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Felix Hoffmann, a German chemist, was searching for something to relieve his father's arthritis. In doing so, he "rediscovered" acetylsalicylic acid and in 1900, patented a stable process for developing it. Hence, we have aspirin.
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| Number | Title | Issue Date |
| 8092906 | Adhesive sheet for steel plate The invention provides an adhesive sheet for steel plate that can abate the emission of organic volatile components, while providing good reinforcing effect and vibration suppression effect. In an adhesive sheet for steel plate is provided that includes a restrictin... | 01/10/2012 |
| 7887916 | Process for producing sandwich structure and adhesive film used therefor An adhesive film comprising a cycloalkanediol modified copolymerized polyester resin film and a thermosetting vinyl ester resin composition layer which is hardened at room temperature on said polyester resin film. ... | 02/15/2011 |
| 7862889 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm.... | 01/04/2011 |
| 7722949 | Adhesive composition and adhesive film therefrom An adhesive composition comprising: 100 parts by weight of (A) a phenoxy resin having, per molecule, at least one alkoxy silane residue represented by the following formula (I) wherein R1 may be the same with or ... | 05/25/2010 |
| 7572503 | Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hyd... | 08/11/2009 |
| 7521116 | Pressure sensitive adhesive tapes from cationic cure adhesives Pressure sensitive adhesive tapes produced by a process where cationic cure is conducted against a paper film substrate and an optional second film substrate, both having low moisture content. The low moisture content is maintained during cationic cure by putting th... | 04/21/2009 |
| 7405246 | Cure system, adhesive system, electronic device A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive syste... | 07/29/2008 |
| 7368170 | Viscous chemical anchoring adhesive A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000 centipoise. The chemical anchoring adhesive can be in the form of a slug or... | 05/06/2008 |
| 7348057 | Acrylic adhesive sheet An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30° C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing... | 03/25/2008 |
| 7320830 | Flame-retardant heat-resistant resin composition and adhesive film comprising the same The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based compound, and a cured film, obtained from the non-flammable heat-resistant... | 01/22/2008 |
| 7304362 | Molded integrated circuit package with exposed active area An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may co... | 12/04/2007 |
| 7294048 | Abrasive article An abrasive article includes a substrate having opposed first and second surfaces, a make coat on at least a portion of the first surface, abrasive mineral particles on at least a portion of the make coat to provide an abrasive surface and a size coat arranged over ... | 11/13/2007 |
| 7267870 | Pressure-sensitive adhesive sheet for steel plates A pressure-sensitive adhesive sheet for steel plates, which comprises a backing and a resin layer, wherein the backing comprises a resin-coated glass cloth obtainable by coating a glass cloth with a resin emulsion (A) followed by coating with a resin emulsion (B) wh... | 09/11/2007 |
| 7258918 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: wherein R represents a divalent aromatic hydrocarbon group or a d... | 08/21/2007 |
| 7244495 | Dicing/die bonding adhesion tape A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2–2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition... | 07/17/2007 |
| 7232595 | Device comprising low outgassing photo or electron beam cured rubbery polymer material Disclosed are photo or electron beam curable polymerizable compositions, and preparation thereof and devices containing such cured material. The composition contains completely or substantially completely hydrogenated hydrocarbon-based material completely free or su... | 06/19/2007 |
| 7220787 | Photoreactive hot-melt adhesive composition It is an object to provide a photoreactive hot-melt adhesive composition which exhibits high adhesive strength immediately after combination of adherends and excellent bond strength after completion of curing and provides a highly durable bonded laminate. A p... | 05/22/2007 |
| 7220490 | Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-ret... | 05/22/2007 |
| 7208062 | Method of producing multilayer printed wiring board Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in which layer A is a layer of a thermosetting res... | 04/24/2007 |
| 7204574 | Polyimide thickfilm flow feature photoresist and method of applying same A polyimide photoresist for thick film flow features adheres to a polyimide nozzle plate or other materials, without the use of an adhesive material between the two surfaces. Further, the photoresist can utilize an acrylate UV initiator, which can reduce the potenti... | 04/17/2007 |
| 7198989 | Method of producing a COF flexible printed wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF fl... | 04/03/2007 |
| 7161232 | Apparatus and method for miniature semiconductor packages A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent th... | 01/09/2007 |
| 7135224 | Adhesive tape An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and ... | 11/14/2006 |
| 7115989 | Adhesive sheet for producing a semiconductor device An adhesive sheet for producing a semiconductor device, which includes a base layer and an adhesive layer and is used in the process for producing the semiconductor device including the step of sealing a semiconductor element connected to an electric conductor with ... | 10/03/2006 |
| 7101596 | Liquid crystal sealant, liquid crystal display device using the same and method for producing the device A liquid crystal sealant comprising an epoxy resin represented by the following formula (1): [Formula 1] (in the formula, n denotes an average polymerization degree and is a positive number of 0–5) as a ... | 09/05/2006 |
| 7090895 | Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device An epoxy resin composition is provided, which includes (A) an epoxy resin with at least 2 epoxy groups within each molecule, (B) a curing agent, and (C) a foaming agent. This composition displays excellent flame retardancy and reliability and is suitable for use as ... | 08/15/2006 |
| 7063413 | Fluid ejection cartridge utilizing a two-part epoxy adhesive A fluid ejection cartridge, including a substrate carrier having a substrate receiving surface, and a substrate having at least one fluid ejector actuator disposed on the substrate. In addition the fluid ejection cartridge includes a two-part adhesive disposed betwe... | 06/20/2006 |
| 7053133 | Ultraviolet activatable adhesive film An ultraviolet activatable adhesive film comprising an epoxy resin, an ultraviolet activatable cationic polymerization catalyst and cationic polymerization inhibitor and water in an amount effective to suppress the cationic polymerization of the film and prolong the... | 05/30/2006 |
| 7008693 | Highly heat-resistant label Highly heat-resistant labels usable with the adherends which can be exposed to high temperatures are provided and include the following: (1) a highly heat-resistant label comprising a support base and a hot-melt adhesive layer composed of a thermoplastic resin showi... | 03/07/2006 |
| 7005394 | Tackified thermoplastic-epoxy pressure sensitive adhesives A pressure sensitive adhesive composition comprised of: a) 75 to 99.9 weight percent of a tackified thermoplastic polymer component comprising 1) 1–99 weight percent of a thermoplastic polymer substantially without epoxy-binding or ester functions, and 2) 1–99 w... | 02/28/2006 |
| 6986935 | Fusible interlining A fusible interlining includes a textile interlining web coated with a plurality of double-layered adhesive dots on a first side of the textile interlining web. Each of the plurality of double-layered adhesive dots includes a bottom dot facing the interlining web an... | 01/17/2006 |
| 6977024 | Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies A semiconductor device, which is obtained by sticking an adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a... | 12/20/2005 |
| 6941719 | Structural reinforcement A structural reinforcement for a hollow member comprising a rigid reinforcing member having a shape that substantially conforms to the cross section of the hollow member to be reinforced with an expandable adhesive material over at least a portion of the surface of ... | 09/13/2005 |
| 6929856 | Dicing tape Dicing tape comprises a tackifiable adhesive layer which is composed mainly of a polyimide and has a peel strength of 0.02 N/mm (20 gf/cm) or greater as the adhesive strength at near room temperature (20-50° C.) and a cured peel strength of 0.3 N/mm (300 gf/cm) or ... | 08/16/2005 |
| 6921454 | Elastomer toughened radiation curable adhesives A radiation curable adhesive composition which includes: a) an α,β-olefinically unsaturated ether monomer component consisting of one or more compounds having the formula: R[O—CH═CHR1]n (I) where R is... | 07/26/2005 |
| 6911720 | Semiconductor device adhesive sheet with conductor bodies buried therein A semiconductor device, which is obtained by sticking an adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a... | 06/28/2005 |
| 6903144 | Non-aqueous solvent-free process for making UV curable adhesive and sealants from expodized monohydroxylated diene polymers This invention is a process for making UV curable adhesives, sealants, coatings, ink, flexible printing plates, laminating adhesives, fibers, gaskets, and related compositions, films, and thin parts, wherein an epoxidized monohydroxylated polydiene polymer comprised... | 06/07/2005 |
| 6881293 | Process for producing a multi-layer printer wiring board The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecu... | 04/19/2005 |
| 6878435 | High adhesion triple layered anisotropic conductive adhesive film Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention compris... | 04/12/2005 |
| 6875500 | Flexible flooring system A flooring system for floors exhibiting surface movement, and/or for cushioning hard floors, which includes an epoxy or polyurethane primer, a two-component ambient temperature cured polyurethane membrane substrate base atop the primer of a urethane grade castor oil... | 04/05/2005 |
