Pneumatic Shoe Lacing Apparatus
This invention provides a pneumatic shoe lacing apparatus for the pneumatic lacing of shoe.
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| Number | Title | Issue Date |
| 7829201 | Plain bearing A plain bearing is described having a bearing metal layer, supported by a support shell, made of an aluminum or copper alloy and having a lead-free running layer, possibly applied to the bearing metal layer over an intermediate layer, made of a zinc matrix having at... | 11/09/2010 |
| 7585572 | Ball stud A ball stud having a ball at one end of a rod-shaped stud. The ball stud comprises: a metal plating film formed on the surface of the stud; and a trivalent chromate film continuously formed over both the surface of the metal plating film formed on the stud and the s... | 09/08/2009 |
| 7344785 | Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same A copper foil 1 comprises a roughened plating layer 2, a Ni—Co alloy plating layer 3, a zinc galvanized (underlying) layer 4, a chromate treatment layer 5, and a silane coupling treatment layer 6 on a surface to be bonded ... | 03/18/2008 |
| 7341795 | Fe-Cr alloy structure with excellent corrosion resistance and excellent adhesion, and manufacturing method thereof The invention provides a Fe—Cr alloy structure containing Cr of about 6% or more by mass but about 25% or less by mass, having a corrosion-resistant paint film containing metal powder having ionization tendencies greater than iron, with a content of the metal powd... | 03/11/2008 |
| 7323254 | Layered material The invention relates to an alloy consisting of at least three components A, B, C, which form at least a first matrix and a soft phase dispersed therein, with a first surface (5) and a second surface (9) lying opposite it, the proportions of components... | 01/29/2008 |
| 7314671 | Chromium(VI)-free conversion layer and method for producing it A chromium(VI)-free, chromium(III)-containing and substantially coherent conversion layer on zinc or zinc alloys presenting, even in the absence of further components such as silicate, cerium, aluminum and borate, a corrosion protection of approx. 100 to 1000 h in t... | 01/01/2008 |
| 7314674 | Corrosion resistant coating composition, coated turbine component and method for coating same A composition comprising a particulate corrosion resistant component, and a glass-forming binder component. The particulate corrosion resistant component comprises from 0 to about 95% alumina particulates, and from about 5 to 100% corrosion resistant non-alumina par... | 01/01/2008 |
| 7300706 | High-carbon steel wire with nickel sub coating A wire for external exposure, i.e. without chemical binding with a polymer or rubber matrix. The wire has a steel core, a nickel sub-coating and a zinc or zinc alloy top coating above the nickel sub-coating. The steel core has a carbon content exceeding 0.20%. The w... | 11/27/2007 |
| RE39884 | Coated milling insert and method of making it A coated milling insert particularly useful for milling in low and medium alloyed steels with or without raw surface zones during wet or dry conditions. The insert is characterized by a WC-Co cemented carbide with a low content of cubic carbides and a highly W alloy... | 10/16/2007 |
| 7273669 | Spray-formed articles made of pseudo-alloy and method for making the same Method and arrangement for spray forming an article. The method includes spraying a plurality of metal streams upon a low-heat resistant model and thereby forming a spray formed article. Each of the plurality of metal streams is composed of moltenized droplets, and ... | 09/25/2007 |
| 7220493 | Lead-free solder, and a lead-free joint A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liq... | 05/22/2007 |
| 7175882 | Process for coating metal surfaces A protective coating is formed on a metallic surface by contacting the surface with an aqueous solution of fluorometallate followed by an aqueous solution containing vanadate ions. The process does not require the use of any organic substances, but provides a corros... | 02/13/2007 |
| 7172818 | Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having de... | 02/06/2007 |
| 7166364 | Polyester conversion coated metal or its alloys I provide an aqueous coating composition to provide an outer protective coating for a metal selected from the group consisting of an aluminum, aluminum alloy, iron, iron alloy, zinc, zinc alloy, zinc coated iron, zinc coated iron alloy, and these metals and magnesiu... | 01/23/2007 |
| 7166941 | Electroplated stator bar end and fitting The interior of a stator bar clip that is joined to the end of a stator bar is electroplated so that a metallic barrier coating overlies the braze joint between the stator bar and the clip to define a seal at and around the joint that is substantially impermeable to... | 01/23/2007 |
| 7160630 | Corrosion resistant article and method of production thereof The disclosure relates to a corrosion resistant article comprising a metal body and a protective coating applied on at least one surface of said metal body, said protective coating comprising: (a) a zinc layer comprising metallic zinc; (b) a silicate layer comprisin... | 01/09/2007 |
| 7150391 | Material for welding and welded article A material for welding 5 having a region 11 in which welding such as laser welding or arc welding is performed, the region including indentations 5a-1 which are produced by carrying out a first working step comprising embossing, V-... | 12/19/2006 |
| 7108923 | Copper foil for printed circuit board with taking environmental conservation into consideration A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of co... | 09/19/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7018721 | Structure for interconnecting conductors and connecting method A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, ... | 03/28/2006 |
| 7018486 | Corrosion resistant trivalent chromium phosphated chemical conversion coatings An acidic aqueous solution containing a water soluble trivalent chromium compound is provided with a additive for improving corrosion resistance and reducing precipitation of trivalent chromium over time. A suitable additive is nitrilotris (methylene) triphosphonic ... | 03/28/2006 |
| 6994919 | Brazing product and method of manufacturing a brazing product The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of... | 02/07/2006 |
| 6989199 | Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-... | 01/24/2006 |
| 6984456 | Flexible printed wiring board for chip-on flexibles There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wirin... | 01/10/2006 |
| 6969557 | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surf... | 11/29/2005 |
| 6949300 | Product and method of brazing using kinetic sprayed coatings The present invention is directed to a process for preparing aluminum and aluminum alloy surfaces in heat exchangers for brazing by depositing thereon a kinetic sprayed brazing composition. The process simultaneously deposits monolith or composite coatings that can ... | 09/27/2005 |
| 6946201 | Chromium (VI)-free conversion layer and method for producing it A chromium(VI)-free, chromium(III)-containing and substantially coherent conversion layer on zinc or zinc alloys presenting, even in the absence of further components such as silicate, cerium, aluminum and borate, a corrosion protection of approx. 100 to 1000 h in t... | 09/20/2005 |
| 6938552 | Corrosion-resistant structure incorporating zinc or zinc-alloy plated lead or lead-alloy wires and method of making same Structure incorporating lead is fabricated from specially prepared components such that mobility of the lead is impeded when the structure is exposed to an unprotected environment such as weathering outdoors or saltwater. In a preferred embodiment, a bullet or bulle... | 09/06/2005 |
| 6936354 | Systems for conversion of water into hydrogen and sorption of hydrogen in electronic devices The invention teaches a system suitable for use in a water-sensitive electronic device which comprises two superimposed layers, the first material of which is formed of a material capable of sorbing hydrogen, the second material formed of a material capable of conve... | 08/30/2005 |
| 6928731 | Ultrasonic bonding process for making a microfluid device A piezoelectric ceramic ink-jet print head is made by an inventive ultrasonic bonding process. Specifically, there are several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improve... | 08/16/2005 |
| 6927343 | Contactor for testing miniaturized devices and components A contactor has a film substrate of an insulating material and plural wiring patterns on the substrate. A first end of each wiring pattern extends out from a first edge of the substrate as a first contact terminal and a second end of each wiring pattern extends out ... | 08/09/2005 |
| 6913184 | Alloy composition and method for low temperature fluxless brazing A family of low temperature brazing alloys wherein the alloy is utilized in the form of a filler metal or shim and consists of electroplated nickel on zinc shimstock, wherein the zinc shimstock includes zinc, aluminum and silicon, with or without a small amount of l... | 07/05/2005 |
| 6905782 | Tarnish deterring tin coating The present invention is directed to a coated substrate, comprising: an antitarnish layer deposited on a substrate in an amount effective to prevent tarnishing of said coated substrate; and an outer layer deposited onto said antitarnish layer, said outer layer compr... | 06/14/2005 |
| 6893738 | Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited cop... | 05/17/2005 |
| 6884511 | Method for brazing ceramic-containing bodies, and articles made thereby Ceramic-containing bodies can be bonded to other ceramic-containing bodies, or to metals or metal-containing bodies, by way of an aluminum-silicon brazing alloy. Such alloys feature high thermal conductivity and a melting range intermediate to Cu—Sil and Au—Si. ... | 04/26/2005 |
| 6869690 | Zinc-diffused alloy coating for corrosion/heat protection The present invention relates to a zinc-diffused nickel alloy coating for corrosion and heat protection and to a method for forming such a coating. The coating method broadly comprises the steps of forming a plain nickel or nickel alloy coating layer on a substrate,... | 03/22/2005 |
| 6866765 | Electrolytic copper-plated R-T-B magnet and plating method thereof An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction... | 03/15/2005 |
| 6863748 | Process and alloy for decorative galvanizing of steel A process and an alloy for galvanizing non-reactive steel and mixed or moderately reactive steel for providing a decorative spangle to the galvanized coating. The alloy contains 0.1 to less than 0.8 wt % tin, 0.05 to 0.2 wt % bismuth, 0.001 to 0.008 wt % aluminum, a... | 03/08/2005 |
| 6861159 | Corrosion-resistant coated copper and method for making the same A corrosion-resistant coated base metal coated with a corrosion resistant alloy. The corrosion resistant alloy includes tin and zinc. The corrosion resistant coated base metal includes a heat created intermetallic layer primarily including copper and zinc. ... | 03/01/2005 |
| 6858321 | Corrosion resistant member A corrosion resistant member has a chemical conversion treatment film with a two-layer structure formed atop a metal substrate plated with zinc or zinc alloy plating. The two-layer structure comprises a lower layer containing Cr formed on the surface of the plating ... | 02/22/2005 |