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| Number | Title | Issue Date |
| 8043719 | Metal member having precious metal plating A metal member is manufactured that has a plating layer of precious metal on the surface of a bare metal portion formed of a predetermined metal. First, a surface layer of the bare metal portion is removed. Then, a plating of precious metal is applied to the portion... | 10/25/2011 |
| 7736752 | Pt/Pd alloy wires, strips or reshaped parts hardened by oxide dispersion, and process of producing the same A wire, strip or reshaped part is produced from an alloy based on platinum, palladium or a mixture of platinum and palladium and hardened by oxide dispersion. The wire, strip or reshaped part cross-section exhibits a peripheral zone in which at least one relatively ... | 06/15/2010 |
| 7666523 | Electrode surface coating and method for manufacturing the same An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; and one or more surface coatings comprising one or more of the following metals titanium, niobium, tantalum, ruthenium, rhodium, iridium, palla... | 02/23/2010 |
| 7622198 | Decorative article having white coating and method for manufacture thereof The present invention provides personal ornaments having as an outermost layer a white ornamental coating film having platinum or a platinum alloy formed by dry-plating, including: an ornament base article made of a metal or ceramic, an underlayer formed on the surf... | 11/24/2009 |
| 7527877 | Platinum group bond coat modified for diffusion control A modified platinum group metal coating composition comprising a phase having a solid solution face-centered cubic (fcc) crystal structure, rich in platinum group materials. In order to be effective, the platinum group metal coating material was modified based on th... | 05/05/2009 |
| 7435484 | Ruthenium thin film-formed structure A method of depositing a ruthenium(Ru) thin film on a substrate in a reaction chamber, includes: (i) supplying a gas of a ruthenium precursor into the reaction chamber so that the gas of the ruthenium precursor is adsorbed onto the substrate, wherein the ruthenium p... | 10/14/2008 |
| 7416790 | Coating systems containing rhodium aluminide-based layers A coating process and system suitable for use on components subjected to high temperatures. The coating system includes an overlay coating of predominantly B2 phase rhodium aluminide (RhAl) intermetallic compound containing about 25 to about 90 atomic percent rhodiu... | 08/26/2008 |
| 7413814 | Multilayer getter structures and methods for making same Getter multilayer structures are disclosed, embodiments of which include at least a layer of a non-evaporable getter alloy having a low activation temperature over a layer of a different non-evaporable getter material having high specific surface area, both preferab... | 08/19/2008 |
| 7413974 | Copper-metallized integrated circuits having electroless thick copper bond pads A metal structure (100) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). The first copper layer of first thickness and first crystal... | 08/19/2008 |
| 7381477 | Rare earth-transition metal alloy articles This invention provides a rare earth-transition metal (RE-TM) alloy structure comprising a RE-TM alloy substrate and a noble metal diffusion barrier disposed thereon. The noble metal diffusion barrier may be provided on the surface of the alloy substrate by an elect... | 06/03/2008 |
| 7378159 | Protected article having a layered protective structure overlying a substrate A protected article has a substrate and a protective structure overlying a surface of the substrate. The protective structure includes a protective layer overlying the surface of the substrate and having an aluminum content greater than that of the substrate, and a ... | 05/27/2008 |
| 7368380 | Method of manufacturing semiconductor device A method of manufacturing a semiconductor device is disclosed in which a metallic deposit is stably formed on the anode side with small variation in film thickness, and plating is prevented on the cathode side without carrying out any additional processing on the ca... | 05/06/2008 |
| 7368328 | Semiconductor device having post-mold nickel/palladium/gold plated leads A semiconductor device having a leadframe comprised of a base metal (110, e.g., copper), a chip mount pad (103) and a plurality of lead segments (104). Each of the segments has a first end (104a) near the mount pad and a second end... | 05/06/2008 |
| 7361386 | Functional coatings for the reduction of oxygen permeation and stress and method of forming the same The oxidation behavior of the bond coat is improved using a HVOF nanostructured NiCrAlY coating. NiCrAlY powder is mechanically cryomilled and HVOF sprayed onto Ni-based alloy to form a nanocrystalline bond coat. Oxidation is performed on the coating to form the the... | 04/22/2008 |
| 7325432 | Method for manufacturing fuel cell metallic separator A metallic separator according to a first embodiment is formed by obtaining a blank by rolling a metallic material having conductive inclusions, and removing a surface of the blank by 2% or more of the thickness of the blank. A metallic separator according to a seco... | 02/05/2008 |
| 7323215 | Free layer design for CPP GMR enhancement By using a composite free layer of Fe25% Co/NiFe, an improved CPP GMR device has been created. The resulting structure yields a higher CPP GMR ratio than prior art devices, while maintaining free layer softness and acceptable magnetostriction. A process for manufact... | 01/29/2008 |
| 7318915 | Oxidation-reduction catalyst and its process of use This invention relates generally to a ruthenium stabilized oxidation-reduction catalyst useful for oxidizing carbon monoxide, and volatile organic compounds, and reducing nitrogen oxide species in oxidizing environments, substantially without the formation of toxic ... | 01/15/2008 |
| 7316856 | Separator for flat-type polyelectrolyte fuel cell and polyelectrolyte fuel cell employing that separator A separator having a separator member coupled body having a metal plate as a base body, and formed by integrally coupling a plurality of separator members each having through holes for feeding fuel to an electrolyte of the fuel cell, the through holes arranged so as... | 01/08/2008 |
| 7313909 | High-emissivity infrared coating applications for use in HIRSS applications A high emissivity (Hi-E) coating for use on the exhaust baffles of HIRSS systems. HIRSS systems were developed to reduce the infrared (IR) signature of helicopter engines. Increasing operating temperatures of helicopter engines have made the HIRSS systems less effec... | 01/01/2008 |
| 7311981 | Gas turbine part provided with a protective coating A gas turbine part comprises a superalloy metal substrate, a bonding underlayer formed on the substrate and comprising an intermetallic compound of aluminum, nickel, and platinum, and a ceramic outer layer anchored on the alumina film formed on the bonding underlaye... | 12/25/2007 |
| 7309909 | Leadframes for improved moisture reliability of semiconductor devices A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (402) and a plurality of lead segments (403). Covering the base metal are, consecutively, a nickel layer (3... | 12/18/2007 |
| 7288328 | Superalloy article having a gamma-prime nickel aluminide coating An article for use in hostile thermal environments, such as a component of a gas turbine engine. The article includes a nickel-base superalloy substrate that is prone to formation of a deleterious secondary reaction zone (SRZ), and an overlay coating having a predom... | 10/30/2007 |
| 7285338 | Anisotropic thin-film rare-earth permanent magnet An anisotropic thin-film rare-earth permanent magnet endowed with high magnetic characteristics by rendering a vapor-phase-grown thin film anisotropic in the layering direction. The atomic laminate units are formed by laminating a monoatomic layer of a rare earth el... | 10/23/2007 |
| 7273662 | High-temperature coatings with Pt metal modified γ-Ni+γ′-NiAl alloy compositions An alloy including a Pt-group metal, Ni and Al in relative concentration to provide a γ-Ni+γ′-Ni3Al phase constitution, and a coating including the alloy. ... | 09/25/2007 |
| 7270884 | Adhesion layer for Pt on SiO Si, Al, Al plus TiN, and IrO2 are used as adhesion layers to prevent peeling of noble metal electrodes, such as Pt, from a silicon dioxide (SiO2) substrate in capacitor structures of memory devices. ... | 09/18/2007 |
| 7268021 | Lead frame and method of manufacturing the same A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of... | 09/11/2007 |
| 7268415 | Semiconductor device having post-mold nickel/palladium/gold plated leads A semiconductor device having a leadframe comprised of a base metal (110, e.g., copper), a chip mount pad (103) and a plurality of lead segments (104). Each of the segments has a first end (104a) near the mount pad and a second end... | 09/11/2007 |
| 7264979 | Method of manufacturing light emitting device A high-quality light emitting device is provided which has a long-lasting light emitting element free from the problems of conventional ones because of a structure that allows less degradation, and a method of manufacturing the light emitting device is provided. Aft... | 09/04/2007 |
| 7264887 | MCrAlY bond coating and method of depositing said MCrAlY bond coating A method of depositing a bond coating to a surface of an article includes the steps of depositing an inner layer of the bond coating consisting of β-NiAl comprising Fe, Ga, Mo, B, Hf or Zr or γ/β-MCrAlY comprising Fe, Ga, Mo, B, Hf or Zr or γ/γ′- or γ-MCrAlY... | 09/04/2007 |
| 7264888 | Coating systems containing gamma-prime nickel aluminide coating An overlay coating for articles used in hostile thermal environments. The coating has a predominantly gamma prime-phase nickel aluminide (Ni3Al) composition suitable for use as an environmental coating and as a bond coat for a thermal barrier coating. The... | 09/04/2007 |
| 7255726 | Composite gas separation modules having high Tamman temperature intermediate layers A composite gas separation module includes a porous metal substrate; an intermediate layer that includes a powder having a Tamman temperature higher than the Tamman temperature of the porous metal substrate and wherein the intermediate layer overlies the porous meta... | 08/14/2007 |
| 7256481 | Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (302) and a plurality of lead segments (303). Covering the base metal are, consecutively, a continuous nickel ... | 08/14/2007 |
| 7250225 | Gamma prime phase-containing nickel aluminide coating An intermetallic composition suitable for use as an environmentally-protective coating on surfaces of components used in hostile thermal environments, including the turbine, combustor and augmentor sections of a gas turbine engine. The coating contains the gamma-pri... | 07/31/2007 |
| 7247393 | Gamma prime phase-containing nickel aluminide coating An intermetallic composition suitable for use as an environmentally-protective coating on surfaces of components used in hostile thermal environments, including the turbine, combustor and augmentor sections of a gas turbine engine. The coating contains the gamma-pri... | 07/24/2007 |
| 7247396 | Highly oriented perpendicular magnetic recording media A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma... | 07/24/2007 |
| 7245006 | Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium fi... | 07/17/2007 |
| 7241510 | Peelable circuit board foil In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250... | 07/10/2007 |
| 7238432 | Metal member coated with metal layers There is provided a metal member capable of realizing a corrosion resistance and wear resistance, which are equivalent to or better than those when expensive PdNi is used even if PdNi is not used, and of being produced at relatively low costs. A first layer essentia... | 07/03/2007 |
| 7232611 | Component including a zirconium alloy, a method for producing said component, and a nuclear plant including said component The present invention relates to a component (1) comprising an element (2), which contains zirconium or a zirconium alloy and which has a surface (3) on which a corrosion protective layer (4) is formed, the oxide layer (4) comprisi... | 06/19/2007 |
| 7214326 | Increased capacity leadframe and semiconductor package using the same In accordance with the present invention, there is provided a method for manufacturing a semiconductor package. The method comprises the initial step of applying first and second photoresist layers to respective ones of opposed first and second surfaces of a metal p... | 05/08/2007 |
