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| Number | Title | Issue Date |
| 8273465 | Slide member A slide member including a base material; and an overlay that is formed over the base material and that consists of Ag or Ag alloy including crystal planes (hk1) represented by Miller indices; wherein a relative X-ray diffraction intensity of crystal plane (200) to ... | 09/25/2012 |
| 8062765 | Silver layer formed by electrosilvering substrate material The inventors have conducted vigorous studies, and discovered as a result that it is possible to form a silver layer having a high reflectance of about 90 to 99% in a visible light area by setting a grain size of an outermost surface of a silver plated layer within ... | 11/22/2011 |
| 8029917 | Coated articles A metallic biomedical article, preferably an orthopaedic implant, instrument or tool, for use in contact with internal human body tissue, having a first silver containing metal nitride coating thereon, and process for making the same, is provided. ... | 10/04/2011 |
| 7897266 | Personal grooming device having a tarnish resistant, hypoallergenic and/or antimicrobial silver alloy coating thereon The present disclosure is generally directed to a personal grooming product or device (e.g., foil shaver, rotary shaver, etc.) having a metal coating on one or more surfaces thereof, the grooming product being designed for contacting the skin (e.g., the human hand o... | 03/01/2011 |
| 7749620 | Electromagnetic wave shield material and process for producing the same The present invention is to provide an electromagnetic wave shielding material which comprises a transparent substrate and a fine line pattern formed thereon, wherein the fine line pattern comprises a metal plating film using a physically developed metal silver as a... | 07/06/2010 |
| 7413974 | Copper-metallized integrated circuits having electroless thick copper bond pads A metal structure (100) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). The first copper layer of first thickness and first crystal... | 08/19/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7338709 | Security yarn and production method therefor According to the present invention, there is provided a security thread whose existence is not clarified, which is prevented beforehand from being removed, which can be attached even to a form of a commodity heretofore regarded as difficult, and whose use purpose ra... | 03/04/2008 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7294394 | Phase change material containing fusible particles as thermally conductive filler According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible fi... | 11/13/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7262130 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have... | 08/28/2007 |
| 7261950 | Flexible, formable conductive films Electrically conductive films comprising a flexible support, an extensible metal or metal alloy layer, and a crosslinked polymeric protective layer have at least one permanently deformed curved region. The films can be light transmissive and can have regions of comp... | 08/28/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7253521 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in combination with diffusion barriers, rather than aluminum, to form the wi... | 08/07/2007 |
| 7250224 | Coating system and method for vibrational damping of gas turbine engine airfoils A coating system and coating method for damping vibration in an airfoil of a rotating component of a turbomachine. The coating system includes a metallic coating on a surface of the airfoil, and a ceramic coating overlying the metallic coating. The metallic coating ... | 07/31/2007 |
| 7247396 | Highly oriented perpendicular magnetic recording media A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma... | 07/24/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7211340 | Thin film structures providing strong basal plane growth orientation and magnetic recording media comprising same A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of crystalline layers, the intermediate crystalline layer providing one of the ... | 05/01/2007 |
| 7211338 | Hard, ductile coating system The invention provides hard, ductile coatings comprising a ductile bonding layer of zirconium or titanium alloyed with a precious metal and a hard, surface layer comprising at least one compound selected from the group consisting of zirconium nitride, titanium nitri... | 05/01/2007 |
| 7180174 | Nanotube modified solder thermal intermediate structure, systems, and methods An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder. ... | 02/20/2007 |
| 7175919 | Multilayered metal laminate and process for producing the same An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The proce... | 02/13/2007 |
| 7169486 | Highly oriented perpendicular magnetic recording media A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma... | 01/30/2007 |
| 7163753 | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc di... | 01/16/2007 |
| 7160632 | Material for sliding contacts, clad composite material and small-sized DC motor using the same The invention provides a material for sliding contacts that is suitable for a small-sized DC motor used in recent downsized CD players and is excellent in durability. A material for sliding contacts used in a commutator of a small-sized DC motor that consists essent... | 01/09/2007 |
| 7150920 | Metal-carbon composite powders Metal-carbon composite powders and methods for producing metal-carbon composite powders. The powders have a well-controlled microstructure and morphology and preferably have a small average particle size. The method includes forming the particles from an aerosol of ... | 12/19/2006 |
| 7141311 | Ferrite thin film for high frequency and method for preparation thereof The present invention provides a Y-type hexagonal ferrite thin film suitable for high frequency devices, having a crystal structure with the c-axis oriented perpendicular to the surface of the thin film. The present invention also provides a method of producing the ... | 11/28/2006 |
| 7132172 | Composite material for use in the manufacture of electrical contacts and a method for its manufacture An electrically conductive composite material for use in the manufacture of electrical contact components, consisting of a metal strip and a contact layer made of a silver or tin contact material, which contact layer is applied at least to one side of the metal stri... | 11/07/2006 |
| 7105914 | Integrated circuit and seed layers Structures are provided which improve performance in integrated circuits. The structures include a diffusion barrier and a seed layer in an integrated circuit both formed using a low energy ion implantation followed by a selective deposition of metal lines for the i... | 09/12/2006 |
| 7091611 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 08/15/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7083859 | Conductive powder and method for preparing the same Disclosed are conductive powder having a packing density of 68% by volume or more with a relative value preferably comprising 60 to 92% by weight of roughly spherical and silver-plated copper powder part of the surface of which has been coated with 3 to 30% by weigh... | 08/01/2006 |
| 7067421 | Multilevel copper interconnect with double passivation Structures and methods provide multilevel wiring interconnects in an integrated circuit assembly which alleviate problems associated with integrated circuit size and performance and include methods for forming multilevel wiring interconnects in an integrated circuit... | 06/27/2006 |
| 7056853 | Oxide ceramic material, ceramic substrate employing the same, ceramic laminate device, and power amplifier module An oxide ceramic material is provided to contain aluminum oxide as a principal component, and at least one selected from A and B shown below as an auxiliary component: A: niobium oxide and copper oxide B: copper ox... | 06/06/2006 |
| 7049009 | Silver selenide film stoichiometry and morphology control in sputter deposition A method of sputter depositing silver selenide and controlling the stoichiometry and nodular defect formations of a sputter deposited silver-selenide film. The method includes depositing silver-selenide using a sputter deposition process at a pressure of about 0.3 m... | 05/23/2006 |
| 7045188 | Metal alloys for the reflective or the semi-reflective layer of an optical storage medium A silver-based alloy thin film is provided for the highly reflective or semi-reflective layer of optical discs. Alloy additions to silver include gold, rhodium, ruthenium, osmium, platinum, palladium, copper, silicon, cadmium, tin, lithium, nickel, cobalt, indium, c... | 05/16/2006 |
| 7045187 | Metal alloys for the reflective or the semi-reflective layer of an optical storage medium Metal alloy thin films are provided for use in the highly reflective and semi-reflective layers of optical discs. Alloys include silver alloyed with gold, palladium, copper, rhodium, ruthenium, osmium, iridium, and platinum. Other alloys include copper alloys with s... | 05/16/2006 |
| 7033679 | Metal film and metal film-coated member, metal oxide film and metal oxide film-coated member, thin film forming apparatus and thin film forming method for producing metal film and metal oxide film The metal film of the present invention is a dense film of a single crystal that has very low surface roughness and very good crystal orientation because an arithmetic mean roughness of the surface is not larger than 2 nm and a (111) peak intensity of X-ray diffract... | 04/25/2006 |
| 7026057 | Corrosion and abrasion resistant decorative coating A new article of manufacture, for example a faucet or other article of hardware, has a specified decorative color, and is resistant to corrosion, abrasion and attack by chemicals. The article includes a substrate, one or more corrosion resistant layers applied to th... | 04/11/2006 |
| 7018720 | Layer sequence built on a substrate in thin-film technology The layer sequence built on a substrate in thin-film technology includes an electrically conductive sputtered layer and an electrically conductive reinforcing layer for reinforcing or strengthening the sputtered layer, which is applied on the sputtered layer by a me... | 03/28/2006 |
