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Class 428/671 - Cu-base component alternative to Ag-, Au-, or Ni-base component


Subclass of Class 428 - Stock material or miscellaneous articles
Definition: Subject matter in which a component may contain 40 percent
No. of patents: 131
Last issue date: 07/29/2008


1        
NumberTitleIssue Date
7405007Semiconductor having a substantially uniform layer of electroplated metal
A method of electroplating metal onto a low conductivity layer combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of the pulse...
07/29/2008
7396596Article with a coating of electrically conductive polymer
A coated article, which has (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer. The article is characterized in that the copp...
07/08/2008
7357883Conductive adhesive, method of producing the same, and bonding method
A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating ...
04/15/2008
7357291Solder metal, soldering flux and solder paste
Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ...
04/15/2008
7338717Tool and a method for creating the tool
A method 10 and a laminated tool 31 which is created by the method 10 and which is formed by the selective coupling or attachment of sectional members, such as members 14, 16. The formed tool 31 includes a finished surface 36
03/04/2008
7270572Component connector
Systems, methodologies, media, and other embodiments associated with connecting a cable to a computer component are described. One exemplary system embodiment includes a component connector comprising at least one signal pin and a plurality of ground pins positioned...
09/18/2007
7247396Highly oriented perpendicular magnetic recording media
A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma...
07/24/2007
7241510Peelable circuit board foil
In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250...
07/10/2007
7211340Thin film structures providing strong basal plane growth orientation and magnetic recording media comprising same
A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of crystalline layers, the intermediate crystalline layer providing one of the ...
05/01/2007
7181976Spring-elastic measuring element comprising a flat connecting element that can be welded
The invention relates to a spring-elastic measuring element (1) for thermometers, pressure switches or manometers consisting of an arc-shaped measuring tube (3), a base body (2) and a connecting element (10) for the measuring mechanism. T...
02/27/2007
7169486Highly oriented perpendicular magnetic recording media
A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma...
01/30/2007
7129194Catalyst system with improved corrosion resistance
An improved catalyst system that includes a metal support structure and an anti-corrosive layer on the metal support structure, and has improved resistance to corrosion and other degradation under corrosive environments. Typically, a catalyst supporting layer is app...
10/31/2006
7087315Method for forming plating film
A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th...
08/08/2006
7067199Magnetic particle of CuAu(1) or CuAu(III) type its production method, magnetic recording medium and its production method
The present invention relates to a method of producing a magnetic particle including forming a layer containing an alloy particle that can form a CuAu-type or Cu3Au-type hard magnetic ordered alloy phase on a support, oxidizing the layer, and annealing th...
06/27/2006
7049007Composite foil and its manufacturing process
A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group includin...
05/23/2006
7033730Silver-reactive metal alloys for optical data storage and recordable storage media containing same
An optical data recording and storage medium that includes a reflective layer formed from a silver alloy that contains, in addition to silver, about 0.2 to about 1.0 wt. %, based on the total weight of alloy, of samarium (Sm), about 0.2 to about 2.0 wt. % of copper ...
04/25/2006
7026057Corrosion and abrasion resistant decorative coating
A new article of manufacture, for example a faucet or other article of hardware, has a specified decorative color, and is resistant to corrosion, abrasion and attack by chemicals. The article includes a substrate, one or more corrosion resistant layers applied to th...
04/11/2006
7018721Structure for interconnecting conductors and connecting method
A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, ...
03/28/2006
6994919Brazing product and method of manufacturing a brazing product
The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of...
02/07/2006
6913657Hard precious metal alloy member and method of manufacturing same
A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but less than 15,000 ppm, wherein the hardening additive is constituted o...
07/05/2005
6908691Metal strip for epitaxial coatings and method for the production thereof
The aim of the invention is to provide a metal strip for epitaxial coating with a biaxially textured layer, this metal strip, however, being able to be produced in an uncomplicated manner and having a high tensile strength, low magnetic losses and/or a high electric...
06/21/2005
6872468Peelable circuit board foil
In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic release material (215). The conductive metal foil layer has a an exposed surface (212...
03/29/2005
6863991Coated biperiodic metallic mesh arrays with molecular monolayers and lipid bilayers thereon
A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (...
03/08/2005
6838191Blanch resistant and thermal barrier NiAl coating systems for advanced copper alloys
A method of forming an environmental resistant thermal barrier coating on a copper alloy is disclosed. The steps include cleansing a surface of a copper alloy, depositing a bond coat on the cleansed surface of the copper alloy, depositing a NiAl top coat on the bond...
01/04/2005
6828036Anti-ferromagnetically coupled magnetic media with combined interlayer + first magnetic layer
An anti-ferromagnetically coupled (“AFC”), high areal density magnetic recording medium of simplified thin film layer structure and having improved thermal stability and signal-to-medium noise ratio (“SMNR”) comprises a stack of thin film layers including, i...
12/07/2004
6797405Method for uniform electrochemical reduction of apertures to micron and submicron dimensions using commercial biperiodic metallic mesh arrays and devices derived therefrom
A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting...
09/28/2004
6780520Metal/ceramic bonding article and method for producing same
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist
08/24/2004
6648211Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered ...
11/18/2003
6638374Device produced by a process of controlling grain growth in metal films
A process for controlling grain growth in the microstructure of thin metal films (e.g., copper or gold) deposited onto a substrate. In one embodiment, the metal film is deposited onto the substrate to form a film having a fine-grained microstructure. The ...
10/28/2003
6605371Brazing alloy for stainless steel, structure braze-assembled with the brazing alloy, and brazing material for stainless steel
A brazing alloy according to the present invention has a melting point equivalent to that of a copper brazing filler and is excellent in corrosion- and oxidation-resistance. The brazing alloy consists essentially of Mn, Ni and Cu, and has a composition in...
08/12/2003
6572955Ceramics having excellent high-frequency characteristics and method of producing the same
High-frequency ceramics containing SiO2, Al2 O3, MgO, ZnO and B2 O3 as constituent components, said ceramics comprising: 30 to 50% by weight of a crystal phase containing ZnO and Al2 O3
06/03/2003
6537683Stratified composite material for sliding elements and method for the production thereof
A method is described for producing composite multilayer materials which exhibit optimum properties throughout their entire service life. The composite multilayer material comprises a backing layer, a bearing metal layer, an intermediate layer and an elec...
03/25/2003
6534192Multi-purpose finish for printed wiring boards and method of manufacture of such boards
A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with co...
03/18/2003
6485846Corrosion resistant gauge component
A component for a gauge comprising a bourdon tube having a first end and a second end. A socket is joined to the first end of the bourdon tube and a closure member is joined to the second end of the bourdon tube. At least one of the bourdon tube and the c...
11/26/2002
6372364Nanostructure coatings
A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured ...
04/16/2002
6346335Copper foil composite including a release layer
A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel ...
02/12/2002
6326685Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix
A reduced CTE composite structure is made by providing a matrix material whose CTE is to be reduced, adding negative CTE bodies to the matrix material and mechanically coupling the matrix material to the negative CTE bodies as by deforming the composite s...
12/04/2001
6316128High strength clad material having excellent moldability
A three-layer clad material in which stainless steel is used as the substrate, Ni or an Ni alloy is monolithically pressure-welded to either principal plane of the substrate, and Cu is monolithically pressure-welded to the other principal plane, wherein t...
11/13/2001
6312834Clad material and method of manufacturing the material
The present invention, which is aimed at providing a method for manufacturing a clad material that can be used for the anode cases and cathode cases of button-type microbatteries and other miniature electronic devices requiring the use of comparatively th...
11/06/2001
6242108Abrasion resistant coating and method of making the same
An abrasion resistant coating is created by adding a ductile phase to a brittle matrix phase during spray coating where an Al--Cu--Fe quasicrystalline phase (brittle matrix) and an FeAl intermetallic (ductile phase) are combined. This composite coating pr...
06/05/2001
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