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| Number | Title | Issue Date |
| 8153272 | Composite articles made by joining brass part and silicon carbide ceramic part A process for joining a brass part and a silicon carbide ceramic part comprising: providing a brass part, a SiC ceramic part, a Al foil and a Ni foil; placing the SiC ceramic part, the Al foil, the Ni foil, and the brass part into a mold, the Al foil and the Ni foil... | 04/10/2012 |
| 8153271 | Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof The invention relates to a coated article which has (i) at least one electrically non-conducting base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer, wherein the copper or... | 04/10/2012 |
| 7989086 | High temperature seal for joining ceramic components such as cells in a ceramic oxygen generator A multi-layer seal arrangement includes a dissolution barrier between a braze alloy and a ceramic component. The inventive seal is useful for joining a ceramic component to another ceramic component or a metal component, for example. In one example, the braze compri... | 08/02/2011 |
| 7939179 | Laminated steel application for major appliances doors and cases A dent resistant laminated steel application is provided for a laminated appliance wall, including: an exterior cover having a first outer skin layer and at least a second substrate layer laminated thereto, wherein the first outer skin layer is stainless steel and o... | 05/10/2011 |
| 7758970 | Different materials bonded member and production method thereof A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given... | 07/20/2010 |
| 7709099 | Bonded body, wafer support member using the same, and wafer treatment method A bonded body consisting of a ceramic member and a metal composite member of which bonding layer is less likely to be eroded by plasma is provided. The bonded body comprises the ceramic member that has two opposing main surfaces with a first metal layer provided on ... | 05/04/2010 |
| 7691488 | Diffusion barriers in modified air brazes A method for joining two ceramic parts, or a ceramic part and a metal part, and the joint formed thereby. The method provides two or more parts, a braze consisting of a mixture of copper oxide and silver, a diffusion barrier, and then heats the braze for a time and ... | 04/06/2010 |
| 7416789 | Refractory metal substrate with improved thermal conductivity A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having a first major surface and a second ... | 08/26/2008 |
| 7413815 | Thin laminate as embedded capacitance material in printed circuit boards The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a ... | 08/19/2008 |
| 7393596 | Aluminum/ceramic bonding substrate and method for producing same When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grai... | 07/01/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7360581 | Structured thermal transfer article Structured thermal transfer article comprising a plurality of metal bodies and a plurality of interstitial elements disposed between and connecting the plurality of metal bodies to one another. The metal bodies comprise an inner portion comprising a first metal and ... | 04/22/2008 |
| 7361302 | Oxidation and fatigue resistant metallic coating The present invention relates to a metallic coating to be deposited on gas turbine engine components. The metallic coating comprises up to 18 wt % cobalt, 3.0 to 18 wt % chromium, 5.0 to 15 wt % aluminum, 0.1 to 1.0 wt % yttrium, up to 0.6 wt % hafnium, up to 0.3 wt... | 04/22/2008 |
| 7354862 | Thin passivation layer on 3D devices Embodiments of the invention include a device with stacked substrates. Conducting interconnecting structures of one substrate are bonded to conducting interconnecting structures of another substrate. A passivating layer may be on the conducting interconnecting struc... | 04/08/2008 |
| 7353979 | Method of fabricating substrate placing stage A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes the step of providing a plate-shaped ceramic base formed of a composite... | 04/08/2008 |
| 7348493 | Metal-ceramic circuit board A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stres... | 03/25/2008 |
| 7342716 | Multiple cavity low-emissivity coatings Multiple cavity low-emissivity coatings. The coating includes three infrared-reflection film regions, which may each include silver. ... | 03/11/2008 |
| 7341427 | Gas turbine nozzle segment and process therefor A gas turbine engine nozzle segment and process for producing such a nozzle segment to exhibit improved durability and aerodynamic performance. The process produces a nozzle segment having at least one vane between and interconnecting a pair of platforms. The nozzle... | 03/11/2008 |
| 7338717 | Tool and a method for creating the tool A method 10 and a laminated tool 31 which is created by the method 10 and which is formed by the selective coupling or attachment of sectional members, such as members 14, 16. The formed tool 31 includes a finished surface 36 | 03/04/2008 |
| 7339728 | Low-emissivity coatings having high visible transmission and low solar heat gain coefficient Low-emissivity coatings that are highly reflective to infrared radiation. The coating includes three infrared-reflection film regions, which may each include silver. ... | 03/04/2008 |
| 7334326 | Method for making an integrated circuit substrate having embedded passive components A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f... | 02/26/2008 |
| 7334375 | Evacuated panel for thermal insulation of a body having non-planar surfaces An evacuated panel is provided for thermal insulation of a body (3, 4) having non-planar surfaces, the panel having two main faces and comprising a flexible envelope (1), made of one or more barrier sheets, and a filling material formed of at least two... | 02/26/2008 |
| 7331499 | Manufacturing method for a ceramic to metal seal A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature o... | 02/19/2008 |
| 7332813 | Semiconductor device A semiconductor device with a metallic region can have a resistance to stress migration and increased reliability. A lower layer wiring made from a barrier metal film (102) and a copper containing metallic film (103) can be formed within an insulating ... | 02/19/2008 |
| 7329384 | Porous metal based composite material A porous composite material includes a metal material for forming a matrix, and at least two kinds of fine particle materials having different wettabilities with respect to the metal material. The porous composite material is provided by melting and impregnating the... | 02/12/2008 |
| 7313991 | Cutting insert and use thereof A cutting insert made of cemented carbide and the use thereof for recessing or copy-turning, preferably at a high rotating speed. The cutting insert has at least one recess for insertion therein of a cutting body of a material other than cemented carbide, such as a ... | 01/01/2008 |
| 7312103 | Method for making an integrated circuit substrate having laser-embedded conductive patterns A method for making an integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. A dielectric material is injection-molded or laminated over a metal layer that is punch... | 12/25/2007 |
| 7308760 | Method of making a valve lifter A valve lifter and a method of manufacture thereof is provided in which sliding properties of a cam on a cam-contacting sliding surface in an upper surface of a valve lifter are improved by forming the cam-contacting sliding surface as a concave surface to permit re... | 12/18/2007 |
| 7306860 | Protective coating for oxide ceramic based composites A layered structure includes a substrate comprising a layer of an oxide/oxide ceramic based composite material, a first oxide layer disposed directly on the substrate and formed from a material that has no greater than about 10% porosity and is substantially imperme... | 12/11/2007 |
| 7300673 | Deposition products, composite materials and processes for the production thereof Methods for the production of deposition products including an oxidized metal species under both acidic and alkaline conditions, methods for the production of composite materials including a substrate and the deposition product, and products in the nature of deposit... | 11/27/2007 |
| 7297412 | Fabrication of stacked microelectronic devices Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear... | 11/20/2007 |
| 7291401 | Non-hexavalent-chromium type corrosion resistant coating film structure having a resin layer and a metal layer that is superior in terms of adhesion to the resin layer A steel material that has on its surface a non-hexavalent-chromium type corrosion-resistant coating film formed by a composite of a metal layer and a resin layer. The steel material having or not having a copper layer is formed with 1) a Zn and/or Zn-based alloy lay... | 11/06/2007 |
| 7291403 | Thermal barrier coating system A TBC system suitable for protecting the surface of a substrate subjected to a hostile thermal environment. The TBC system comprises a bond coat on the substrate surface, an alumina scale on the bond coat, and a multilayer TBC comprising a thermal-sprayed first cera... | 11/06/2007 |
| 7279230 | Hybrid composite materials A fiber-reinforced metal-ceramic composite material having a hot ceramic side and a cool metal side and a graded ceramic-metal zone therebetween, wherein the ceramic content of said composite ranges from 100% at said hot ceramic side to 0% at said cool metal side an... | 10/09/2007 |
| 7276304 | Fuel cell system including a unit for electrical isolation of a fuel cell stack from a manifold assembly and method therefor A fuel cell system with improved electrical isolation having a fuel cell stack with a positive potential end and a negative potential, a manifold for use in coupling gases to and from a face of the fuel cell stack, an electrical isolating assembly for electrically i... | 10/02/2007 |
| 7276292 | Insulating substrate boards for semiconductor and power modules An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board (2) and a metal alloy layer (3) consisting of aluminum formed on one surface portion of the ceramic substrate board (2), wherein the V... | 10/02/2007 |
| 7268021 | Lead frame and method of manufacturing the same A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of... | 09/11/2007 |
| 7261942 | Photocatalytically-active, self-cleaning aqueous coating compositions and methods Method for producing novel photochemically-active metal oxide-containing aqueous compositions such as TiO2 compositions coated or sprayed and dried under ambient conditions to form novel photochemically-active, colorless coatings having strong wetability ... | 08/28/2007 |
| 7261776 | Deposition of buffer layers on textured metal surfaces A method of making a multilayer article includes depositing a first material on the surface of a metal substrate to form a seed layer of the first material, the first material being deposited under reducing conditions relative to the metal substrate, and then epitax... | 08/28/2007 |
| 7261951 | Copper based sintered contact material and double-layered sintered contact member With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and achieving improved seizure resistance through restraint of frictional he... | 08/28/2007 |
