% by weight, sil...	11/11/2008
7435484	Ruthenium thin film-formed structure A method of depositing a ruthenium(Ru) thin film on a substrate in a reaction chamber, includes: (i) supplying a gas of a ruthenium precursor into the reaction chamber so that the gas of the ruthenium precursor is adsorbed onto the substrate, wherein the ruthenium p...	10/14/2008
7422792	Metallized polymide film A metallized polyimide film includes: a polyimide film including a first side and a second side; an intermediate layer that contains at least one element selected from the group consisting of Mo, Cr, Ni, Si, Fe, and Al, a deposition amount of the at least one elemen...	09/09/2008
7416789	Refractory metal substrate with improved thermal conductivity A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having a first major surface and a second ...	08/26/2008
7413974	Copper-metallized integrated circuits having electroless thick copper bond pads A metal structure (100) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). The first copper layer of first thickness and first crystal...	08/19/2008
7396596	Article with a coating of electrically conductive polymer A coated article, which has (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer. The article is characterized in that the copp...	07/08/2008
7378160	Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In parti...	05/27/2008
7358189	Copper clad laminate To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thi...	04/15/2008
7357883	Conductive adhesive, method of producing the same, and bonding method A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating ...	04/15/2008
7341796	Copper foil having blackened surface or layer A copper foil with a blackened surface or layer wherein one or both surfaces of a copper foil is subject to black treatment, and having a color difference ΔL≦−70 and chroma C≦15 of a black-treated surface when measured by a color difference meter represente...	03/11/2008
7297413	Plating substrate, electroless plating method, and circuit forming method using the same An electroless copper plating method is provided having a first catalyst step of forming a first catalyst layer on a ceramic base material containing a glass component using a tin chloride solution and a palladium chloride solution; a pre-copper-plating heat treatme...	11/20/2007
7291401	Non-hexavalent-chromium type corrosion resistant coating film structure having a resin layer and a metal layer that is superior in terms of adhesion to the resin layer A steel material that has on its surface a non-hexavalent-chromium type corrosion-resistant coating film formed by a composite of a metal layer and a resin layer. The steel material having or not having a copper layer is formed with 1) a Zn and/or Zn-based alloy lay...	11/06/2007
7279231	Electroless plating structure The present invention relates to a cobalt electroless plating bath composition. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures in semiconductor devices. ...	10/09/2007
7268021	Lead frame and method of manufacturing the same A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of...	09/11/2007
7261951	Copper based sintered contact material and double-layered sintered contact member With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and achieving improved seizure resistance through restraint of frictional he...	08/28/2007
7255933	Multi-layer sliding part and a method for its manufacture A multi-layer sliding part is prepared by a process including mixing 1–50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5–20 mass % of Sn and a remainder of Cu to form a mixed powder, sinteri...	08/14/2007
7247396	Highly oriented perpendicular magnetic recording media A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma...	07/24/2007
7235144	Method for the formation of a high-strength and wear-resistant composite layer A process for forming a high-strength, wear-resistant composite layer on the surface of an aluminum alloy substrate from an applied additive material. The additive material consists of an alloy or powder mixture which contains aluminum, silicon and at least 15% by w...	06/26/2007
7217464	Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose ...	05/15/2007
7211332	Laminate A laminate having a metal foil layer, and a polyimide resin layer provided on the metal foil layer, wherein the polyimide resin layer is obtained by curing a coating of a polyimide resin precursor solution directly applied onto a surface of the metal foil layer, whe...	05/01/2007
7211340	Thin film structures providing strong basal plane growth orientation and magnetic recording media comprising same A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of crystalline layers, the intermediate crystalline layer providing one of the ...	05/01/2007
7195825	Multi-layer sliding part and a method for its manufacture A multi-layer sliding part is prepared by a process including mixing 1–50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5–20 mass % of Sn and a remainder of Cu to form a mixed powder, sinteri...	03/27/2007
7186370	Copper-base alloy and its use A copper-base alloy with increased melting point above 1000° C., which is resistant or immune to carburization, metal dusting and coking, resistant to oxidation at elevated temperatures. The alloy has the following composition (in weight-%): Al 4–15, Si 0.1–6, ...	03/06/2007
7173510	Thermal fuse and method of manufacturing fuse A thermal fuse includes a fusible alloy including tin, a couple of lead conductors connected to both ends of the fusible alloy, respectively, and a surface layer on the lead conductors, respectively. The surface layer is made of tin or alloy including tin as main su...	02/06/2007
7173770	Zoom lens and imaging apparatus using the same An imaging apparatus includes, a zoom lens and a field stop for determining the extent of an imaging field, arranged at an object side of the zoom lens. The zoom lens has in order from an object side, a first lens group having positive refracting power, a second len...	02/06/2007
7168148	Composite cookware having ceramic coated aluminum edges A method of manufacturing composite cookware or bakeware comprising the steps of (a) providing a bonded multi-layer composite sheet of material having at least one layer of an aluminum or aluminum alloy material; (b) forming a cookware vessel of a desired configurat...	01/30/2007
7169486	Highly oriented perpendicular magnetic recording media A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma...	01/30/2007
7163753	Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc di...	01/16/2007
7160632	Material for sliding contacts, clad composite material and small-sized DC motor using the same The invention provides a material for sliding contacts that is suitable for a small-sized DC motor used in recent downsized CD players and is excellent in durability. A material for sliding contacts used in a commutator of a small-sized DC motor that consists essent...	01/09/2007
7157152	Copper-tin-oxygen alloy plating The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellen...	01/02/2007
7153590	Composite copper foil and manufacturing method thereof A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (	12/26/2006
7138190	Composite containing reinforcing fibers comprising carbon Composite which contains reinforcing fibers comprising carbon and whose matrix comprises silicon carbide, silicon and copper, with the mass fraction of copper in the composite being up to 55%, processes for producing it, in particular by liquid infiltration of C/C i...	11/21/2006
7132158	Support layer for thin copper foil A composite material useful for the manufacture of a circuit has a support layer, a metal foil layer having opposing first and second sides and a thickness of 15 microns or less and a release layer effective to facilitate separation of the metal foil layer from the ...	11/07/2006
7132172	Composite material for use in the manufacture of electrical contacts and a method for its manufacture An electrically conductive composite material for use in the manufacture of electrical contact components, consisting of a metal strip and a contact layer made of a silver or tin contact material, which contact layer is applied at least to one side of the metal stri...	11/07/2006
7128980	Composite component for fusion reactors A highly heat-resistant laminated component for a fusion reactor has at least of a plasma-facing area made of tungsten or a tungsten alloy, a heat-dissipating area of copper or a copper alloy with a mean grain size of more than 100 μm, and an interlayer of a refrac...	10/31/2006
7125913	Partial oxidation reactors and syngas coolers using nickel-containing components Disclosed are methods and apparatus for producing synthesis gas and higher hydrocarbons from light hydrocarbons and molecular oxygen as well as the higher hydrocarbons produced by the disclosed methods and apparatus. The methods and apparatus disclosed utilize compo...	10/24/2006
7108923	Copper foil for printed circuit board with taking environmental conservation into consideration A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of co...	09/19/2006
7094474	Composite powder and gall-resistant coating A composite powder includes an FeMo based first powder including between about 20% and about 55% by weight Fe and between about 45% and about 80% by weight of Mo. The composite powder also includes an aluminum bronze based second powder blended with the FeMo based f...	08/22/2006
7087315	Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th...	08/08/2006

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Class 428/674 - Cu-base component