Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 4030948 | Polyimide containing silicones as protective coating on semiconductor device A copolymer which is the reaction product of a tetracarboxylic acid dianhydride, and organic diamine and a di(aminoalkyl) poly siloxane where the di(aminoalkyl) poly siloxane constitutes 18 - 45 mole percent of the total amine requirement of the polymer a... | 06/21/1977 |
| 4026876 | Soluble polyamide-imides derived from phenylindane diamines Polyamide-imides with phenylindane diamines incorporated into the polymer backbone have been found to be soluble in high concentration in polar organic solvents.... | 05/31/1977 |
| 4024101 | Method for making poly-etherimides and products produced thereby A method is provided for making polyetherimides involving the reaction of aromatic bis(ether anhydride)s and organic diamines in the presence of a phenolic solvent. The resulting polyetherimide-phenolic solvent mixture can be employed as a wire coating en... | 05/17/1977 |
| 4022649 | Method for producing metal laminates containing an interlayer of thermally stable heterocyclic polymer A metal laminate having high thermal stability is produced by forming a cured film layer of a thermally stable heterocyclic polymer such as polyamide imide having only a small volatile content on at least one surface of one or both of metal plates or foil... | 05/10/1977 |
| 4020215 | Extrusion of polyolefin onto paper at decreased temperatures By coating a paper substrate first with a polyalkyleneimine and then with a polymer containing groups which react chemically with the imino groups of the polyalkyleneimine, a polyolefin can be extruded onto the substrate with good adhesion at temperatures... | 04/26/1977 |
| 4019972 | Photopolymerizable copying compositions containing biuret-based polyfunctional monomers This invention relates to a photopolymerizable copying composition comprising at least one binder, at least one photoinitiator, and at least one polymerizable, acid amide group-containing acrylic acid derivative or alkyl acrylic acid derivative which is n... | 04/26/1977 |
| 4008348 | Particulate and solar radiation stable coating for spacecraft A laminate thermal control coating for spacecraft comprising a layer of solar-radiation stable film, a layer of particulate-radiation stable film applied to the upper surface of the solar-radiation stable film, and a layer of reflecting material applied t... | 02/15/1977 |
| 4004959 | Unsaturated polyester with polyimide-ammonia prepolymers as thermosetting laminate Thermosetting compositions are provided which are particularly suitable for use in the form of solutions, in making laminates. The compositions comprise (a) a prepolymer possessing imide groups derived from a polyimide and ammonia and (b) an unsaturated p... | 01/25/1977 |
| 3996203 | Solution process for the preparation of polyimides from diamines and anhydrides Novel polyimide prepolymers with improved mold flow characteristics and enhanced physical properties when thermoset, are provided by heating a difunctional amine and an anhydride of an unsaturated dicarboxylic acid in a solvent at a temperature not in exc... | 12/07/1976 |
| 3993825 | Electrophotographic toner transfer and fusing apparatus and method Apparatus and method for transferring non-fused xerographic toner images from a first support material, such as a photoconductive insulating surface, to a second support material, such as paper, and fusing the toner images to the second support material. ... | 11/23/1976 |
| 3993850 | Recording material A recording material is described, which comprises a support of paper or of synthetic polymer and an electroconductive layer on at least one side of the support. The surface resistance of this electroconductive layer is not more than 1011 ohms ... | 11/23/1976 |
| 3985928 | Heat-resistant laminating resin composition and method for using same A heat-resistant resin composition suitable for use in multilayer super high density printed circuit boards, comprising a polyaminobismaleimide, a polyepoxy compound, and an aromatic vinyl copolymer containing as structural unit maleic anhydride and/or an... | 10/12/1976 |
| 3984375 | Aromatic amide-imide polymers 1. A polyamide-imide resin consisting essentially of the repeating amide-imide polymeric unit ##SPC1## Wherein R is a member selected from the group consisting of ##SPC2## And copolymers thereof, in which X is an integer of from 1 to about 500.... | 10/05/1976 |
| 3969566 | Articles of manufacturing prepared from polymers of hydrazine or dihydrazides and tricarboxylic acid anhydrides Novel polymers formed from the reaction of tricarboxylic anhydrides and hydrazines or hydrazides which may be cross-linkable by further reaction with a hydrazine or hydrazide are disclosed.... | 07/13/1976 |
| 3968083 | Novel polyetherimides This invention is concerned with a new class of polyetherimides. More particularly, the invention is concerned with polyetherimides derived from the reaction of an organic diamine and a class of dianhydrides selected from the class consisting of a bisphen... | 07/06/1976 |
| 3967044 | Copper coatings on shaped plastic supports This invention relates to an improvement in the process for the production of a copper coating on a shaped plastic support in which copper is vapor-deposited in a high vacuum on the surface of the plastic support, the improvement comprising coating said s... | 06/29/1976 |
| 3964954 | Method of bonding utilizing imide ester derivatives of ethene maleic anhydride copolymers Imide - ester derivatives of ethene - maleic anhydride copolymers are prepared in a two step reaction. These derivatives are useful as adhesives and protective coatings.... | 06/22/1976 |
| 3963682 | Polymeric fungicidal compositions containing the trichloromethyl thioimide moiety A polymer having fungicidal properties is prepared from a styrene maleic copolymer resin by converting the maleic portion of the resin to an imide and further reacting the imide with perchloromethyl mercaptan.... | 06/15/1976 |
| 3958317 | Copper surface treatment for epoxy bonding A treated copper surface for bonding, using adhesive such as epoxy glass, in applications such as multilayer circuit boards. The copper surface is covered with a thin layer of chromium having a roughened (etched) outer surface. The chromium layer preclude... | 05/25/1976 |
| 3959233 | Process for preparing polyamide-imide from trimellitic acid, diamine and diisocyanate and polyamide imide shaped articles Polyamide-imides are prepared by reacting trimellitic acid with an aromatic or an aliphatic diamine in the molar ratio of about 1:0.55 to 1:0.95 and then reacting this product with at least 0.45 to about 0.75 moles to about 0.05 to about 0.35 moles of an ... | 05/25/1976 |
| 3957726 | S-triazine-imide copolymers Polyimides having a recurring unit ##SPC1## Wherein R is an organic blocking group; A is NH, O or S; Z is the direct bond, O, S, SO2, ##EQU1## or CH2 ; n is 0 or 1; and R1 is a divalent organic radica are prepare... | 05/18/1976 |
| 3953649 | Self-bonding magnet wire and process of manufacturing same A self-bonding magnet wire comprising a conductor with a coating thereon, said coating comprising 65 to 95 parts by weight of a copolyamide containing 10 to 50 weight percent ω-laurolactam, 35 to 5 parts by weight of a copolyamide containing 70 to 90 wei... | 04/27/1976 |
| 3953658 | Copper coatings on shaped plastic supports This invention relates to an improvement in the process for the production of a copper coating on a shaped plastic support in which copper is vapor-deposited in a high vacuum on the surface of the plastic support, the improvement comprising coating said s... | 04/27/1976 |
| 3944517 | Novel polyetherimides prepared from tolane dianhydride or dichloroethylene diphenylene dianhydride This invention is concerned with polyetherimides derived from the reaction of an organic diamine and a dianhydride selected from the class consisting of a tolane dianhydride and a dichloroethylene diphenylene dianhydride.... | 03/16/1976 |
| 3941749 | Linear oxadiazole-imide copolymers Polymers containing both oxadiazole and imide recurring units are made from soluble polymeric precursors that contain hydrazide and/or amic acid recurring units. Dehydration of the hydrazide produces the oxadiazole unit and dehydration of the amic acid pr... | 03/02/1976 |
| 3941911 | Thermally resistant magnetic tape An improved magnetic tape having the property of retaining magnetic data even when spooled and subjected to high temperature environments. This thermal resistance is suitably achieved by providing a backing coating which contacts the magnetic-particle-bea... | 03/02/1976 |
| 3939029 | Method of bonding utilizing a heat activated polyamide adhesive High strength structural metal-to-metal bonds can be achieved in 10 to 15 seconds by placing a resinous polyamide capable of imidizing between the metal surfaces to be bonded and heating the composite to a temperature sufficiently high (ࣙ 400°F) to ind... | 02/17/1976 |
| 3936404 | Aqueous baking varnishes from carboxylic polyester and carboxylic polyimide, and coated article Aqueous baking varnishes having a low viscosity and a high concentration suitable for coating conductors which comprise A. a carboxyl group containing polyester resin having an acid number of about 10 to 150 comprising the reaction product of 1. an organic car... | 02/03/1976 |
| 3933749 | Polythioetherimides and method of preparation Polythioetherimides are provided and a method for making such materials. Aromatic bis(thioetheranhydride)s are reacted with organic diamine in the presence of organic solvent, or in the melt. The polythioetherimides are injection moldable thermoplastics w... | 01/20/1976 |
| 3932689 | Flexible adhesive composition and method for utilizing same and article formed therefrom This invention provides an adhesive composition for use in flexible printed circuits, comprising a phenol-formaldehyde resin, a polyepoxy compound, an acrylonitrile-butadiene copolymer and/or a polyvinylacetal resin, and a styrenic copolymer containing as... | 01/13/1976 |
